2. Rogers RO3003 PCB Detailed Specification

Item	Specification Parameter
Board Structure	Four-layer copper structure
Layer Material Configuration	0.254mm RO3003, 0.185mm TG170 FR-4, 0.254mm TG170 FR-4
Outer Layer Copper Thickness	1oz finished copper
Inner Layer Copper Thickness	0.5oz finished copper
Finished Board Thickness	0.8mm
Surface Solder Mask	Top layer green solder mask without silk screen, bottom layer no solder mask and no silk screen
Surface Treatment	Immersion silver
Board Dimension	52mm x 77mm per piece

 

3. PCB Stackup Structure

This 4-Layer 0.8mm Rogers RO3003 and TG170 FR4 hybrid high frequency PCB adopts a professional hybrid stackup design for stable high frequency signal performance and reliable mechanical structure:

•Copper_layer_1 – 1oz finished copper
•RO3003 Dielectric Core – 0.254 mm
•TG170 FR4 Dielectric Core – 0.185 mm
•TG170 FR4 Dielectric Core – 0.254 mm
•Copper_layer_4 – 0.5oz finished copper

 

4. Rogers RO3003 CCL Material Introduction

The exceptional high-frequency performance of this custom 4-Layer RF PCB is derived from authentic Rogers RO3000 series copper clad laminates, a lineup of high-performance ceramic-filled PTFE CCL materials exclusively formulated for high frequency PCB and microwave circuit board manufacturing. The Rogers RO3000 material family includes RO3003, RO3006, RO3010, and RO3035 high frequency laminates, which are widely recognized as the top-tier base materials for automotive radar PCB, wireless communication PCB, and industrial microwave PCB in the global electronics manufacturing industry.

4.1 Basic Material Properties

Rogers RO3000 series high frequency laminates are high-performance ceramic-filled PTFE composite CCL materials, specially manufactured for precision high frequency PCB and RF microwave PCB fabrication. This professional dielectric material series balances excellent electrical stability, reliable mechanical strength, and cost-effective production, making it the preferred material for commercial high frequency hybrid PCB projects. A unique core advantage of Rogers RO3000 CCL materials is their consistent mechanical properties across different dielectric constant specifications. This key feature effectively eliminates board warpage, layer separation, and long-term reliability risks for multilayer hybrid PCB designs, greatly improving the structural flexibility and production yield of mixed-dielectric 4-layer high frequency PCBs.

Rogers RO3003 CCL material delivers superior thermal and dimensional stability for finished high frequency PCB products. The X-axis and Y-axis thermal expansion coefficient of 17 ppm/°C precisely matches the expansion rate of copper foil, ensuring minimal dimensional deviation during high-temperature etching and baking processes. The typical etching shrinkage of this immersion silver PCB is controlled below 0.5 mils per inch, guaranteeing high precision circuit patterns. The Z-axis thermal expansion coefficient of 24 ppm/°C significantly enhances plated through-hole reliability, allowing the RO3003 hybrid PCB to maintain stable electrical performance under repeated thermal cycling and harsh operating environments. Additionally, Rogers RO3003 laminate maintains a highly stable dielectric constant with changing temperature and frequency, ensuring ultra-low signal loss and consistent transmission efficiency for radar and communication RF PCBs.

4.2 Processing Characteristics

Rogers RO3000 series ceramic-filled PTFE laminates feature excellent processing compatibility for standard industrial PCB fabrication. This high frequency CCL material can be processed with conventional PTFE PCB manufacturing workflows with only minor parameter adjustments, fully compatible with mass production lines for multilayer hybrid FR4 PCBs. The mature and standardized processing technology enables economical large-scale production of Rogers RO3003 high frequency PCBs, ensuring stable product quality, high yield rate, and short lead time for commercial RF PCB orders.

4.3 Core Features and Advantages

As the core dielectric material of this 4-Layer hybrid PCB, Rogers RO3003 laminate features ultra-low dielectric loss and supports high-frequency operation up to 77 GHz, fully meeting the performance requirements of high-speed RF microwave PCB devices. The material retains stable mechanical properties under variable temperature conditions, supporting reliable stripline circuit production and durable multilayer PCB construction. Its universal mechanical compatibility allows seamless combination with different dielectric constant materials and TG170 FR4 substrates, which is the core competitive advantage of this custom RO3003 and FR4 hybrid high frequency PCB for multi-scenario RF applications.

Rogers RO3003 high frequency PCB material provides stable dielectric constant performance across varying temperature and frequency ranges, making it ideal for manufacturing key RF PCB components including band pass filters, microstrip patch antennas, and voltage controlled oscillators. Its low in-plane thermal expansion coefficient matches copper foil perfectly, greatly improving surface mount assembly reliability for finished immersion silver PCBs. This effectively prevents performance fluctuations caused by ambient temperature changes, delivering excellent long-term dimensional and electrical stability for industrial high frequency circuit boards.

4.4 Typical Application Fields

Rogers RO3000 series high frequency lamnates are widely applied in high-end commercial and industrial high frequency PCB projects. Common application scenarios include automotive radar PCB, GPS satellite antenna PCB, cellular communication power amplifier PCB, wireless patch antenna PCB, direct broadcast satellite equipment circuit boards, cable system datalink PCBs, remote meter reading circuit boards, and industrial power backplane PCBs.

 

5. Datasheet

Property Category	Property Name	RO3003 Typical Value	Units	Test Conditions	Test Method
Electrical Properties	Dielectric Constant (process)	3.00 ± 0.04	-	23°C, 10 GHz	IPC TM-650 2.5.5.5
	Dielectric Constant (design)	3.00	-	8 GHz - 40 GHz	Differential Phase Length
	Dissipation Factor	0.0010	-	23°C, 10 GHz	IPC TM-650 2.5.5.5
	Thermal Coefficient of Dielectric Constant	-3	ppm/°C	-50 to 150°C, 10 GHz	IPC TM-650 2.5.5.5
	Volume Resistivity	107	MΩ-cm	Condition A	IPC TM-650 2.5.17.1
	Surface Resistivity	107	MΩ	Condition A	IPC TM-650 2.5.17.1
Thermal Properties	Decomposition Temperature (Td)	500	°C (TGA)	-	ASTM D3850
	Coefficient of Thermal Expansion - x	17	ppm/°C	-55 to 288°C, 23°C/ 50% RH	IPC TM-650 2.4.41
	Coefficient of Thermal Expansion - y	16	ppm/°C	-55 to 288°C, 23°C/ 50% RH	IPC TM-650 2.4.41
	Coefficient of Thermal Expansion - z	25	ppm/°C	-55 to 288°C, 23°C/ 50% RH	IPC TM-650 2.4.41
	Thermal Conductivity	0.50	W/(m·K)	50°C	ASTM D5470
Mechanical Properties	Copper Peel Strength	12.7	lbs/in	1 oz. EDC After Solder Float	IPC TM-650 2.4.8
	Young’s Modulus	930 / 823	MPa	23°C	ASTM D638
	Dimensional Stability (MD, CMD)	-0.06 / 0.07	mm/m	Condition A	IPC TM-650 2.2.4
Physical Properties	Flammability	V-0	-	-	UL 94
	Moisture Absorption	0.04	%	D48/50	IPC TM-650 2.6.2.1
	Density	2.1	g/cm³	23°C	ASTM D792
	Specific Heat Capacity	0.9	J/g/K	-	Calculated
	Lead Free Process Compatible	Yes	-	-	-

 

6. Summary

This custom 4-Layer 0.8mm Rogers RO3003 hybrid high frequency PCB integrates premium Rogers RO3003 ceramic-filled PTFE high-performance laminate and industrial-grade TG170 FR4 dielectric material, combining the ultra-low loss high-frequency advantages of genuine Rogers RO3003 PCB and the cost-effectiveness and rigidity of standard FR4 PCB. Featuring 1oz outer layer copper, 0.5oz inner layer copper, precision immersion silver surface finishing, and custom non-silk-screen solder mask design, this Rogers multilayer RF hybrid PCB offers high dimensional accuracy, superior thermal stability, and minimal signal transmission loss. Powered by the reliable mechanical and electrical properties of Rogers RO3000 series CCL materials, this high frequency PCB is perfectly optimized for automotive radar systems, RF microwave communication devices, wireless antenna equipment, and other high-precision electronic applications, supporting stable mass production and long-term reliable operation of terminal products.

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