2. Core Features of Rogers TMM10 PCB

1. Dielectric Constant (Dk): 9.20 +/- 0.230
2. Dissipation Factor: 0.0022 at 10 GHz
3. Thermal Coefficient of Dk: -38 ppm/°K
4. Coefficient of Thermal Expansion (CTE): 21 ppm/K (X), 21 ppm/K (Y), 20 ppm/K (Z), perfectly matched to copper
5. Decomposition Temperature (Td): 425 °C (TGA)
6. Thermal Conductivity: 0.76 W/mK
7. Substrate Thickness Range: 0.0015 to 0.500 inches +/- 0.0015”

3. Key Advantages of TMM10 High Frequency PCB

1. Superior Mechanical Performance: Resists creep and cold flow, ensuring long-term structural integrity even in harsh operating environments
2. Chemical Resistance: Tolerant to process chemicals, minimizing damage during PCB fabrication and assembly
3. Simplified Fabrication: Eliminates the need for sodium napthanate treatment prior to electroless plating, reducing production steps and costs
4. Reliable Wire-Bonding: Based on thermoset resin, the substrate does not soften when heated, preventing pad lifting or deformation during wire bonding

4. Detailed PCB Construction Parameters

Construction Item	Specification
Base material	TMM10
Layer count	Double sided
Board dimensions	76mm x 118mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.35mm
Blind vias	No
Finished board thickness	0.5mm
Finished Cu weight (outer layers)	1 oz (1.4 mils)
Via plating thickness	20 μm
Surface finish	ENEPIG
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Pre-shipment Electrical Test	100% Electrical test used

5. PCB Stackup Configuration

2-layer rigid PCB, with the following layer structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. Rogers TMM10 Core - 0.381 mm (15mil)
3. Copper_layer_2 - 35 μm

6. PCB Technical Statistics

1. Components: 34 | Total Pads: 56 | Thru Hole Pads: 32
2. Top SMT Pads: 24 | Bottom SMT Pads: 0 | Vias: 24 | Nets: 2

7. Artwork Format Supplied

Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with most manufacturing equipment.

8. Quality Assurance Standard

Complies with IPC-Class-2 standards, guaranteeing consistent quality, reliability, and performance for commercial and industrial applications.

9. Global Availability

Available worldwide, with reliable supply chains to support global customers’ production needs and timely delivery.

10. Typical Application Scenarios

1. Chip testers and semiconductor testing equipment
2. Dielectric polarizers for microwave systems
3. Satellite communication systems and related components
4. GPS antennas, patch antennas, and other wireless communication devices

11. Rogers TMM Series CCL Introduction

Rogers TMM series thermoset microwave CCL (Copper Clad Laminate) is a high-performance composite material, composed of ceramic, hydrocarbon, and thermoset polymer. It is specifically designed for high-reliability stripline and microstrip applications, offering a perfect balance of electrical and mechanical properties. Unlike traditional PTFE/ceramic laminates, TMM CCL combines their key advantages without requiring specialized production techniques, making it more cost-effective and easier to fabricate.

11.1 Key Properties of TMM Series CCL

1. Exceptionally low thermal coefficient of dielectric constant (typically less than 30 ppm/°C), ensuring stable electrical performance across temperature fluctuations
2. Isotropic CTE closely matched to copper, enhancing plated through-hole reliability and minimizing etch shrinkage for high-precision PCB designs
3. Thermal conductivity approximately twice that of traditional PTFE/ceramic laminates, facilitating efficient heat dissipation in high-power applications
4. Thermoset resin base, maintaining rigidity when heated to enable reliable wire bonding without pad lifting or substrate deformation
5. Resistant to etchants and solvents used in PCB production, compatible with all common printed circuit board processes

11.2 Available Specifications of TMM Series CCL

1. Wide range of dielectric constants to suit diverse high-frequency application needs
2. Copper foil weights: 1/2 oz/ft² to 2 oz/ft²
3. Can be bonded directly to brass or aluminum plates for additional application flexibility
4. Substrate thickness range: 0.015” to 0.500”, catering to various design requirements

11.3 Features & Benefits of TMM Series CCL

1. Wide Range of Dielectric Constants: Ideal for single-material systems across a broad spectrum of high-frequency applications, reducing design complexity.
2. Exceptional Mechanical Properties: Resists creep and cold flow, ensuring long-term structural stability in harsh operating conditions.
3. Copper-Matched CTE: Delivers high reliability of plated through-holes, minimizing deformation and improving PCB durability.
4. Chemical Resistance: Reduces damage during fabrication and assembly processes, lowering production defects and costs.
5. Thermoset Resin Base: Enables reliable wire bonding, eliminates the need for specialized production techniques, and TMM10i laminates can directly replace alumina substrates for cost savings.

12.DataSheet

Properties	Typical Value	Direction	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	9.20 ± 0.230	Z	–	10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant (design)	9.8	–	–	8 GHz – 40 GHz	Differential Phase Length Method
Dissipation Factor (process)	0.0022	Z	–	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-38	–	ppm/°K	-55 to +125°C	IPC-TM-650 2.5.5.5
Insulation Resistance	>2000	–	Gohm	C/96/60/95	ASTM D257
Volume Resistivity	2×10⁸	–	MΩ·cm	–	ASTM D257
Surface Resistivity	4×10⁷	–	MΩ	–	ASTM D257
Electrical Strength (Dielectric Strength)	285	Z	V/mil	–	IPC-TM-650 2.5.6.2
Thermal Properties
Decomposition Temperature (Td)	425	–	°C	TGA	ASTM D3850
Coefficient of Thermal Expansion – x	21	X	ppm/K	0 to 140°C	ASTM E 831, IPC-TM-650 2.4.41
Coefficient of Thermal Expansion – y	21	Y	ppm/K	0 to 140°C	ASTM E 831, IPC-TM-650 2.4.41
Coefficient of Thermal Expansion – z	20	Z	ppm/K	0 to 140°C	ASTM E 831, IPC-TM-650 2.4.41
Thermal Conductivity	0.76	Z	W/m/K	80°C	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress	5.0 (0.9)	X,Y	lb/inch (N/mm)	After solder float, 1 oz. EDC	IPC-TM-650 2.4.8
Flexural Strength (MD/CMD)	13.62	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)	1.79	X,Y	Mpsi	A	ASTM D790
General Properties
Moisture Absorption (1.27 mm / 0.050”)	0.09	–	%	D/24/23	ASTM D570
Moisture Absorption (3.18 mm / 0.125”)	0.20	–	%	D/24/23	ASTM D570
Specific Gravity	2.77	–	–	A	ASTM D792
Specific Heat Capacity	0.74	–	J/g/K	A	Calculated
Lead-Free Process Compatible	YES	–	–	–	–

13.Summary

Rogers  TMM10 2-Layer RF circuit board is a high-performance, cost-effective solution tailored for microwave and RF applications. Leveraging the advanced properties of Rogers TMM10 thermoset substrate, this 0.5mm thick double-sided PCB offers stable dielectric performance, excellent dimensional stability, and simplified fabrication. Compliant with IPC-Class-2 standards, globally available, and equipped with ENEPIG surface finish, it meets the rigorous requirements of chip testers, satellite communication systems, and wireless antennas, providing reliable performance and long-term value for volume production.