Rogers TMM6 PCB Substrates Introduction Hello everyone. Welcome back to our channel. We are happy to bring a wealth of knowledge and expertise in the field of high frequency laminates. Today we’re going to introduce to you a groundbreaking innovation in the field of microwave materials - Rogers TMM 6 PCB material. This cutting-edge ceramic thermoset polymer composite is specifically engineered to revolutionize high-frequency applications, particularly in plated thru-hole reliability strip-line and micro-strip designs. What sets TMM 6 laminates apart is their ability to harness the advantages of both ceramic and traditional PTFE microwave circuit laminates, all while eliminating the need for specialized production techniques commonly associated with these materials. Now let's delve into the detailed properties of TMM 6 laminate. TMM 6 Properties Rogers TMM 6 is a high-performance thermoset microwave PCB material . One of the standout features of TMM 6 laminates is their unique dielectric constant (Dk). With a value of 6.0±0.08, it provides reliable performance in the Z direction at 10 GHz, as tested using IPC-TM-650 2.5.5.5. Additionally, the design dielectric constant is measured at 6.3, covering a wide frequency range from 8 GHz to 40 GHz using the Differential Phase Length Method. The dissipation factor (process) of TMM 6 is impressively low at 0.0023 in the Z direction at 10 GHz, ensuring minimal signal loss during transmission. Rogers TMM 6 thermoset microwave PCB material exhibits a thermal coefficient of dielectric constant of -11 ppm/°K within a temperature range of -55℃ to 125℃, as determined by IPC-TM-650 2.5.5.5. This property ensures the stability of the dielectric constant over a wide temperature range. TMM 6 demonstrates excellent insulation resistance with values exceeding 2000 Gohm, as tested using ASTM D257. Its volume resistivity is measured at 2 x 10^8 Mohm.cm, and the surface resistivity is 1 x 10^9 Mohm, indicating its high electrical insulation capabilities. TMM 6 exhibits an impressive electrical strength of 362 volts per mil (V/mil), tested and measured using IPC-TM-650 method 2.5.6.2. Regarding thermal properties, TMM 6 has a decomposition temperature (Td) of 425℃, determined by TGA testing according to ASTM D3850. The coefficient of thermal expansion is reported as 18 ppm/K in the X and Y directions, and 26 ppm/K in the Z direction within a temperature range of 0 to 140℃. These values ensure compatibility with copper and help reduce the risk of thermal stress during operation. TMM 6 exhibits good thermal conductivity with a value of 0.72 W/m/K in the Z direction at 80℃, as measured using ASTM C518. This property allows for efficient heat dissipation in high-power applications. In terms of mechanical properties, TMM 6 demonstrates a strong copper peel strength after thermal stress at 5.7 lb/inch (1.0 N/mm), following solder float with 1 oz. ED copper, as per IPC-TM-650 Method 2.4.8. The flexural strength in the MD and CMD directions is measured at 15.02 kpsi, and the flexural modulus is 1.75 Mpsi, as determined by ASTM D790. TMM 6 has a moisture absorption rate of 0.06% for a 1.27mm (0.050") thickness and 0.2% for a 3.18mm (0.125") thickness, measured using ASTM D570. The specific gravity of the material is 2.37, indicating its density compared to water, as specified in ASTM D792. The specific heat capacity is calculated as 0.78 J/g/K. Finally, TMM 6 is compatible with lead-free processes, allowing for environmentally friendly manufacturing without compromising performance. TMM6 Typical Value Property TMM6 Direction Units Condition Test Method Dielectric Constant, ε Process 6.0±0.08 Z 10 GHz IPC-TM-650 2.5.5.5 Dielectric Constant, ε Design 6.3 - - 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor (process) 0.0023 Z - 10 GHz IPC-TM-650 2.5.5.5 Thermal Coefficient of dielectric constant -11 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5 Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257 Volume Resistivity 2 x 10^8 - Mohm.cm - ASTM D257 Surface Resistivity 1 x 10^9 - Mohm - ASTM D257 Electrical Strength (dielectric strength) 362 Z V/mil - IPC-TM-650 method 2.5.6.2 Thermal Properties Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850 Coefficient of Thermal Expansion - x 18 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41 Coefficient of Thermal Expansion - Y 18 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41 Coefficient of Thermal Expansion - Z 26 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41 Thermal Conductivity 0.72 Z W/m/K 80 ℃ ASTM C518 Mechanical Properties Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8 Flexural Strength (MD/CMD) 15.02 X,Y kpsi A ASTM D790 Flexural Modulus (MD/CMD) 1.75 X,Y Mpsi A ASTM D790 Physical Properties Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570 3.18mm (0.125") 0.2 Specific Gravity 2.37 - - A ASTM D792 Specific Heat Capacity 0.78 - J/g/K A Calculated Lead-Free Process Compatible YES - - - - Typical Applications Displayed on the screen is a TMM6 laminate for chip testing purposes. Rogers TMM 6 laminate's exceptional dielectric properties make it an excellent choice for RF and microwave circuitry applications. Its versatility extends to power amplifiers, filters, couplers, satellite communication systems, GPS antennas, patch antennas, and dielectric polarizers and lenses, contributing to the reliable and efficient operation of these systems. Summary Rogers TMM6 microwave materials are comprised of a hydrocarbon matrix that is extensively filled with ceramic particles. When drilling TMM6 materials, it is necessary to take precautions due to the abrasive characteristics of the ceramic filler. It is advisable to minimize high tool surface speeds and low chip loads as much as possible, as they can result in excessive heat generation and accelerated tool wear. OK. This concludes today’s episode. Thank you for reading. See you next time.
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