2. TU-865 PCB Specifications

Item	Specification Parameter
Board Structure	8-Layer heavy copper circuit board
Base Material	TU-865 TG180 FR4 halogen free substrate
Copper Thickness Per Layer	10 oz (350μm) finished copper
Finished Board Thickness	4.5mm
Solder Mask	Top green solder mask with white legend, bottom green solder mask with white legend
Surface Treatment	Immersion Gold
Board Size	120mm x 120mm per piece
Special Technology	Blind hole, buried hole, half hole; all vias filled with conductive copper paste

 

3. PCB Stackup Structure

This 8-Layer 4.5mm TU-865 TG180 FR4 PCB adopts standard high-reliability symmetrical stackup design suitable for heavy copper and multilayer high reliability projects:

• Copper_layer_1 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_2 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_3 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_4 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_5 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_6 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_7 – 10 oz finished copper
• TU-865 FR4 Core – Custom thickness
• Copper_layer_8 – 10 oz finished copper
• 

 

4. TU-865 CCL Material Introduction

TU-865 is a high Tg halogen free FR4 copper clad laminate formulated with epoxy resin and E-glass fabric, specially developed for harsh environment and high reliability electronic applications. As an eco-friendly green material without halogen, antimony and red phosphorous components, TU-865 integrates superior electrical performance, outstanding mechanical stability and excellent environmental compatibility.Matched with TU-865P prepreg for multilayer lamination, this material is also available for single sided and double sided PCB production. With UL94V-0 flammability grade and advanced phosphorous nitrogen compound formula, it meets global environmental protection standards while maintaining stable performance under lead-free soldering and complex assembly processes.

 

4.1 Basic Material Properties

TU-865 features high Tg performance up to TG180 and supports maximum operating temperature up to 130°C. It belongs to mid-loss dielectric material with low thermal expansion coefficient, providing excellent dimensional stability and moisture resistance. The material owns remarkable CAF resistance and UV blocking characteristics, and is fully compatible with AOI inspection process. Its stable physical and chemical properties ensure long-term reliability under repeated thermal cycling and high humidity working scenarios.

 

4.2 Processing Characteristics

TU-865 laminate supports standard PCB manufacturing and lead-free assembly processes, available in multiple standard thickness from 0.05mm to 1.58mm, with copper foil cladding ranging from 1/3 oz to 12 oz. Various glass fabric styles such as 106, 1080, 2113, 2116, 1506 and 7628 are optional, and prepreg can be supplied in roll or panel form for flexible multilayer stackup design. It shows great chemical resistance and low warpage performance, ideal for heavy copper, blind buried hole and high-layer count PCB mass production.

 

4.3 Core Features and Advantages

TU-865 is an environmental friendly high reliability material free of halogen and harmful flame retardant ingredients. High Tg design improves thermal endurance, while low CTE minimizes dimensional change during high temperature processing. Excellent moisture resistivity and anti-CAF capability extend service life of multilayer boards. Compatible with lead-free soldering and severe thermal cycling conditions, it delivers high production yield and stable performance for high-end industrial and communication PCB projects.

 

4.4 Typical Application Fields

TU-865 high reliability FR4 material is widely applied in multiple high-end industries. Main application scenarios include automotive electronic systems and harsh environment industrial equipment, as well as server hardware, telecommunication equipment and base station infrastructure. It is the ideal substrate for heavy copper multilayer PCB, high-reliability industrial control boards and long-life electronic products requiring strict environmental and thermal cycling resistance.

 

5.Datasheet

Item	Specification Parameter
Board Structure	8-Layer heavy copper circuit board
Base Material	TU-865 TG180 FR4 halogen free substrate
Copper Thickness Per Layer	10 oz (350μm) finished copper
Finished Board Thickness	4.5mm
Solder Mask	Top green solder mask with white legend, bottom green solder mask with white legend
Surface Treatment	Immersion Gold
Board Size	120mm x 120mm per piece
Special Technology	Blind hole, buried hole, half hole; all vias filled with conductive copper paste

 

6. Summary

This 8-Layer 4.5mm TU-865 TG180 FR4 heavy copper PCB adopts high-reliability halogen free TU-865 substrate, with 10 oz full-layer finished copper, 4.5mm overall thickness and immersion gold surface finish. Equipped with blind hole, buried hole, half hole and copper paste filled via technology, the board adopts double-sided green solder mask with white legend and fixed dimension of 120mm x 120mm. Benefiting from TU-865’s high Tg, low expansion, anti-CAF, moisture resistant and eco-friendly advantages, this multilayer heavy copper PCB is perfectly suitable for automotive electronics, server, telecommunication and base station equipment under harsh working conditions.

 

Tags：8-Layer PCB, 4.5mm FR4 PCB, TU-865 PCB, TG180 FR4 PCB, Halogen Free PCB, Heavy Copper PCB, 10oz Copper PCB, Immersion Gold PCB, Blind Buried Hole PCB, Copper Paste Filled Via PCB, High Reliability FR4 PCB, Server PCB, Telecommunication Base Station PCB, Harsh Environment PCB, Multilayer Industrial PCB