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Home - Newly shipped PCBs - Rogers RO4003C and 370HR Hybrid High Frequency PCB 10-Layer 1.618mm Controlled Impedance PCB with Blind Via and Resin Plugged Hole

Rogers RO4003C and 370HR Hybrid High Frequency PCB 10-Layer 1.618mm Controlled Impedance PCB with Blind Via and Resin Plugged Hole

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

 

1. RO4003C and 370HR PCB Product Overview

This custom 10-Layer 1.618mm hybrid high frequency PCB is laminated with 8mil RO4003C laminate and 370HR materials, specially designed for high frequency RF circuits and precision controlled impedance scenarios. Rogers RO4003C and 370HR circuit board adopts 1oz finished copper for outer layers, and 1oz plus 0.5oz Yin-Yang copper for inner layers, with overall lamination thickness of 1.618mm. Both top and bottom layers adopt blue solder mask with white legend, and the surface is finished with 135% to 150% immersion gold.It supports strict impedance control: Top layer trace width 12.2mil for 50 Ohm; Layer 3 trace width 3.5mil and spacing 5.5mil for 80 Ohm.Process features include blind via L1-L2, L9-L10, L7-L10 and full resin plugged hole. Board dimension is 132mm x 144mm per piece, ideal for wireless base station, RF microwave and automotive radar applications.

 

2.PCB Specifications

Item

Specification Parameter

Board Structure

10-Layer multilayer PCB

Dielectric Material

8mil RO4003C and 370HR hybrid laminate

Outer Layer Copper

1oz finished copper

Inner Layer Copper

1oz / 0.5oz Yin-Yang copper

Lamination Thickness

1.618mm

Solder Mask

Top blue solder mask with white legend, bottom blue solder mask with white legend

Surface Treatment

135%–150% Immersion Gold

Board Size

132mm x 144mm per piece

Controlled Impedance

Top: 12.2mil trace width, 50 Ohm; Layer 3: 3.5mil width / 5.5mil spacing, 80 Ohm

Special Process

Blind via L1-L2, L9-L10, L7-L10; Resin plugged hole

 

3. PCB Stackup Structure

This 10-Layer 1.618mm RO4003C and 370HR hybrid PCB adopts symmetrical stackup for stable high frequency and impedance performance.

 

 

4. RO4003C Laminate Introduction

RO4003C belongs to RO4000 series hydrocarbon ceramic high frequency laminates, not PTFE based material. It is developed for high frequency low loss and cost-sensitive mass production applications above 500MHz.It features low dielectric tolerance, low insertion loss and stable dielectric constant across wide frequency range. The temperature coefficient of dielectric constant is extremely low, suitable for broadband circuits, controlled impedance lines and filter design.With high Tg over 280°C and low thermal expansion coefficient close to copper, RO4003C delivers excellent dimensional stability and reliable plated through hole performance under thermal shock. It can be processed with standard FR4 manufacturing processes without special via etching treatment, supporting automated production and CAF resistance.

 

4.1 RO4003C Applications

Cellular Base Station Antennas and Power Amplifiers

RF Identification Tags

Automotive Radar and Sensors

LNB's for Direct Broadcast Satellites

 

4.2 RO4003C Datasheet

Property Category

Property Name

RO4003C Typical Value

Direction

Units

Test Conditions

Test Method

Electrical Properties

Dielectric Constant (εr, Process)

3.38 ± 0.05

Z

-

10 GHz/23°C

IPC-TM-650 2.5.5.5

 

Dielectric Constant (εr, Design, Clamped Stripline)

3.55

Z

-

8 to 40 GHz

Differential Phase Length Method

 

Dissipation Factor (tan δ)

0.0027 / 0.0021

Z

-

10 GHz/23°C, 2.5 GHz/23°C

IPC-TM-650 2.5.5.5

 

Thermal Coefficient of Dielectric Constant (εr)

+40

Z

ppm/°C

-50°C to 150°C

IPC-TM-650 2.5.5.5

 

Volume Resistivity

1.7 × 10¹⁰

-

MΩ•cm

Condition A

IPC-TM-650 2.5.17.1

 

Surface Resistivity

4.2 × 10⁹

-

MΩ

Condition A

IPC-TM-650 2.5.17.1

 

Electrical Strength

31.2 (780)

Z

kV/mm (V/mil)

0.51mm (0.020")

IPC-TM-650 2.5.6.2

Mechanical Properties

Tensile Modulus (Young’s Modulus)

19,650 (2,850) / 19,450 (2,821)

X / Y

MPa (ksi)

RT (Room Temperature)

ASTM D638

 

Tensile Strength

139 (20.2) / 100 (14.5)

X / Y

MPa (ksi)

RT (Room Temperature)

ASTM D638

 

Flexural Strength

276 (40)

-

MPa (kpsi)

-

IPC-TM-650 2.4.4

 

Dimensional Stability

<0.3

X, Y

mm/m (mils/inch)

After etch + E2/150°C

IPC-TM-650 2.4.39A

 

Copper Peel Strength

1.05 (6.0)

-

N/mm (pli)

After solder float, 1 oz. EDC Foil

IPC-TM-650 2.4.8

Thermal Properties

Coefficient of Thermal Expansion

11 (X) / 14 (Y) / 46 (Z)

X / Y / Z

ppm/°C

-55 to 288°C

IPC-TM-650 2.4.41

 

Glass Transition Temperature (Tg)

>280

-

°C (TMA)

Condition A

IPC-TM-650 2.4.24.3

 

Decomposition Temperature (Td)

425

-

°C (TGA)

-

ASTM D3850

 

Thermal Conductivity

0.71

-

W/m/°K

80°C

ASTM C518

Physical Properties

Moisture Absorption

0.06

-

%

48 hrs immersion, 0.060" sample, 50°C

ASTM D570

 

Density

1.79

-

g/cm³

23°C

ASTM D792

 

Flammability

N/A

-

-

-

UL 94

 

Lead-Free Process Compatible

Yes

-

-

-

-

 

5. 370HR Laminate Introduction

370HR is a high performance 180°C glass transition temperature FR-4 laminate and prepreg system, designed for multilayer printed wiring boards requiring superior thermal performance and long-term reliability.Formulated with high-performance multifunctional epoxy resin and reinforced with E-glass fabric, it achieves lower expansion rate and better thermal endurance than conventional FR4, while fully compatible with standard FR4 processing workflow.It features Tg 180°C, Td 340°C, excellent T260 and T288 thermal resistance, UV blocking and AOI fluorescence, outstanding CAF resistance, chemical stability and moisture resistivity, fully compliant with RoHS and major IPC UL industry certifications. It is highly suitable for sequential lamination multilayer PCB design.

 

5.1 370HR Applications

Automotives and Harsh environment equipment

Servers

Telecommunication systems

Base station infrastructure

 

5.2 370HR Datasheet

Property

Typical Value

Specification

Units

Test Method

Glass Transition Temperature (Tg) by DSC

180

170

ºC

IPC-TM-650 2.4.25

Decomposition Temperature (Td) by TGA @ 5% weight loss

340

–

ºC

ASTM D3850

T260

60

–

Minutes

ASTM D3850

T288

30

–

Minutes

ASTM D3850

CTE, Z-axis Pre-Tg / Post-Tg

45 / 230

–

ppm/ºC

IPC-TM-650 2.4.24

CTE, X-, Y-axes Pre-Tg / Post-Tg

13/14 / 14/17

–

ppm/ºC

IPC-TM-650 2.4.24

Z-axis Expansion (50-260ºC)

2.8

–

%

IPC-TM-650 2.4.24

Thermal Conductivity

0.4

–

W/mK

ASTM D5930

Thermal Stress 10 sec @ 288ºC Unetched / Etched

Pass / Pass Visual

Pass

Rating

IPC-TM-650 2.4.13.1

Dk Permittivity @ 100 MHz

4.24

5.4

–

IPC-TM-650 2.5.5.3

Dk Permittivity @ 1 GHz

4.17

–

–

IPC-TM-650 2.5.5.9

Dk Permittivity @ 2 GHz

4.04

–

–

IPC-TM-650 2.5.5.5

Dk Permittivity @ 5 GHz

3.92

–

–

IPC-TM-650 2.5.5.5

Dk Permittivity @ 10 GHz

3.92

–

–

IPC-TM-650 2.5.5.5

Df Loss Tangent @ 100 MHz

0.0150

0.035

–

IPC-TM-650 2.5.5.3

Df Loss Tangent @ 1 GHz

0.0161

–

–

IPC-TM-650 2.5.5.9

Df Loss Tangent @ 2 GHz

0.0210

–

–

IPC-TM-650 2.5.5.5

Df Loss Tangent @ 5 GHz

0.0250

–

–

IPC-TM-650 2.5.5.5

Df Loss Tangent @ 10 GHz

0.0250

–

–

IPC-TM-650 2.5.5.5

Volume Resistivity – 96/35/90

–

1.0×10⁶

MΩ-cm

IPC-TM-650 2.5.17.1

Volume Resistivity – After moisture resistance

3.0×10⁸

–

MΩ-cm

IPC-TM-650 2.5.17.1

Volume Resistivity – At elevated temperature

7.0×10⁸

1.0×10³

MΩ-cm

IPC-TM-650 2.5.17.1

Surface Resistivity – 96/35/90

–

1.0×10⁴

MΩ

IPC-TM-650 2.5.17.1

Surface Resistivity – After moisture resistance

3.0×10⁶

–

MΩ

IPC-TM-650 2.5.17.1

Surface Resistivity – At elevated temperature

2.0×10⁸

1.0×10³

MΩ

IPC-TM-650 2.5.17.1

Dielectric Breakdown

>50

–

kV

IPC-TM-650 2.5.6

Arc Resistance

115

60

Seconds

IPC-TM-650 2.5.1

Electric Strength

54 (1350)

30 (750)

kV/mm (V/mil)

IPC-TM-650 2.5.6.2

Comparative Tracking Index (CTI)

3 (175-249)

–

Class (Volts)

UL-746A / ASTM D3638

Peel Strength – Low profile Cu >17μm

1.14 (6.5)

0.70 (4.0)

N/mm (lb/inch)

IPC-TM-650 2.4.8

Peel Strength – Standard profile After thermal stress

1.25 (7.0)

0.80 (4.5)

N/mm (lb/inch)

IPC-TM-650 2.4.8.2

Peel Strength – Standard profile @125ºC

1.25 (7.0)

0.70 (4.0)

N/mm (lb/inch)

IPC-TM-650 2.4.8.3

Peel Strength – Standard profile After process solutions

1.14 (6.5)

0.55 (3.0)

N/mm (lb/inch)

IPC-TM-650 2.4.8

Flexural Strength Lengthwise / Crosswise

90000 / 77000

–

lb/in²

IPC-TM-650 2.4.4

Tensile Strength Lengthwise / Crosswise

55900 / 35620

–

lb/in²

–

Young's Modulus Grain / Fill direction

3744 / 3178

–

ksi

–

Poisson's Ratio Grain / Fill direction

0.177 / 0.171

–

–

–

Moisture Absorption

0.15

–

%

IPC-TM-650 2.6.2.1

Flammability

V-0

–

Rating

UL 94

Max Operating Temperature

130

UL Cert

ºC

–

 

6. Summary

This 10-Layer 1.618mm hybrid PCB combines RO4003C high frequency laminate and 370HR high Tg FR4 material, adopting 1oz outer copper and 1oz/0.5oz inner Yin-Yang copper layout. With 1.618mm overall thickness, dual-sided blue solder mask white legend and 135%–150% immersion gold finish, it achieves precise 50 Ohm and 80 Ohm impedance control.Equipped with multi-group blind via and resin plugged hole technology, the board integrates the low-loss high-frequency advantage of RO4003C and the high thermal stability and high reliability of 370HR. It is an ideal circuit board for base station antenna, RF power amplifier, automotive radar and broadband communication equipment.

 

Tags：10-Layer PCB, RO4003C and 370HRPCB, RO4003C Laminate PCB, 370HR FR4 PCB, High Frequency Hybrid PCB, Controlled Impedance PCB, Yin-Yang Copper PCB, Immersion Gold PCB, Blue Solder Mask PCB, Blind Via PCB, Resin Plugged Hole PCB, Telecommunication Base Station PCB, Automotive Radar RF PCB

 

 

 

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