2. Key Features

• RoHS compliant and rated UL 94 V-0
• Fully compliant with IPC-4103 standards
• Stable dielectric constant (Dk): 3.48 ± 0.05
• Dissipation factor: 0.0037 at 10 GHz
• Glass Transition Temperature (Tg): above 280 °C (TMA)
• Coefficient of Thermal Expansion: 10 ppm/°C (X-axis), 12 ppm/°C (Y-axis), 31 ppm/°C (Z-axis)

3. Product Benefits

• Better oxidation resistance than ordinary thermoset microwave materials
• Optimized for performance-focused and high-volume production scenarios
• Low loss characteristic enables stable operation at higher frequencies and fits automotive electronic applications perfectly
• Strict tolerance of dielectric constant ensures reliable controlled impedance transmission lines
• Compatible with lead-free manufacturing processes without blistering or delamination issues
• Low Z-axis thermal expansion guarantees long-term reliability of plated through holes
• Low in-plane expansion maintains excellent dimensional stability throughout circuit processing temperature ranges
• Excellent CAF resistance for extended service life

4. PCB Construction Details

Parameter Item	Specification Details
Base Material	RO4835
Layer Count	2-Layers
Board Dimensions	45mm x 83.69mm (1 PCS), Tolerance: +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.2mm
Vias Design	No blind or buried vias
Finished Board Thickness	0.6mm
Finished Cu Weight	1 oz (1.4 mils) for all layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Silkscreen on Solder Pads	No
Pre-Shipment Test	100% Electrical test

 

5. PCB Stackup

This 2-layer rigid PCB adopts a standard symmetrical stackup structure with stable thickness and uniform material distribution:

• Layer-1: Finished copper, 35 μm
• RO4835 Dielectric: 20 mil (0.508mm)
• Layer-2: Finished copper, 35 μm

 

6. PCB Statistics

• Components: 18
• Total Pads: 32
• Thru Hole Pads: 24
• Top SMT Pads: 8
• Bottom SMT Pads: 0
• Vias: 9
• Nets: 2

 

7. Artwork & Production Standard

• Type of artwork supplied: Gerber RS-274-X
• Accepted standard: IPC-Class-2
• Service area: Worldwide

 

8. Typical Applications

• Automotive Radar and Sensors
• Point-to-Point Microwave Devices
• Power Amplifiers
• Phased-Array Radar Systems
• General RF Components

 

9. RO4835 Copper Clad Laminate Introduction

Rogers RO4835 is a high-performance hydrocarbon ceramic copper clad laminate belonging to the renowned RO4000® material family, specially engineered for high frequency circuit manufacturing. Oxidation is a common issue for traditional thermoset laminates including standard FR-4, which will gradually raise dielectric constant and dissipation factor under long-term high-temperature operation and degrade circuit performance. To solve this problem, RO4835 high-frequency laminate is developed with drastically enhanced oxidation resistance, outperforming most conventional hydrocarbon-based substrates.

Rogers RO4835 circuit material delivers electrical and mechanical characteristics nearly equivalent to the widely recognized RO4350Blaminates, bringing proven reliability to RF circuit designs. As a low-loss high frequency material, RO4835 can be processed with standard FR-4 fabrication workflows at a competitive cost. Different from PTFE-based high-frequency materials, it requires no special via treatment such as sodium etching, and is fully compatible with automated PCB production and copper surface conditioning equipment.

RO4000® series materials feature a glass transition temperature higher than 280°C. Its CTE value is close to copper, delivering outstanding dimensional stability ideal for mixed-dielectric multilayer boards. The low Z-axis expansion also ensures durable plated through holes even under extreme thermal shock. With RoHS-compliant flame retardant formula, RO4835 meets UL 94 V-0 requirements and fully complies with IPC-4103 /11 standards, making it a versatile choice for high-volume, high-frequency PCB production.

 

 

9.1 Core Advantages of RO4835 Laminate

• Superior oxidation resistance compared to common thermoset microwave laminates
• Suited for high-volume production and performance-demanding circuit designs
• Low dielectric loss to support operation at elevated frequencies
• Tight Dk tolerance for accurate controlled impedance transmission lines
• Full compatibility with lead-free manufacturing, free of blistering and delamination
• Low Z-axis expansion to protect plated through holes
• Stable in-plane expansion across the full range of PCB processing temperatures
• Excellent CAF resistance for long-term operational reliability

 

9.2 Main Applications of RO4835 Laminate

• Automotive Radar & Sensors
• Point-to-Point Microwave Systems
• RF Power Amplifiers
• Phased-Array Radar Equipment
• General RF Microwave Components

 

10. Rogers RO4835 Datasheet

Property	Typical Value	Direction	Units	Condition	Test Method
Dielectric Constant (εr) - Process	3.48 ± 0.05	Z	--	10 GHz / 23°C	IPC-TM-650 2.5.5.5 (Clamped Stripline)
Dielectric Constant (εr) - Design	3.66	Z	--	8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor (tan δ)	0.0037	Z	--	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/°C	-100°C to 250°C	IPC-TM-650 2.5.5.5
Volume Resistivity	5 × 10⁸	--	MΩ•cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	7 × 10⁸	--	MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	30.2 (755)	Z	KV/mm (V/mil)	--	IPC-TM-650 2.5.6.2
Tensile Modulus	7780 (1128)	Y	MPa (kpsi)	RT	ASTM D638
Tensile Strength	136 (19.7)	Y	MPa (kpsi)	RT	ASTM D638
Flexural Strength	186 (27)	--	MPa (kpsi)	--	IPC-TM-650 2.4.4
Dimensional Stability	＜0.5	X, Y	mm/m (mils/inch)	After etch +E2 / 150°C	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10	X	ppm/°C	-55°C to 288°C	IPC-TM-650 2.4.41
Coefficient of Thermal Expansion	12	Y	ppm/°C	-55°C to 288°C	IPC-TM-650 2.4.41
Coefficient of Thermal Expansion	31	Z	ppm/°C	-55°C to 288°C	IPC-TM-650 2.4.41
Tg	＞280	--	°C (TMA)	Condition A	IPC-TM-650 2.4.24.3
Td	390	--	°C (TGA)	--	ASTM D3850
Thermal Conductivity	0.66	--	W/(m·K)	80°C	ASTM C518
Moisture Absorption	0.05	--	%	48 hrs immersion, 0.060” sample, 50°C	ASTM D570
Density	1.92	--	g/cm³	23°C	ASTM D792
Copper Peel Strength	0.88 (5.0)	--	N/mm (pli)	After solder float, 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	V-0	--	Class	--	UL 94
Lead-Free Process Compatible	Yes	--	--	--	--

 

11. Product Summary

Rogers RO4835 2-layer high frequency PCB is a reliable and economical solution for RF and microwave applications. Constructed with 20 mil RO4835 dielectric material and 0.6mm finished board thickness, this 2-layer PCB uses immersion gold surface finish and follows IPC-Class-2 manufacturing rules. It combines low loss performance, great thermal stability and excellent oxidation resistance, while supporting standard FR-4 production flow to cut manufacturing costs. With stable CTE values, tight Dk tolerance and lead-free process compatibility, this PCB keeps stable performance during fabrication and long-term service. It is widely applicable to automotive radar, phased-array radar, power amplifiers and other RF devices, providing dependable circuit solutions for global customers.

 

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