2. Features

1. Dielectric constant of 10.2+/- .30 at 10 GHz/23°C
2. Dissipation factor of 0.0022 at 10 GHz/23°C
3. Low Coefficient of Thermal Expansion (-55 to 288 °C) of 13 ppm/°C(X), 11 ppm/°C (Y), 16 ppm/°C (Z) respectively
4. Td > 500°C
5. Thermal Conductivity of 0.95 W/mK
6. Moisture Absorption of 0.05%
7. Operating temperature range: -40℃ to +85℃

3. Benefits

1. Material exhibits dimensional stability with expansion coefficient matched to copper, ensuring long-term reliability and reducing deformation risks
2. Economical laminate pricing, suitable for volume manufacturing processes to help control production costs
3. ISO 9001 Certified, guaranteeing consistent quality and compliance with international standards
4. Suitable for use with multi-layer board designs, offering flexibility for complex electronic applications

4. PCB Construction Details

Construction Item	Specification
Base material	RO3010
Layer count	Double sided
Board dimensions	89.65mm x 94.3 mm = 1PCS
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.25mm
Blind vias	No
Finished board thickness	1.3mm
Finished Cu weight (outer layers)	1 oz (1.4 mils)
Via plating thickness	20 μm
Surface finish	EPIG (nickel free)
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Electrical test prior to shipment	100% Electrical test used

5. PCB Stackup

2-layer rigid PCB

1. Copper_layer_1 - 35 μm
2. Rogers RO3010 Substrate - 50mil (1.27mm)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 21
2. Total Pads: 45
3. Thru Hole Pads: 31
4. Top SMT Pads: 14
5. Bottom SMT Pads: 0
6. Vias: 29
7. Nets: 2

7. Type of artwork supplied

Gerber RS-274-X

8. Accepted standard

IPC-Class-2

9. Availability

worldwide

10. Some Typical Applications

1. Automotive radar applications
2. Global positioning satellite antennas
3. Cellular telecommunications systems - power amplifiers and antennas
4. Patch antenna for wireless communications
5. Direct broadcast satellites
6. Datalink on cable systems
7. Remote meter readers
8. Power backplanes
10. 11.Rogers RO3000 Series CCL Introduction

Rogers RO3000 series is a ceramic-filled PTFE composite CCL, specially designed for commercial microwave and RF applications. It features excellent electrical and mechanical stability at a competitive price, with consistent mechanical properties across different dielectric constants—enabling flexible multi-layer PCB designs without warpage risks. Its X/Y-axis CTE (17 ppm/°C) matches copper, ensuring superior dimensional stability, while the Z-axis CTE (24 ppm/°C) guarantees reliable plated through-holes even in harsh thermal environments. Compatible with standard PTFE processing techniques and cost-effective for volume production, it is well-suited for high-frequency applications like automotive radar, satellite antennas, and cellular telecommunications systems.

 

Rogers RO3000 is a ceramic-filled PTFE composite CCL for microwave/RF applications, offering excellent electrical/mechanical stability at competitive prices. Its copper-matched X/Y-axis CTE (17 ppm/°C) ensures dimensional stability, while Z-axis CTE (24 ppm/°C) guarantees reliable plated through-holes. Compatible with standard PTFE processing, it’s cost-effective for volume production and ideal for high-frequency applications.

12.DataSheet

Properties	Typical Value	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	10.2 ± 0.30	-	23˚C, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	11.20	-	8 GHz – 40 GHz	Differential Phase Length
Dissipation Factor	0.0022	-	23˚C, 10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-395	ppm/˚C	-50 to 150˚C, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	10⁵	MΩ·cm	Condition A	IPC TM-650 2.5.17.1
Surface Resistivity	10⁵	MΩ	Condition A	IPC TM-650 2.5.17.1
Thermal & Mechanical Properties
Decomposition Temperature (Td)	500	˚C	TGA	ASTM D3850
Coefficient of Thermal Expansion – x	13	ppm/˚C	-55 to 288˚C, 23˚C / 50% RH	IPC TM-650 2.4.41
Coefficient of Thermal Expansion – y	11	ppm/˚C	-	-
Coefficient of Thermal Expansion – z	16	ppm/˚C	-	-
Thermal Conductivity	0.95	W/(m·K)	50˚C	ASTM D5470
Copper Peel Strength	9.4	lbs/in	1 oz. EDC After Solder Float	IPC TM-650 2.4.8
Young’s Modulus	1902, 1934	MPa	23˚C	ASTM D638
Dimensional Stability (MD, CMD)	-0.35, -0.31	mm/m	Condition A	IPC TM-650 2.2.4
General Properties
Flammability	V-0	-	-	UL 94
Moisture Absorption	0.05	%	D48/50	IPC TM-650 2.6.2.1
Density	2.8	g/cm³	23˚C	ASTM D792
Specific Heat Capacity	0.8	J/g/K	-	Calculated
Lead Free Process Compatible	Yes	-	-	-

13.Summary

Rogers RO3010 2-Layer High Frequency PCB is a reliable, cost-effective solution designed for a wide range of high-frequency applications. Leveraging the ceramic-filled PTFE composite substrate of Rogers RO3010, this 1.3mm thick double-sided PCB offers excellent dielectric stability, low dissipation factor, and dimensional consistency, making it suitable for circuit miniaturization and broadband component design. With ISO 9001 certification, compliance with IPC-Class-2 standards, and worldwide availability, it meets the rigorous requirements of automotive, telecommunications, and satellite applications, providing long-term performance and value for volume manufacturing.