Home - Newly shipped PCBs - Rogers TMM6 2-Layer High Frequency PCB Built on 15mil Substrate with ENEPIG Surface Finish -Thermoset Microwave Circuit Solution

Rogers TMM6 2-Layer High Frequency PCB Built on 15mil Substrate with ENEPIG Surface Finish -Thermoset Microwave Circuit Solution

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

 

1. Introduction

Rogers 15mil 2-layer TMM6 PCB is fabricated using advanced ceramic thermoset polymer composite material, specifically developed to deliver exceptional plated thru-hole reliability for high-performance stripline and microstrip applications.

Rogers  innovative thermoset microwave TMM6 PCB substrate integrates the advantageous properties of both ceramic and traditional PTFE microwave circuit laminates, eliminating the need for the specialized manufacturing techniques typically required for these conventional materials.

A distinguishing characteristic of Rogers TMM6 thermoset laminate is its unique dielectric constant (Dk) within the Rogers product family, which enables tailored performance for specific high-frequency design requirements. Engineered to balance mechanical robustness and electrical performance, this circuit board material stands out as a versatile solution for demanding microwave and RF applications where reliability and process compatibility are critical.

2. Features

  1. Dielectric Constant (Dk): 6.0 +/- 0.08 at 10GHz
  2. Dissipation Factor: 0.0023 at 10GHz
  3. Thermal Coefficient of Dk: -11 ppm/°K
  4. Coefficient of Thermal Expansion (CTE) matched to copper for enhanced stability
  5. Decomposition Temperature (Td): 425 °C (TGA)
  6. CTE (x, y, z axes): 18 ppm/K, 18 ppm/K, 26 ppm/K
  7. Thermal Conductivity: 0.72 W/mk
  8. Available Thickness Range: 0.0015 to 0.500 inches, tolerance +/- 0.0015”

3. Benefits

  1. Superior mechanical properties resist creep and cold flow, ensuring long-term structural integrity
  2. Excellent resistance to process chemicals minimizes damage during PCB fabrication workflows
  3. Thermoset resin base enables reliable wire-bonding, supporting advanced component integration
  4. Compatible with all common PCB manufacturing processes, reducing production complexity and costs
  5. Copper-matched CTE prevents thermal stress-induced failures in high-temperature cycling environments
  6. High decomposition temperature and thermal conductivity enhance performance in high-power applications
  7. Unique Dk value provides design flexibility for specialized RF and microwave circuitry

4. PCB Construction Details

  1. Base material: Rogers TMM6 thermoset microwave composite
  2. Layer count: 2-layer (rigid circuit board)
  3. Board dimensions: 60mm x 96mm = 1PCS, tolerance +/- 0.15mm
  4. Minimum Trace/Space: 5/7 mils
  5. Minimum Hole Size: 0.4mm
  6. Blind vias: None
  7. Finished board thickness: 0.5mm
  8. Finished Cu weight: 1oz (1.4 mils) outer layers
  9. Via plating thickness: 20 μm
  10. Surface finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
  11. Top Silkscreen: No
  12. Bottom Silkscreen: No
  13. Top Solder Mask: No
  14. Bottom Solder Mask: No
  15. Quality inspection: 100% Electrical test conducted prior to shipment

5. PCB Stackup

2-layer rigid thermoset microwave circuit board

  1. Copper_layer_1 - 35 μm (1oz)
  2. Rogers TMM6 core material - 0.381 mm (15mil)
  3. Copper_layer_2 - 35 μm (1oz)

6. PCB Statistics

  1. Components: 20
  2. Total Pads: 26
  3. Thru Hole Pads: 9
  4. Top SMT Pads: 17
  5. Bottom SMT Pads: 0
  6. Vias: 16
  7. Nets: 2

7. Type of Artwork Supplied

Gerber RS-274-X

8. Quality Standard

IPC-Class-2

9. Availability

Worldwide

10. Typical Applications

  1. RF and microwave circuitry
  2. Power amplifiers and combiners
  3. Filters and couplers
  4. Satellite communication systems
  5. Global Positioning Systems (GPS) Antennas
  6. Patch Antennas
  7. Dielectric polarizers and lenses
  8. Chip testers

Conclusion

Rogers TMM6 2-layer ENEPIG PCB is a high-reliability thermoset microwave solution engineered for demanding RF and microwave applications. By leveraging ceramic thermoset polymer composite technology, it combines the advantages of ceramic and PTFE laminates while offering process compatibility with standard PCB manufacturing. With its unique dielectric constant, copper-matched CTE, and robust mechanical properties, TMM6 PCB meets IPC-Class-2 quality standards and provides global availability, making it an ideal choice for engineers developing high-performance, reliable electronic systems.

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.

 

 

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