2. Rogers RO3210 PCB Specifications

Item	Specification Parameter
Board Structure	Four-layer copper circuit structure
Layer Material Configuration	0.508mm RO3210, 0.2mm RO4450F, 0.508mm RO3210
Outer Layer Copper Thickness	1oz finished copper
Inner Layer Copper Thickness	0.5oz finished copper
Finished Board Thickness	1.321mm lamination thickness
Surface Solder Mask	Top layer green solder mask with white silk screen, bottom layer green solder mask without silk screen
Surface Treatment	Immersion Gold and Immersion Silver
Board Dimension	95mm x 98mm per piece
Special Process	TOP to inner layer 1 controlled depth groove, 1-3 layer blind via design

 

3. PCB Stackup Structure

Rogers  RO3210 and RO4450F 4-Layer high frequency PCB adopts a professional symmetrical hybrid stackup structure, ensuring balanced mechanical stress and stable high-frequency signal transmission performance:

•Copper_layer_1 – 1oz finished copper
•RO3210 Dielectric Core – 0.508 mm
•RO4450F Bonding Layer – 0.2 mm
•RO3210 Dielectric Core – 0.508 mm
•Copper_layer_4 – 0.5oz finished copper

 

4. Rogers RO3210 CCL Material Introduction

Rogers RO3210 is a premium high-frequency circuit laminate belonging to the professional RO3200 series CCL materials, developed as an upgraded iteration of the classic RO3000 series high-frequency substrates. This woven fiberglass-reinforced ceramic-filled PTFE laminate is engineered to integrate superior electrical performance and enhanced mechanical stability, delivering cost-effective solutions for commercial and industrial high-frequency PCB manufacturing. Manufactured under strict ISO 9002 quality management systems, RO3200 series materials maintain consistent batch quality and reliable long-term performance, becoming the preferred substrate for complex multilayer RF and microwave PCB products.

4.1 Basic Material Properties

Rogers RO3210 high-frequency laminates feature a unique composite structure combining woven fiberglass reinforcement and ceramic-filled PTFE materials. It inherits the ultra-smooth surface characteristics of non-woven PTFE laminates while possessing the high rigidity of woven-glass substrates, achieving a perfect balance of precision processing performance and structural stability. The material boasts a stable dielectric constant of 10.2 and an ultra-low dissipation factor of 0.0027, effectively reducing high-frequency signal attenuation and transmission loss. Its optimized in-plane thermal expansion coefficient is highly matched with copper foil, greatly improving the dimensional stability of PCBs during high-temperature processing and thermal cycling, and avoiding circuit deformation or performance failure caused by temperature changes.

4.2 Processing Characteristics

Rogers RO3210 high frequency laminates support standard industrial PTFE PCB fabrication processes, fully compatible with conventional multilayer PCB production workflows with only minor parameter adjustments. The material’s excellent surface smoothness allows finer line etching tolerances, meeting the precision circuit production requirements of high-density multilayer PCBs. With uniform mechanical and electrical properties, RO3210 adapts perfectly to complex hybrid lamination processes with epoxy materials, effectively reducing production defects such as board warpage and layer misalignment. The mature and stable processing performance ensures high production yield and efficient volume manufacturing for customized high-frequency PCB orders.

4.3 Core Features and Advantages

The most prominent advantage of Rogers RO3210 material is its upgraded mechanical stability compared with traditional RO3000 series laminates. The woven glass reinforcement structure significantly enhances substrate rigidity, making raw materials easier to handle and reducing processing damage. Uniform electrical and mechanical performance enables it to adapt to complex multilayer high-frequency PCB structures, ensuring consistent signal transmission performance of each circuit layer. The copper-matched low expansion coefficient supports hybrid designs with epoxy multilayer boards and improves the reliability of surface mount assembly. In addition, RO3210 high frequency PCB substrate delivers excellent dimensional stability and cost competitiveness, realizing high-quality and cost-effective mass production of commercial high-frequency PCBs.

4.4 Typical Application Fields

Rogers RO3210 high-frequency PCB materials are widely used in high-precision wireless communication and automotive electronic fields. Typical application scenarios include automotive collision avoidance systems, vehicle GPS satellite antenna equipment, and wireless telecommunication base station infrastructure. It is also widely applied in wireless microstrip patch antennas, direct broadcast satellite equipment, cable system datalink modules, remote meter reading devices, and industrial power backplane circuits. Furthermore, RO3210 laminates serve as core substrates for LMDS and wireless broadband equipment, providing stable and efficient high-frequency signal support for various modern wireless communication systems.

 

5. Datasheet

Property Category	Property Name	RO3210 Typical Value	Direction	Units	Test Conditions	Test Method
Electrical Properties	Dielectric Constant (εr, Process)	10.2 ± 0.50	Z	-	10 GHz, 23°C	IPC-TM-650 2.5.5.5
	Dielectric Constant (εr, Design, Clamped Stripline)	10.8	Z	-	8 GHz - 40 GHz	Differential Phase Length Method
	Dissipation Factor (tan δ)	0.0027	Z	-	10 GHz, 23°C	IPC-TM-650 2.5.5.5
	Thermal Coefficient of Dielectric Constant (εr)	-459	Z	ppm/°C	10 GHz, 0-100°C	IPC-TM-650 2.5.5.5
	Volume Resistivity	103	-	MΩ•cm	Condition A	IPC-TM-650 2.5.17.1
	Surface Resistivity	103	-	MΩ	Condition A	IPC-TM-650 2.5.17.1
Thermal Properties	Coefficient of Thermal Expansion (-55 to 288 °C)	13 (X,Y) / 34 (Z)	X,Y,Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
	Thermal Conductivity	0.81	-	W/m/K	80°C	ASTM C518
	Specific Heat Capacity	0.79	-	J/g/K	-	Calculated
	Decomposition Temperature (Td)	500	-	°C	TGA	ASTM D3850
Mechanical Properties	Tensile Modulus (Young’s Modulus)	579 (MD) / 517 (CMD)	MD, CMD	kpsi	23°C	ASTM D638
	Copper Peel Strength	11.0	-	pli (lbs/in)	1 oz. EDC After Solder Float	IPC-TM-650 2.4.8
	Dimensional Stability	0.8	X,Y	mm/m	Condition A	ASTM D257
Physical Properties	Water Absorption (Moisture Absorption)	<0.1	-	%	D24/23	IPC-TM-650 2.6.2.1
	Density	3.0	-	g/cm³	-	-
	Color	Off White	-	-	-	-
	Flammability	V-0	-	-	-	UL 94
	Lead Free Process Compatible	YES	-	-	-	-

 

6. Summary

This custom 4-Layer 1.321mm Rogers RO3210 and RO4450F hybrid high frequency PCB integrates high-performance RO3210 ceramic-filled woven glass laminates and professional RO4450F bonding materials, featuring stable dielectric properties and upgraded mechanical rigidity. With customized 1oz outer and 0.5oz inner copper thickness, dual immersion gold and silver surface treatment, and exclusive solder mask design, this multilayer RF PCB adopts precise controlled depth groove and blind via processes to meet high-precision interconnection needs. Benefiting from RO3210’s ultra-low signal loss, excellent dimensional stability and cost-effective manufacturing advantages, this hybrid PCB is highly suitable for automotive radar systems, wireless broadband communication equipment, base station infrastructure and other high-end electronic devices, supporting stable batch production and long-term reliable operation.

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