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20-Layer 3mm TU-872 SLK TG200 High Speed HDI PCB, Nickel Palladium Gold PCB with Resin Plugged Hole and Controlled Impedance
20-Layer 3mm TU-872 SLK TG200 High Speed HDI PCB, Nickel Palladium Gold PCB with Resin Plugged Hole and Controlled Impedance
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. TU-872 SLK PCB Product Overview
This custom 20-Layer 3mm HDI high speed PCB adopts premium TU-872 SLK TG200 modified epoxy FR-4 substrate, specially developed for high speed low loss and high frequency multilayer circuit applications.The PCB is configured with 0.5oz copper for inner layers and 1oz finished copper for outer layers, with overall finished board thickness up to 3mm. It adopts green solder mask with white silk screen on both top and bottom sides, and finished with nickel palladium gold surface treatment for superior conductivity, oxidation resistance and soldering reliability.The board is manufactured strictly in accordance with IPC-3 standard, equipped with professional resin plugged hole technology, precise controlled impedance design and laser HDI structure. The dimension is 215mm × 137mm per unit, shipped in 2×2 panel combination with 4 pieces per set. It is perfectly suitable for high-performance computing, server, telecom and radio frequency high-end electronic equipment.
2.PCB Specifications
Item |
Specification Parameter |
Board Structure |
20-Layer HDI multilayer PCB |
Base Material |
TU-872 SLK TG200 modified epoxy FR-4 |
Inner Layer Copper |
0.5oz finished copper |
Outer Layer Copper |
1oz finished copper |
Finished Board Thickness |
3mm |
Solder Mask |
Green solder mask with white legend |
Surface Treatment |
Nickel Palladium Gold |
Single Board Dimension |
215mm × 137mm |
Shipping Panel |
2×2 layout, 4 pieces per panel |
Manufacturing Standard |
IPC-3 Class Standard |
Special Process |
Resin plugged hole, Controlled impedance, Laser HDI technology |
3. Impedance Table
4. TU-872 SLK Laminate Introduction
TU-872 SLK is a high-performance modified epoxy FR-4 laminate reinforced with regular woven E-glass fabric. It is engineered with low dielectric constant and ultra-low dissipation factor, tailored for high speed low loss and high frequency multilayer PCB designs.The material supports eco-friendly lead-free manufacturing processes and maintains full compatibility with conventional modified FR-4 production workflows. With allyl network forming compound adopted in formula, TU-872 SLK features enhanced material toughness, outstanding moisture resistance, optimized CTE performance, superior chemical resistance and excellent thermal stability. It also delivers remarkable CAF resistance, reliable through-hole integrity and stable long-term working performance for high-end multilayer electronic products.
4.1 Performance and Processing Advantages
Outstanding electrical performance
Dielectric constant below 4.0
Dissipation factor lower than 0.010
Stable and consistent Dk and Df characteristics
Compatible with modified FR-4 fabrication processes
Great moisture resistance and suitable for lead-free reflow soldering
Optimized Z-axis thermal expansion property
Good anti-CAF performance
Excellent dimensional stability, uniform thickness and high flatness
Reliable via-hole performance and superior soldering stability
4.2 TU-872 SLK Applications
Radio frequency equipmentBackpanel and high performance computing devicesLine cards and storage hardwareServers, telecommunication and base station systemsOffice network routers
4.3 TU-872 SLK Datasheet
Property |
Typical Value |
Conditioning |
IPC-4101/126 Specification |
Units |
Thermal Properties |
|
|
|
|
Tg (DMA) |
> 170°C |
E-2/105 |
– |
°C |
Tg (DSC) |
> 170°C |
E-2/105 |
– |
°C |
Tg (TMA) |
> 170°C |
E-2/105 |
– |
°C |
Td (TGA) |
> 340°C |
E-2/105 |
– |
°C |
CTE x-axis |
N/A |
E-2/105 |
– |
ppm/°C |
CTE y-axis |
N/A |
E-2/105 |
– |
ppm/°C |
CTE z-axis |
< 3.0% |
E-2/105 |
– |
% |
Thermal Stress (Solder Float, 288°C) |
> 10 sec |
Condition A |
– |
sec |
T260 |
> 30 min |
E-2/105 |
– |
min |
T288 |
> 15 min |
E-2/105 |
– |
min |
T300 |
> 2 min |
E-2/105 |
– |
min |
Flammability |
94V-0 |
E-24/125 |
94V-0 |
Rating |
Electrical Properties |
|
|
|
|
Permittivity (RC50%) 1GHz (SPC method/4291B) |
< 5.2 |
E-2/105 |
– |
– |
Permittivity (RC50%) 5GHz (SPC method) |
– |
E-2/105 |
– |
– |
Permittivity (RC50%) 10GHz (SPC method) |
– |
E-2/105 |
– |
– |
Loss Tangent (RC50%) 1GHz / 5GHz / 10GHz |
< 0.035 |
E-2/105 |
– |
– |
Volume Resistivity |
> 10¹⁰ MΩ·cm |
C-96/35/90 |
> 10⁶ MΩ·cm |
MΩ·cm |
Surface Resistivity |
> 10⁸ MΩ |
C-96/35/90 |
> 10⁴ MΩ |
MΩ |
Electric Strength |
> 40 kV/mm |
Condition A |
> 30 kV/mm |
kV/mm |
Dielectric Breakdown |
> 50 kV |
Condition A |
N/A |
kV |
Mechanical Properties |
|
|
|
|
Young’s Modulus (Warp / Fill Direction) |
N/A |
Condition A |
– |
– |
Flexural Strength Lengthwise |
> 60,000 psi |
Condition A |
– |
psi |
Flexural Strength Crosswise |
> 50,000 psi |
Condition A |
– |
psi |
Peel Strength (1.0 oz. RTF Cu foil) |
> 4 lb/in |
Condition A |
– |
lb/in |
Physical Properties |
|
|
|
|
Water Absorption |
0.13 % |
E-1/105+D-24/23 |
< 0.5 % |
% |
5. Summary
This 20-Layer 3mm TU-872 SLK TG200 HDI PCB adopts high speed low loss TU-872 SLK substrate, with 0.5oz inner copper and 1oz outer copper configuration. It features green solder mask white legend and nickel palladium gold surface finish, manufactured strictly following IPC-3 standard.Integrated with resin plugged hole, controlled impedance and laser HDI technology, the board is shipped in 2×2 panel layout with 4 pieces per set. Benefiting from TU-872 SLK’s stable low Dk/Df, anti-CAF, low expansion and high thermal reliability advantages, this multilayer HDI PCB is ideal for radio frequency, high performance computing, server, telecom base station and network router applications.
Tags：20-Layer PCB, 3mm HDI PCB, TU-872 SLK PCB, TG200 FR4 PCB, High Speed Low Loss PCB, Nickel Palladium Gold PCB, Resin Plugged Hole PCB, Controlled Impedance PCB, Laser HDI PCB, IPC-3 Standard PCB, Server Telecommunication PCB, High Performance Computing PCB, Multilayer Backpanel PCB