2. Key Features of DiClad 527 PCB

1. Stable dielectric constant (Dk) ranging from 2.4 to 2.6 at 10 GHz and 1 MHz under 50% RH condition
2. Ultra-low dissipation factor of 0.0017 at 10 GHz and 0.0010 at 1 MHz with 50% relative humidity
3. Low TcDK value of -153 ppm/°C within the temperature range of -10°C to 140°C at 10 GHz, ensuring stable electrical performance under temperature changes
4. Extremely low moisture absorption rate of 0.03%, resisting performance degradation caused by humid environments
5. Precise and stable CTE parameters: 14 ppm/°C (X-axis), 21 ppm/°C (Y-axis), and 173 ppm/°C (Z-axis)
6. Adopts 1oz outer layer copper weight and 20μm via plating thickness for reliable circuit conductivity and durability
7. Precise manufacturing specifications with 4/6 mils minimum trace/space and 0.3mm minimum hole size, supporting fine-line circuit design
8. No blind vias design, simplified circuit structure and improved production stability
9. Black top silkscreen and no solder mask on both sides, meeting special high-frequency circuit design requirements
10. 100% electrical testing implemented prior to shipment to guarantee product qualification rate

3. Product Benefits

1. Extremely Low Loss Tangent: Effectively reduces high-frequency signal attenuation, ensuring efficient and accurate signal transmission for RF and microwave circuits
2. Excellent Dimensional Stability: Optimized fiberglass and PTFE composite structure minimizes board deformation and size deviation during production and operation
3. Consistent Product Performance Uniformity: Uniform substrate material properties ensure stable overall performance of each finished PCB board
4. Highly Uniform Electrical Properties Across Frequencies: Maintains consistent electrical characteristics in wide frequency bands, adapting to multi-scene high-frequency application requirements
5. Reliable Consistent Mechanical Performance: Stable CTE parameters enhance the PCB’s adaptability to temperature changes and mechanical stress
6. Superior Excellent Chemical Resistance: Resists corrosion from common industrial chemicals, extending product service life
7. Stable Dk Over Wide Frequency Range: Avoids dielectric constant drift in different frequency environments, ensuring stable circuit impedance matching
8. Low Circuit Loss at High Frequency: Greatly improves the working efficiency of high-frequency electronic equipment and reduces energy consumption
9. Negligible Humidity-Induced Performance Drift: Low moisture absorption ensures stable working performance in high-humidity and harsh outdoor environments

4. PCB Construction Details

Parameter Item	Specification Details
Base Material	DiClad 527
Layer Count	2-layer rigid PCB
Board Dimensions	49.63mm x 91.54mm (1PCS), Tolerance: +/- 0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.3mm
Blind Vias Design	No Blind Vias
Finished Board Thickness	0.6mm
Finished Cu Weight (Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Test	100% Electrical Test

5. PCB Stackup

This 2-layer rigid Rogers DiClad 527 PCB adopts a standard symmetrical stackup structure with stable thickness and uniform material distribution, ensuring excellent high-frequency performance:

1. Copper_layer_1: 35 μm
2. DiClad 527 Substrate: 0.508 mm (20mil)
3. Copper_layer_2: 35 μm

6. PCB Statistics

1. Components: 36
2. Total Pads: 104
3. Thru Hole Pads: 63
4. Top SMT Pads: 41
5. Bottom SMT Pads: 0
6. Vias: 19
7. Nets: 2

7. Artwork & Production Standard

1. Type of Artwork Supplied: Gerber RS-274-X
2. Accepted Manufacturing Standard: IPC-Class-2
3. Product Availability: Worldwide Supply & Service

8. Typical PCB Applications

1. Radar Feed Networks
2. Commercial Phased Array Networks
3. Low Loss Base Station Antennas
4. Guidance Systems
5. Digital Radio Antennas
6. High-frequency Filters, Couplers, LNAs (Low Noise Amplifiers)

9. DiClad 527 Copper Clad Laminate (CCL) Introduction

Rogers DiClad® 527 belongs to the premium PTFE woven fiberglass reinforced copper clad laminate series, which is professionally developed as a high-performance substrate for high-frequency printed circuit boards. Different from ordinary non-woven fiberglass PTFE laminates, Rogers DiClad 527 Laminate adopts a precisely calibrated woven fiberglass and PTFE composite formula, with a controllable material ratio that balances outstanding electrical performance and rigid mechanical properties for high-frequency PCB manufacturing.

The core advantage of DiClad® series copper clad laminates lies in its standardized woven fiberglass structure and uniform PTFE coating process. All fiberglass plies are arranged in a consistent direction, and optional cross-plied specifications are available for customized CuClad laminate solutions. This sophisticated manufacturing process delivers far better dielectric constant uniformity and dimensional stability than conventional non-woven fiberglass reinforced substrates, effectively eliminating performance deviations caused by material inconsistencies.

DiClad 527 copper clad laminate features a relatively high fiberglass-to-PTFE ratio. This unique formula enables the laminate to achieve mechanical properties comparable to traditional rigid PCB substrates, while maintaining ultra-low high-frequency loss characteristics. It boasts lower thermal expansion coefficients in all axes and superior structural stability. Its electrical performance is strictly tested at 1 MHz low frequency and 10 GHz high frequency, with a stable dielectric constant (Er) range of 2.40 to 2.65, fully meeting the stringent requirements of high-precision RF and microwave circuit systems.

9.1 Core Features of DiClad 527 Copper Clad Laminate

1. Ultra-low loss tangent to minimize high-frequency signal transmission loss
2. Superior dimensional stability to resist deformation during PCB fabrication and application
3. Excellent overall product performance uniformity for consistent batch production quality
4. Highly stable electrical properties across full frequency bands
5. Reliable and repeatable mechanical performance for long-term service
6. Outstanding chemical resistance to adapt to complex production and application environments

9.2 Typical Applications of DiClad 527 Copper Clad Laminate

1. Military-grade Radar Feed Networks
2. Commercial Phased Array Networks
3. Low-loss Base Station Antenna Systems
4. Missile Guidance Systems
5. Digital Radio Antenna Equipment
6. High-frequency Filters, Couplers and Low Noise Amplifiers (LNAs)

10. DiClad 527 Datasheet

Properties	Typical Value1	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant	2.40-2.60	-	23℃ @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant	2.40-2.60	-	23℃ @ 50% RH, 1 MHz	IPC TM-650 2.5.5.3
Dissipation Factor	0.0017	-	23℃ @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dissipation Factor	0.0010	-	23℃ @ 50% RH, 1 MHz	IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric Constant	-153	ppm/℃	-10℃ to 140℃, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	1.2 × 10⁹	MΩ·cm	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity	4.5 × 10⁷	MΩ	C96/35/90	IPC TM-650 2.5.17.1
Dielectric Breakdown	>45	kV	D48/50	ASTM D-149
Arc Resistance	>180	-	-	ASTM D-495
Coefficient of Thermal Expansion - X	14	ppm/℃	50℃ to 150℃	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - Y	21	ppm/℃	50℃ to 150℃	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - Z	173	ppm/℃	50℃ to 150℃	IPC TM-650 2.4.24
Thermal Conductivity	0.26	W/(m·K)	-	ASTM E1461
Copper Peel Strength	14	Lbs/in	10s @ 288℃, 35 μm foil	IPC TM-650 2.4.8
Young’s Modulus	517, 706	kpsi	23℃ @ 50% RH	ASTM D-638
Tensile Strength (MD, CMD)	19.0, 15.0	kpsi	23℃ @ 50% RH	ASTM D-882
Compressive Modulus	359	kpsi	23℃ @ 50% RH	ASTM D-695
Flex Modulus	537	kpsi	23℃ @ 50% RH	ASTM D-3039
Flammability	V-0	-	C48/23/50 & C168/70	UL 94
Moisture Absorption	0.03	%	E1/105+D24/23	IPC TM-650 2.6.2.2
Density	2.31	g/cm³	C24/23/50, Method A	ASTM D792
NASA Outgassing
Total Mass Lost	0.02	%	125℃, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Collected Volatiles	0.00	%	125℃, ≤ 10⁻⁶ torr	NASA SP-R-0022A
Water Vapor Recovered	0.01	%	125℃, ≤ 10⁻⁶ torr	NASA SP-R-0022A

10. Product Summary

Rogers DiClad 527 2-layer high frequency PCB is a high-reliability RF microwave circuit board tailored for high-precision high-frequency electronic systems. Featuring 0.6mm finished thickness, immersion gold surface treatment, and strict IPC-Class-2 manufacturing standards, this PCB leverages the unique advantages of DiClad 527 substrate to deliver ultra-low dielectric loss, stable Dk performance across wide frequency bands, excellent dimensional stability, and strong humidity resistance. With precise manufacturing parameters and 100% pre-shipment electrical testing, it maintains consistent electrical and mechanical performance in complex working conditions, making it an ideal substrate solution for radar, communication antenna, radio frequency filtering and other high-frequency equipment, supporting global commercial and industrial high-frequency electronic project applications.

Tags：Rogers DiClad 527 PCB, 2-Layer High Frequency PCB, DiClad 527 20mil RF PCB, DiClad 527 Microwave PCB, DiClad 527 Copper Clad Laminate, Immersion Gold PCB, Low Loss PCB, IPC-Class-2 Rigid PCB,  PTFE Woven Fiberglass CCL, Radar Feed Network PCB, Base Station Antenna PCB, Digital Radio Antenna PCB, RF Filter And Coupler PCB, LNA High Frequency PCB