Rogers RO4835 Copper Clad Laminates Introduction Welcome to our channel. Today, we’re going to talk about a type of oxidation resistance laminate --RO4835 high frequency laminate. All thermoset laminate materials, including FR-4, oxidize with time and temperature. Long-term oxidation can cause slight increases in the dielectric constant and dissipation factor of the circuit substrate. Design and operating temperature have an impact on the pace of change and how well a circuit performs. Rogers has developed RO4835 laminate for applications requiring greater stability at high temperatures, which is much more resistant to oxidation than conventional hydrocarbon-based materials. Now let’s look at the data sheet of Rogers RO4835. RO4835 Typical Properties Rogers RO4835 laminate has a process DK of 3.48±0.05 at 10 GHz and 23℃, and a design DK of 3.66 for a wider frequency range of 8-40 GHz. The dissipation factor is 0.0037 at 10 GHz and 23℃. RO4835 has a thermal coefficient of dielectric constant (TCDk) of +50 ppm/℃ over a wide temperature range (-100℃ to 150℃), which is an excellent value for equipment used in variable temperature environments. The volume resistivity and surface resistivity are both with high value, indicating good performance of insulation applications. RO4835 has a high electrical strength of 30.2 Kv/mm (755 v/mil). It shows good tensile modulus of 7780 MPa (1128 kpsi), tensile strength of 136 MPa (19.7 kpsi), and flexural strength of 186 MPa (27 kpsi). RO4835 has excellent dimensional stability with a shift of less than 0.5 mm/m (mils/inch) after etching and exposure at 150℃. The CTE value in X, Y, and Z directions is 10, 12, and 31 ppm/℃, respectively, within the range of -55℃ to 288℃.These low values reveal its stability over an entire range of circuit processing temperatures and reliable plated through holes. RO4835 is high Tg material with value of greater than 280℃and decomposition temperature (Td) is as high as 390℃, which are useful for high-temperature applications. It has a thermal conductivity of 0.66 W/m/K at 80℃. In addition, RO4835 has a very low moisture absorption rate of 0.05% after 48 hours of immersion at 50℃, making it suitable for use in humid environments. The density is 1.92 gm/cm³ at 23℃. It also shows good copper peel strength of 0.88 N/mm (5 pli) after soldering floating 1 oz. ED copper foil. Finally, RO4835 is UL 94 V-0 rated for flammability and is compatible with lead-free processes. Property RO4835 Direction Units Condition Test Method Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650 2.5.5.5 Volume Resistivity 5 x 108 MΩ.cm COND A IPC-TM-650 2.5.17.1 Surface Resistivity 7 x108 MΩ COND A IPC-TM-650 2.5.17.1 Electrical Strength 30.2(755) Z Kv/mm(v/mil) IPC-TM-650 2.5.6.2 Tensile Modulus 7780(1128) Y MPa(kpsi) RT ASTM D 638 Tensile Strength 136(19.7) Y MPa(kpsi) RT ASTM D 638 Flexural Strength 186 (27) Mpa (kpsi) IPC-TM-650 2.4.4 Dimensional Stability <0.5 X,Y mm/m after etch+E2/150℃ IPC-TM-650 2.4.39A Coefficient of Thermal Expansion 10 X ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41 Tg >280 ℃?TMA A IPC-TM-650 2.4.24.3 Td 390 ℃?TGA ASTM D 3850 Thermal Conductivity 0.66 W/m/oK 80℃ ASTM C518 Moisture Absorption 0.05 % 48hrs immersion 0.060" ASTM D 570 Density 1.92 gm/cm3 23℃ ASTM D 792 Copper Peel Stength 0.88 (5.0) N/mm (pli) after solder float 1 oz. IPC-TM-650 2.4.8 Flammability V-0 UL 94 Lead-free Process Compatible Yes A Piece of RO4835 Laminate We are currently seeing on screen a RO4835 laminate. Rogers RO4835 PCB material has a wide variety of applications including, but not limited to, automotive radars and sensors, power amplifiers, phased array radars, and various other RF components. Conclusion Moreover, Rogers RO4835 high frequency circuit material offers almost exactly the same electrical and mechanical properties as RO4350B laminates, which customers have successfully used for many years. As a subset of the RO4000 hydrocarbon ceramic laminate family, RO4835 laminates are created to provide improved high frequency performance and affordable circuit fabrication. The end result is a low loss material that can be manufactured using common epoxy/glass (FR-4) techniques at a reasonable cost. Well, thank you for reading. I’ll see you next time.
(mils/inch)
12
31
Y
Z
sample Temperature 50℃
EDC Foil
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