2. Core Features

This pure gold plating WL-CT300 high frequency PCB fully inherits the superior electrical and mechanical properties of genuine Wangling WL-CT300 copper clad laminate, featuring comprehensive high-frequency performance advantages for modern RF circuit design. Firstly, it achieves a stable dielectric constant of 3.00 and an ultra-low dissipation factor of 0.0025 at 10GHz/23°C, ensuring minimal high-frequency signal attenuation and excellent signal integrity. Secondly, the material delivers an outstanding TCDK value of 27 ppm/°C, maintaining highly consistent dielectric performance under fluctuating temperature environments. Thirdly, it offers superior thermal conductivity of 0.41 W/MK, effectively accelerating heat dissipation and improving long-term operational stability of high-power RF devices. Fourthly, the WL-CT300 PCB features extremely low moisture absorption of 0.15%, preventing electrical performance degradation caused by humid working conditions. Fifthly, it realizes precise CTE matching with copper foil, with X-axis at 15 ppm/°C, Y-axis at 14 ppm/°C and Z-axis at 31 ppm/°C, greatly reducing circuit delamination and cracking risks during processing and operation. Lastly, compared with conventional PTFE high-frequency boards, this WL-CT300 PCB adopts FR4-compatible processing technology, featuring simpler fabrication process, higher yield rate and better circuit uniformity.

3. Product Benefits

Adopting high-performance 5mil WL-CT300 organic polymer ceramic copper clad laminate as the core dielectric material, this ultra-thin 0.25mm high frequency PCB delivers stable and reliable high-frequency performance, this 2-layer 0.25mm ultra-thin high frequency PCB provides prominent technical and economical benefits for high-frequency electronic manufacturing. The stable Dk/DF parameters and excellent temperature coefficient effectively guarantee consistent signal transmission performance for 10GHz high-frequency circuits, greatly improving the precision and stability of radar, antenna and RF filter systems. Low moisture absorption and matched copper CTE significantly enhance the PCB’s environmental adaptability and structural reliability, extending the service life of terminal equipment. High thermal conductivity optimizes the heat dissipation capacity of power amplifier circuits, meeting the heat resistance demands of high-power RF devices. In addition, FR4-like processing compatibility drastically lowers production difficulty and manufacturing costs compared with imported PTFE substrates, while fully replacing equivalent foreign high-frequency materials. With strict IPC-Class-2 quality standards and full pre-shipment electrical inspection, Wangling WL-CT300 PCB delivers cost-effective, stable and globally available high-frequency circuit solutions for automotive, communication and aerospace industries.

4. PCB Construction Details

All dimensional, structural, technological and testing parameters of the Wangling WL-CT300 2-layer ultra-thin high frequency PCB are detailed in the table below, covering machining accuracy, surface treatment, silkscreen and quality specifications:

Specification Item	Detailed Parameters
Board Dimensions	66.04mm x 43.18mm (1PCS), Tolerance: +/- 0.15mm
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.25mm
Blind Vias Design	No Blind Vias
Finished Board Thickness	0.25mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Pure Gold Plating
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Testing	100% Electrical Test

5. PCB Stackup Structure

This 5mil core WL-CT300 high frequency PCB adopts a standardized 2-layer rigid stackup design with pure gold plating surface treatment, equipped with ultra-thin 0.127mm (5mil) WL-CT300 core copper clad laminate. The scientific layered structure ensures uniform electrical performance, stable thermal expansion and reliable structural strength for ultra-thin high-frequency circuit applications:

1. Copper_layer_1: 35 μm 2. WL-CT300 Core: 0.127 mm (5mil) 3. Copper_layer_2: 35 μm

6. PCB Statistical Parameters

Complete component layout, pad and circuit network statistics of the finished Wangling WL-CT300 high frequency PCB are listed as follows:

Components: 36 Total Pads: 95 Thru Hole Pads: 56 Top SMT Pads: 39 Bottom SMT Pads: 0 Vias: 28 Nets: 2

7. Artwork Supply Type

The design artwork of this WL-CT300 high frequency PCB is delivered in standard Gerber RS-274-X format, which is fully compatible with global professional PCB manufacturing equipment to guarantee precise pattern reproduction and consistent production accuracy.

8. Quality Standard

The entire production and inspection process of Wangling WL-CT300 high frequency PCB strictly complies with IPC-Class-2 industry quality standards, meeting the reliability and stability requirements of commercial, industrial and vehicle-mounted high-frequency electronic equipment.

9. Product Availability

Wangling WL-CT300 2-layer ultra-thin high frequency PCB supports worldwide supply and distribution, providing stable and cost-effective high-frequency PCB solutions for global electronic manufacturers and communication engineering projects.

10. Wangling WL-CT300 Material Introduction

Wangling WL-CT series represents thermosetting organic polymer ceramic fiberglass-clad copper clad laminate, a professional high-frequency material series engineered for stable and cost-effective RF PCB fabrication. The dielectric layer is composed of hydrocarbon resin, composite ceramic fillers and fiberglass cloth, delivering consistent low-loss electrical performance to meet rigorous high-frequency circuit design requirements. Compared with traditional PTFE substrates, WL-CT series laminate features FR4-matched PCB processability with simpler fabrication procedures, superior circuit stability and better dimensional uniformity, serving as a perfect drop-in replacement for imported high-frequency CCL products.

Formulated with premium hydrocarbon resin and high-performance composite ceramics, WL-CT series copper clad laminates exhibit outstanding low signal loss, excellent high-temperature resistance and superior temperature stability. The material maintains steady dielectric constant and dissipation factor under varying temperature conditions, features a low thermal expansion coefficient, and offers a high TG value exceeding 280°C, ensuring reliable structural and electrical performance in complex high-temperature working environments.

The WL-CT series supports multiple customizable dielectric constant options, including Dk 3.00, 3.30, 3.38, 3.48, 4.10 and 6.15, fully covering diverse high-frequency PCB design demands. This material series is compatible with ED copper foil and reversed treated (RTF) copper foil. Adopting advanced back-adhesive treatment, RTF copper foil adds an extra 0.018mm (0.7mil) thickness to the laminate, delivering enhanced bonding strength, excellent PIM performance, lower conductor loss and reduced insertion loss for high-precision RF circuits. Additionally, WL-CT copper clad laminate can be combined with aluminum substrates to form high-performance aluminum-based high-frequency composite materials for special heat-dissipation scenarios.

Featuring standard FR4-compatible processing technology, WL-CT series copper clad laminate boasts excellent mechanical and physical properties that support multiple lamination cycles. It is highly suitable for multi-layer, high-layer-count and backplane PCB fabrication, and shows exceptional processability for dense holes and fine trace circuits, greatly improving production yield and circuit precision.

 

 

Core Characteristics of WL-CT & WL-CT300 Copper Clad Laminate

 

1. Tight Dielectric Tolerance & Ultra-Low Loss: Features precise dielectric constant tolerance and extremely low dissipation factor, ensuring minimal signal attenuation and stable high-frequency transmission performance.

2. Premium Thermosetting Hydrocarbon-Ceramic System: The specialized hydrocarbon ceramic thermosetting resin structure delivers superior PCB processability and outstanding thermal endurance compared with conventional high-frequency substrates.

3. Excellent Temperature Stability: Possesses outstanding TCDK performance with negligible dielectric parameter fluctuation under changing temperature conditions, guaranteeing consistent RF signal quality.

4. Matched Low Thermal Expansion: The X/Y-axis thermal expansion coefficient is well-matched with copper foil, while the low Z-axis CTE ensures excellent dimensional thermal stability and reliable plated hole copper integrity during processing and long-term operation.

5. High TG Thermal Stability: With a high TG value above 280°C, the laminate maintains stable dimensional accuracy and intact hole copper quality even under continuous high-temperature working conditions.

6. Superior Thermal Conductivity: Higher thermal conductivity than mainstream thermoplastic high-frequency materials, effectively meeting the heat dissipation requirements of high-power RF and microwave electronic devices.

7. High Cost-Effective Mass Production Grade: Commercialized mass-production material with stable quality and competitive pricing, providing reliable alternatives to expensive imported high-frequency copper clad laminate.

8. Excellent Radiation Resistance: Retains stable dielectric properties and physical structural integrity after high-dose radiation exposure, adapting to harsh aerospace and military working environments.

9. Low Outgassing Performance: Complies with aerospace vacuum outgassing standards after professional vacuum volatilization testing, fully qualified for space and aviation equipment applications.

11. Typical Applications

Benefiting from the low-loss, high-temperature resistant and radiation-stable properties of 5mil WL-CT300 copper clad laminate, this pure gold plating high frequency PCB serves a wide range of high-end industrial and military scenarios. Typical applications cover aerospace and aviation equipment, space vacuum devices, aircraft and cabin electronic systems, microwave circuits, high-precision antennas and phase-sensitive antenna systems. It is also widely adopted in early warning radars, airborne radars, phased array antennas, beamforming networks, satellite communication and navigation systems, as well as high-power RF power amplifiers.

 

12.WL-CT300 Datasheet

 

Item	Test Condition	Unit	WL-CT300
Typical Dielectric Constant	10GHz	/	3.00
Design Dielectric Constant	10GHz	/	2.98
Dielectric Constant Tolerance	/	/	±0.05
Dissipation Factor (Typical)	2GHz	/	0.0025
Dissipation Factor (Typical)	10GHz	/	0.0030
Dissipation Factor (Typical)	20GHz	/	0.0036
Temperature Coefficient of Dielectric Constant	-55℃ ~ 150℃	PPM/℃	27
Peel Strength	1 OZ RTF Copper Foil	N/mm	0.85
Peel Strength	1 OZ RTF Copper Foil	N/mm	0.72
Volume Resistivity	Normal State	MΩ·cm	3×10⁸
Surface Resistivity	Normal State	MΩ	2×10⁸
Dielectric Strength (Z-axis)	5KW, 500V/s	KV/mm	28
Breakdown Voltage (XY-axis)	5KW, 500V/s	KV	35
Coefficient of Thermal Expansion (X, Y-axis)	-55℃ ~ 288℃	ppm/℃	15, 14
Coefficient of Thermal Expansion (Z-axis)	-55℃ ~ 288℃	ppm/℃	31
Thermal Stress	288℃, 10s, 3 cycles	/	No Delamination
Water Absorption	20±2℃, 24h	%	0.15
Density	Room Temperature	g/cm³	1.57
Continuous Operating Temperature	Temperature & Humidity Chamber	℃	-55 ~ +260
Thermal Conductivity (Z-axis)	/	W/(m·K)	0.41
PIM Value	With RTF Copper Foil	dBc	≤-158
Flame Retardancy	UL-94	Class	V-0
Glass Transition Temperature (Tg)	Standard	℃	>280
Thermal Decomposition Temperature (Td)	Initial Value	℃	412
Halogen Content	/	/	Halogen Containing
Material Composition	/	/	Hydrocarbon + Special Ceramics + Glass Fabric

13. Product Summary

WL-CT300 2-layer 5mil RF circuit board is an ultra-thin 0.25mm pure gold plating rigid circuit board based on premium 0.127mm WL-CT300 hydrocarbon ceramic copper clad laminate, designed for high-frequency communication and automotive radar applications. Featuring fixed Dk3.0 low-loss performance, ultra-stable TCDK, high thermal conductivity and low moisture absorption, this pure gold plating PCB achieves precise CTE matching with copper foil and passes strict IPC-Class-2 quality certification. With FR4-compatible processing advantages and high-temperature stability over 280°C TG, it effectively solves the problems of difficult processing and high cost of imported high-frequency substrates, serving as a high-quality alternative solution for base station antenna, satellite communication, automotive radar and RF filter equipment with reliable global supply capacity.

 

Tags：Wangling WL-CT300 PCB, WL-CT300 High Frequency PCB, 2-Layer WL-CT300 PCB, 0.25mm Ultra Thin High Frequency PCB, 0.127mm WL-CT300 Core PCB, Pure Gold Plating PCB, IPC-Class-2 PCB, Hydrocarbon Ceramic PCB, Low Loss 10GHz PCB, Automotive Radar PCB, Base Station Antenna PCB, Satellite Communication PCB, RF Filter PCB, WIMAX Antenna PCB, Low Moisture Absorption PCB