2. Key Features of Rogers TMM6 PCB

1. Built with genuine Rogers TMM6 ceramic hydrocarbon thermoset polymer composite dielectric substrate
2. Precise and stable dielectric constant (Dk): 6.0 ± 0.08 at 10 GHz for consistent impedance control
3. Low dissipation factor of 0.0023 at 10 GHz, effectively minimizing high-frequency signal attenuation
4. Ultra-low thermal coefficient of Dk: -11 ppm/°K, ensuring stable electrical performance under temperature fluctuation
5. Copper-matched isotropic thermal expansion coefficients: 18 ppm/K (X-axis), 18 ppm/K (Y-axis), 26 ppm/K (Z-axis)
6. High decomposition temperature (Td) of 425°C via TGA testing for superior thermal resistance
7. High thermal conductivity of 0.72 W/mk, nearly double the heat dissipation efficiency of conventional PTFE ceramic laminates
8. Wide available substrate thickness range from 0.0015 inch to 0.500 inch with tight tolerance of ±0.0015 inch
9. Nickel-free EPIG surface finish eliminates nickel interference for high-precision RF signal transmission
10. Blind-via-free structural design simplifies circuit layout and improves production yield
11. Standard 1oz outer copper weight and 20μm via plating thickness ensure stable conductivity and PTH reliability

3. Product Benefits

1. Superior Mechanical Stability: Premium thermoset resin structure resists creep and cold flow under long-term operating stress, maintaining stable circuit dimensional accuracy
2. Excellent Chemical Resistance: TMM6 substrate withstands common PCB etching solutions and processing solvents, preventing material damage during fabrication and assembly
3. Reliable Wire Bonding Performance: Thermoset base material will not soften under heating, avoiding pad lifting and substrate deformation during component wire bonding processes
4. Full Compatibility with Standard PCB Processes: No specialized high-frequency processing techniques required, fully adaptable to conventional PWB manufacturing workflows for cost-effective mass production
5. High PTH Reliability: Copper-matched CTE values drastically reduce thermal expansion deviation, ensuring durable plated through-hole stability in temperature cycling environments
6. Ultra-Stable Temperature Dielectric Performance: Extremely low TCDK value restrains electrical parameter drift under extreme temperature changes, guaranteeing consistent RF performance
7. Efficient Thermal Dissipation: Double thermal conductivity compared to traditional PTFE ceramic laminates quickly dissipates heat from high-power RF circuits
8. Flexible Structural Customization: Supports various copper foil weights and metal base bonding, adapting to diverse high-frequency circuit design requirements

4. PCB Construction Details

Parameter Item	Specification Details
Base Material	Rogers TMM6 Ceramic Thermoset Polymer Composite
Layer Count	2-Layer
Board Dimensions	85.6mm x 99.75mm (1PCS), Tolerance: +/- 0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.35mm
Blind Vias Design	No Blind Vias
Finished Board Thickness	1.35mm
Finished Cu Weight	1oz (1.4 mils) Outer Layers
Via Plating Thickness	20 μm
Surface Finish	EPIG (Nickel-Free)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Test	100% Electrical Test Prior to Shipment

5. PCB Stackup

This 2-Layer rigid Rogers TMM6 PCB adopts a symmetrical and stable stackup structure with 50mil high-performance thermoset ceramic composite core, delivering balanced electrical, thermal and mechanical performance for precision RF and microwave circuit systems:

1. Copper Layer 1: 35 μm Finished Copper
2. Rogers TMM6 Core Substrate: 50mil (1.27mm)
3. Copper Layer 2: 35 μm Finished Copper

6. PCB Statistics

1. Total Components: 23
2. Total Pads: 41
3. Thru Hole Pads: 25
4. Top SMT Pads: 16
5. Bottom SMT Pads: 0
6. Total Vias: 6
7. Total Nets: 2

7. Artwork & Production Standard

1. Supplied Artwork Type: Gerber RS-274-X
2. Manufacturing Quality Standard: IPC-Class-2
3. Product Supply Scope: Worldwide Availability

8. Typical PCB Applications

1. General RF & Microwave Circuit Systems
2. High-Frequency Power Amplifiers and Power Combiners
3. Microwave Filters and Directional Couplers
4. Commercial and Military Satellite Communication Systems
5. GPS Navigation Antenna Devices
6. High-Precision Patch Antenna Modules
7. Dielectric Polarizers and Microwave Lenses
8. Professional Chip Testing and Measurement Equipment

9. Rogers TMM6 Thermoset Ceramic Composite Copper Clad Laminate (CCL) Introduction

Rogers TMM6 is a premium thermoset microwave CCL belonging to the Rogers TMM series, professionally formulated ceramic hydrocarbon polymer composite material designed for high-reliability stripline and microstrip circuit applications. The TMM series perfectly merges the high stability of ceramic substrates and the easy processing characteristics of traditional PTFE microwave laminates, overcoming the complex process limitations of conventional high-frequency materials. Unlike PTFE-based substrates, TMM6 thermoset composite material requires no sodium napthanate pretreatment before electroless plating, greatly simplifying the PCB fabrication process while maintaining excellent yield rate.

TMM6 laminate features an ultra-low thermal coefficient of dielectric constant, effectively inhibiting dielectric parameter drift caused by ambient temperature changes. Its isotropic thermal expansion coefficients are highly matched with copper foil, minimizing etching shrinkage and ensuring exceptional plated through-hole reliability for long-term circuit stability. Equipped with 0.72 W/mk thermal conductivity, TMM6 provides nearly double heat dissipation capacity compared with ordinary PTFE ceramic laminates, making it ideal for high-power density RF circuit applications.

As a thermoset resin-based material, TMM6 will not soften under continuous high-temperature conditions, completely solving common problems such as pad peeling and substrate deformation during wire bonding operations. The material exhibits outstanding resistance to various PCB process etchants and solvents, resisting chemical corrosion during production and assembly. Supporting full conventional PWB processes, TMM6 laminates are available in ultra-wide thickness ranges and multiple copper foil specifications from 1/2oz to 2oz, and can be directly bonded with brass or aluminum metal plates, providing extremely flexible design solutions for diverse high-frequency products.

9.1 Core Features of TMM6 CCL

1. Unique ceramic hydrocarbon thermoset composite structure combining ceramic stability and PTFE processability
2. Precise Dk 6.0 ±0.08 and ultra-low DF 0.0023 at 10GHz for low-loss high-frequency transmission
3. Ultra-low TCDK of -11 ppm/°K delivers excellent temperature-frequency stability
4. Copper-matched CTE realizes high-reliability plated through-hole structure
5. High 425°C decomposition temperature enhances high-temperature working durability
6. Superior thermal conductivity accelerates heat dissipation for high-power RF circuits
7. Excellent creep resistance and cold flow resistance for long-term mechanical stability
8. Strong chemical resistance against PCB processing solvents and etchants
9. Support reliable wire bonding without substrate softening or pad lifting
10. No special processing required, fully compatible with standard PCB manufacturing workflow

9.2 Processing & Structural Advantages of TMM6 CCL

1. Eliminates sodium napthanate pretreatment, simplifying electroless plating procedures
2. Wide customizable thickness range from 0.0015” to 0.500” with ultra-tight tolerance
3. Multiple copper cladding options: 1/2oz, 1oz, 2oz electrodeposited copper foil
4. Supports direct bonding with aluminum and brass substrates for metal-backed circuit designs
5. Low etching shrinkage ensures high dimensional accuracy for fine-line circuits
6. Isotropic material performance guarantees uniform signal transmission in all directions

9.3 Main CCL Application Scenarios

1. Industrial RF and Microwave Circuit Systems
2. High-Power Amplifiers, Combiners, Filters and Couplers
3. Satellite Communication and GPS Navigation Antenna Systems
4. Precision Patch Antennas, Dielectric Polarizers and Microwave Lenses
5. Semiconductor Chip Testing and Precision Measurement Equipment

10.Datasheet

Property	Typical Values	Direction	Units	Conditions	Test Method
Dielectric Constant (process)	6.00 ± 0.080	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant (design)	6.3	-	-	8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor (process)	0.0023	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-11	-	ppm/°K	-55 ~ +125°C	IPC-TM-650 2.5.5.5
Insulation Resistance	> 2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity	1×10⁸	-	Mohm·cm	-	ASTM D257
Surface Resistivity	1×10⁹	-	Mohm	-	ASTM D257
Dielectric Strength	362	Z	V/mil	-	IPC-TM-650 2.5.6.2
Decomposition Temperature (Td)	425	-	°C (TGA)	-	ASTM D3850
Coefficient of Thermal Expansion (X)	18	X	ppm/K	0 ~ 140°C	ASTM E 831 / IPC-TM-650 2.4.41
Coefficient of Thermal Expansion (Y)	18	Y	ppm/K	0 ~ 140°C	ASTM E 831 / IPC-TM-650 2.4.41
Coefficient of Thermal Expansion (Z)	26	Z	ppm/K	0 ~ 140°C	ASTM E 831 / IPC-TM-650 2.4.41
Thermal Conductivity	0.72	Z	W/m/K	80°C	ASTM C518
Copper Peel Strength after Thermal Stress	5.7 (1.0)	X, Y	lb/inch (N/mm)	1 oz EDC foil, after solder float	IPC-TM-650 2.4.8
Flexural Strength (MD/CMD)	15.02	X, Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)	1.75	X, Y	Mpsi	A	ASTM D790
Moisture Absorption (1.27mm / 0.050")	0.06	-	%	D/24/23	ASTM D570
Moisture Absorption (3.18mm / 0.125")	0.20	-	%	D/24/23	ASTM D570
Specific Gravity	2.37	-	-	A	ASTM D792
Specific Heat Capacity	0.78	-	J/g/K	A	Calculated
Lead-Free Process Compatible	YES	-	-	-	-

11.Product Summary

Rogers TMM6 2-Layer high frequency PCB is a high-stability thermoset microwave circuit board designed for high-power RF, microwave and satellite communication applications. Fabricated with 50mil Rogers TMM6 ceramic hydrocarbon thermoset composite substrate and 1.35mm finished thickness, TMM6 2-Layer laminate PCB adopts nickel-free EPIG surface finish and complies with IPC-Class-2 industrial manufacturing standards. It integrates the dual strengths of ceramic substrate stability and traditional soft substrate processability, featuring copper-matched CTE, ultra-low dielectric loss, excellent thermal dissipation and superior chemical resistance. Supporting standard PCB processing and reliable wire bonding performance, this high-performance TMM6 PCB is widely applied in power amplifiers, antenna systems, microwave passive components and precision testing equipment, providing cost-effective and high-reliability high-frequency circuit solutions for global commercial and industrial RF markets.

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