2. Rogers RT/duroid 5870 2-Layer PCB Features

1. Dielectric Constant (Dk): 2.33 with tight tolerance of ±0.02 at 10 GHz
2. Dissipation Factor (Df): 0.0012 at 10GHz, enabling low electrical loss even at high frequencies
3. Temperature Coefficient of Dielectric Constant (TCDk): -115 ppm/°C
4. Low Moisture Absorption: 0.02%, suitable for high moisture environments
5. Coefficient of Thermal Expansion (CTE): X-axis 22 ppm/°C, Y-axis 28 ppm/°C, Z-axis 173 ppm/°C
6. Isotropic properties, ensuring consistent performance across all directions
7. Constructed with glass microfiber reinforced PTFE composite, balancing rigidity and processability
8. Resistant to all solvents and reagents (hot or cold) used in PCB etching or plating processes
9. Surface Finish: Electroless Nickel Immersion Gold (ENIG), ensuring excellent conductivity and corrosion resistance

3. Rogers RT/duroid 5870 2-Layer PCB Benefits

1. Uniform electrical properties over a wide frequency range, ensuring consistent signal transmission
2. Easily cut, sheared, and machined to shape, simplifying manufacturing and customization
3. Strong resistance to solvents and reagents used in etching or plating edges and holes, reducing production damage
4. Low moisture absorption (0.02%), making it ideal for high moisture environments
5. Well-established material with proven reliability in high-frequency applications
6. Lowest electrical loss among reinforced PTFE materials, extending usability to Ku-band and above
7. ENIG surface finish provides superior solderability and long-term reliability
8. Compatible with standard PCB manufacturing processes, no specialized techniques required

4. PCB Construction Details

Construction Item	Specification
Base Material	Rogers RT/duroid 5870
Layer Count	2 Layers
Board Dimensions	85mm x 36mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.4mm
Blind Vias	No
Finished Board Thickness	0.3mm
Finished Cu Weight (Outer Layers)	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Electrical Test	100% Electrical Test Used

5. PCB Stackup

2-layer rigid PCB, with the following layer structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. Rogers RT/duroid 5870 Core - 0.254mm (10mil)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 36
2. Total Pads: 56
3. Thru Hole Pads: 32
4. Top SMT Pads: 24
5. Bottom SMT Pads: 0
6. Vias: 28
7. Nets: 2

7. Artwork Format

Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with most manufacturing equipment and processes worldwide.

8. Quality Standard

Complies with IPC-Class-2 standards, guaranteeing consistent quality, reliability, and performance for commercial, industrial, and high-tech applications.

9. Global Availability

Available worldwide, supported by reliable supply chains to meet global customers’ production needs and ensure timely delivery.

10. Typical Applications

1. Commercial Airline Broadband Antennas
2. Microstrip and Stripline Circuits
3. Millimeter Wave Applications
4. Radar Systems
5. Guidance Systems
6. Point to Point Digital Radio Antennas

11. Rogers RT/duroid 5870 CCL Introduction (Glass Microfiber Reinforced PTFE Composites)

Rogers RT/duroid® 5870 is a high-performance glass microfiber reinforced PTFE composite laminate, specifically designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers within the PTFE matrix deliver exceptional dielectric constant uniformity, ensuring consistent performance from panel to panel and across a wide frequency range. With its low dissipation factor, RT/duroid 5870 extends usability to Ku-band and above, making it a preferred choice for high-frequency RF and microwave systems.

11.1 CCL Core Properties

1. Glass microfiber reinforced PTFE composite structure, combining low loss and mechanical rigidity
2. Dielectric Constant (Dk): 2.33 ± 0.02 at 10 GHz, with exceptional uniformity
3. Dissipation Factor (Df): 0.0012 at 10GHz, offering the lowest electrical loss among reinforced PTFE materials
4. Temperature Coefficient of Dielectric Constant (TCDk): -115 ppm/°C
5. Low Moisture Absorption: 0.02%, suitable for high moisture environments
6. CTE: X-axis 22 ppm/°C, Y-axis 28 ppm/°C, Z-axis 173 ppm/°C
7. Isotropic properties, ensuring consistent performance in all directions
8. Resistant to all solvents and reagents (hot or cold) used in PCB etching or plating processes
9. Available with electrodeposited (EDC) copper (½ to 2 ounces/ft², 8 to 70μm), reverse treated EDC, rolled copper foil (for critical applications), or clad with aluminum, copper, or brass plates

11.2 CCL Key Advantages

1. Lowest electrical loss for reinforced PTFE material, enabling high-performance at Ku-band and above
2. Low moisture absorption, ensuring reliability in high humidity environments
3. Isotropic properties, providing consistent electrical performance across all directions
4. Uniform electrical properties over a wide frequency range, reducing performance variations
5. Excellent chemical resistance, minimizing damage during fabrication and plating processes
6. Easy processability—easily cut, sheared, and machined to shape without specialized equipment
7. Versatile cladding options, adapting to diverse application requirements
8. Well-established material with proven reliability in high-frequency industrial and aerospace applications

12.DataSheet

Property	Typical Value	Direction	Unit	Condition	Test Method
Electrical Properties
Dielectric Constant (εr, Process)	2.33 (2.33 ± 0.02 spec.)	Z	N/A	C24/23/50, 1 MHz	IPC-TM-650 2.5.5.3
	2.33	Z	N/A	C24/23/50, 10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant (εr, Design)	2.33	Z	N/A	8 GHz – 40 GHz	Differential Phase Length Method
Dissipation Factor (tan δ)	0.0005	Z	N/A	C24/23/50, 1 MHz	IPC-TM-650 2.5.5.3
	0.0012	Z	N/A	C24/23/50, 10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of εr	-115	Z	ppm/°C	-50 – 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	2×10⁷	Z	MΩ·cm	C96/35/90	ASTM D257
Surface Resistivity	2×10⁷	Z	MΩ	C96/35/90	ASTM D257
Thermal Properties
Specific Heat	0.96 (0.23)	N/A	J/g/K (cal/g/°C)	N/A	Calculated
Thermal Conductivity	0.22	Z	W/m/K	80°C	ASTM C518
CTE (0–100°C)	22	X	ppm/°C	N/A	IPC-TM-650 2.4.41
	28	Y	ppm/°C
	173	Z	ppm/°C
Decomposition Temperature (Td)	500	N/A	°C	TGA	ASTM D3850
Density	2.2	N/A	g/cm³	N/A	ASTM D792
Mechanical Properties @ 23°C / @ 100°C
Tensile Modulus	1300 (189) / 490 (71)	X	MPa (kpsi)	A	ASTM D638
	1280 (185) / 430 (63)	Y	MPa (kpsi)
Ultimate Tensile Stress	50 (7.3) / 34 (4.8)	X	MPa (kpsi)
	42 (6.1) / 34 (4.8)	Y	MPa (kpsi)
Ultimate Tensile Strain	9.8 / 8.7	X	%
	9.8 / 8.6	Y	%
Compressive Modulus	1210 (176) / 680 (99)	X	MPa (kpsi)	A	ASTM D695
	1360 (198) / 860 (125)	Y	MPa (kpsi)
	803 (120) / 520 (76)	Z	MPa (kpsi)
Ultimate Compressive Stress	30 (4.4) / 23 (3.4)	X	MPa (kpsi)
	37 (5.3) / 25 (3.7)	Y	MPa (kpsi)
	54 (7.8) / 37 (5.3)	Z	MPa (kpsi)
Ultimate Compressive Strain	4.0 / 4.3	X	%
	3.3 / 3.3	Y	%
	8.7 / 8.5	Z	%
Copper Peel Strength	27.2 (4.8)	N/A	pli (N/mm)	1 oz (35 μm) EDC foil, after solder float	IPC-TM-650 2.4.8
General Properties
Moisture Absorption	0.02	N/A	%	0.062” (1.6 mm), D48/50	ASTM D570
Flammability	V-0	N/A	N/A	N/A	UL 94
Lead-Free Process Compatible	Yes	N/A	N/A	N/A	N/A

13. Summary

Rogers 2-Layer RT/duroid 5870 High Frequency PCB is a high-precision, low-loss printed circuit board engineered for demanding high-frequency applications. Featuring a 0.3mm thickness (10mil RT/duroid 5870 core), 2-layer structure, and Electroless Nickel Immersion Gold surface finish, this PCB delivers exceptional dielectric uniformity, low electrical loss, and strong chemical resistance. Compliant with IPC-Class-2 standards and compatible with standard PCB manufacturing processes, it is an ideal solution for commercial airline broadband antennas, millimeter wave applications, radar systems, guidance systems, and point-to-point digital radio antennas. Globally available, it provides consistent quality and value for customers seeking reliable, high-performance RF and microwave PCB solutions.