2. Rogers TMM13i 2-Layer PCB Features

1. Isotropic dielectric constant (Dk): 12.85 +/- 0.35, ensuring stable signal transmission across all directions
2. Dissipation factor (Df): 0.0019 at 10GHz, minimizing signal loss in high-frequency applications
3. Thermal coefficient of Dk: -70 ppm/°K, providing excellent electrical stability across temperature variations
4. Copper-matched Coefficient of Thermal Expansion (CTE): X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 20 ppm/°C (operating range: -55 to 288 °C)
5. Lead-free process compatible, meeting global environmental and manufacturing standards
6. UL 94V-0 flammability rating, ensuring compliance with safety requirements
7. Constructed with a ceramic thermoset polymer composite, balancing performance and processability
8. Resistant to process chemicals, reducing damage during PCB fabrication

3. Rogers TMM13i 2-Layer PCB Benefits

1. Superior mechanical properties that resist creep and cold flow, ensuring long-term structural stability
2. Chemical resistance to fabrication solvents and etchants, minimizing production defects
3. No sodium napthanate treatment required prior to electroless plating, simplifying manufacturing processes and reducing costs
4. Thermoset resin base enables reliable wire-bonding, eliminating concerns of pad lifting or substrate deformation during processing
5. Copper-matched CTE ensures high reliability of plated through holes, reducing failure risks in harsh operating conditions
6. Thermal conductivity approximately twice that of traditional PTFE/ceramic laminates, facilitating efficient heat removal
7. Compatible with standard PCB manufacturing processes, no specialized production techniques required

4. PCB Construction Details

Construction Item	Specification
Base Material	Rogers TMM13i
Layer Count	2 Layers
Board Dimensions	76.8mm x 97mm = 1PCS
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.25mm
Blind Vias	No
Finished Board Thickness	3.9mm
Finished Cu Weight (Outer Layers)	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	OSP
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Electrical Test	100% Electrical Test Used

5. PCB Stackup

2-layer rigid PCB, with the following layer structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. Rogers TMM13i Core - 3.81mm (150mil)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 29
2. Total Pads: 47
3. Thru Hole Pads: 19
4. Top SMT Pads: 28
5. Bottom SMT Pads: 0
6. Vias: 26
7. Nets: 2

7. Artwork Format

Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with most manufacturing equipment and processes worldwide.

8. Quality Standard

Complies with IPC-Class-2 standards, guaranteeing consistent quality, reliability, and performance for commercial, industrial, and high-tech applications.

9. Global Availability

Available worldwide, supported by reliable supply chains to meet global customers’ production needs and ensure timely delivery.

10. Typical Applications

1. Chip Testers
2. Dielectric Polarizers and Lenses
3. RF and Microwave Filters, Couplers
4. High-Frequency RF and Microwave Circuitry
5. Satellite Communication Systems

11. Rogers TMM13i CCL Introduction (Thermoset Microwave Laminates)

Rogers TMM® series thermoset microwave materials are ceramic-hydrocarbon-thermoset polymer composites, specifically designed for high-reliability stripline and microstrip applications with plated through holes. These laminates combine the performance advantages of ceramic substrates with the ease of processing of soft substrates, eliminating the need for specialized production techniques common to traditional PTFE or ceramic materials.

11.1 CCL Core Properties

1. Ceramic-hydrocarbon-thermoset composite structure, delivering balanced electrical and mechanical performance
2. Exceptionally low thermal coefficient of dielectric constant (typically less than 30 ppm/°C), ensuring stable electrical performance across temperature ranges
3. Isotropic coefficients of thermal expansion, closely matched to copper, supporting high-reliability plated through holes and low etch shrinkage
4. Thermal conductivity approximately twice that of traditional PTFE/ceramic laminates, facilitating efficient heat removal
5. Available in a wide range of dielectric constants and copper cladding options (1/2 oz/ft² to 2 oz/ft² electrodeposited copper, brass or aluminum plates)
6. Substrate thicknesses ranging from 0.015” to 0.500”, adapting to diverse design requirements
7. Resistant to etchants and solvents used in PCB production, compatible with all common PWB processes

11.2 CCL Key Advantages

1. Wide range of dielectric constants, ideal for single-material systems across various high-frequency applications
2. Exceptional mechanical properties, resisting creep and cold flow for long-term reliability
3. Copper-matched CTE, ensuring high reliability of plated through holes and reducing failure risks
4. Resistant to process chemicals, minimizing material damage during fabrication and assembly
5. Thermoset resin base, enabling reliable wire bonding without substrate softening, pad lifting, or deformation
6. No specialized production techniques or sodium napthanate pretreatment required before electroless plating
7. TMM10 and 10i variants can replace alumina substrates, offering cost and process advantages

12. DataSheet

Property	Typical Value	Direction	Unit	Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	12.85 ± 0.35	Z	–	10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant (design)	12.2	–	–	8 GHz – 40 GHz	Differential Phase Length Method
Dissipation Factor (process)	0.0019	Z	–	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-70	–	ppm/°K	-55 to +125°C	IPC-TM-650 2.5.5.5
Insulation Resistance	>2000	–	Gohm	C/96/60/95	ASTM D257
Volume Resistivity	–	–	MΩ·cm	–	ASTM D257
Surface Resistivity	–	–	MΩ	–	ASTM D257
Electrical Strength (dielectric strength)	213	Z	V/mil	–	IPC-TM-650 2.5.6.2
Thermal Properties
Decomposition Temperature (Td)	425	–	°C	TGA	ASTM D3850
CTE (x)	19	X	ppm/K	0 to 140°C	ASTM E 831, IPC-TM-650 2.4.41
CTE (y)	19	Y	ppm/K	0 to 140°C	ASTM E 831, IPC-TM-650 2.4.41
CTE (z)	20	Z	ppm/K	0 to 140°C	ASTM E 831, IPC-TM-650 2.4.41
Thermal Conductivity	–	Z	W/m/K	80°C	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress	4.0 (0.7)	X,Y	lb/inch (N/mm)	after solder float, 1 oz. EDC	IPC-TM-650 2.4.8
Flexural Strength (MD/CMD)	–	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)	–	X,Y	Mpsi	A	ASTM D790
General Properties
Moisture Absorption (1.27 mm / 0.050")	0.16	–	%	D/24/23	ASTM D570
Moisture Absorption (3.18 mm / 0.125")	0.13	–	%	D/24/23	ASTM D570
Specific Gravity	3.0	–	–	A	ASTM D792
Specific Heat Capacity	–	–	J/g/K	A	Calculated
Lead-Free Process Compatible	YES	–	–	–	–

13. Summary

Rogers 2-Layer TMM13i High Frequency PCB is a high-performance thermoset microwave printed circuit board, engineered to meet the demands of high-frequency RF and microwave applications. Featuring a 3.9mm thickness (150mil TMM13i core), 2-layer structure, and OSP surface finish, this PCB delivers stable isotropic dielectric performance, copper-matched CTE, and excellent mechanical reliability. Compliant with IPC-Class-2 standards and compatible with standard PCB manufacturing processes, it is an ideal solution for chip testers, dielectric polarizers, filters, couplers, and satellite communication systems. Globally available, it provides consistent quality and value for industrial and high-tech customers seeking reliable high-frequency PCB solutions.