2. Key Benefits

1. Low dielectric constant and ultra-low dissipation factor for high-frequency signal transmission
2. Thermoset hydrocarbon ceramic resin system delivers superior heat resistance and process adaptability
3. Excellent TCDK performance ensures stable dielectric constant under temperature fluctuation
4. Copper-matched X/Y-axis CTE and low Z-axis expansion guarantee dimensional stability and via reliability
5. High Tg over 280°C maintains structural integrity during multiple lamination and high-temperature assembly
6. High thermal conductivity supports high-power circuit heat dissipation requirements
7. Low moisture absorption ensures stable electrical performance in complex working environments
8. Available with ED copper or reverse treated RTF copper foil for lower conductor loss and better PIM performance
9. Radiation resistance and low outgassing properties meet aerospace vacuum application standards
10. Cost-effective mass producible alternative to foreign high-frequency laminate counterparts

3. PCB Construction Details

Item	Specification
Base Material	WL-CT440 (copper clad laminate)
Layer Count	2-Layer Rigid PCB
Board Dimensions	89mm x 63.5mm (1PCS), Tolerance +/- 0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.2mm
Blind Vias	Not Allowed
Finished Board Thickness	0.8mm
Finished Outer Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Pre-Shipment Test	100% Electrical Test

4. PCB Stackup Structure

This 2-layer rigid WL-CT440 high frequency PCB adopts standard symmetrical stackup design:

1. Copper_layer_1 – 35 μm
2. WL-CT440 Core – 0.762 mm (30mil)
3. Copper_layer_2 – 35 μm

5. PCB Statistics

1. Components: 37
2. Total Pads: 49
3. Thru Hole Pads: 27
4. Top SMT Pads: 22
5. Bottom SMT Pads: 0
6. Vias: 31
7. Nets: 2

6. Artwork & Quality Standard

1. Type of Artwork Supplied: Gerber RS-274-X for precise WL-CT440 high frequency PCB fabrication
2. Accepted Quality Standard: IPC-Class-2, ensuring high reliability of microwave WL-CT440 PCB

7. Global Availability

This custom 2-layer WL-CT440 high frequency PCB supports worldwide supply and international shipping, providing reliable microwave circuit solutions for global aerospace research institutes, airborne radar manufacturers, phased array antenna enterprises, satellite communication projects and RF power amplifier design teams.

8. Typical Applications

1. Aerospace equipment, airborne devices, cabin and aviation electronic systems
2. Microwave circuits, general antennas and phase-sensitive antenna designs
3. Early warning radar, airborne radar and various microwave radar equipment
4. Phased array antennas, beam forming and wave network systems
5. Satellite communication, navigation system high-frequency modules
6. RF power amplifier and high-power wireless circuit boards

9. WL-CT440 Copper Clad Laminate Knowledge

9.1 Product Overview

WL-CT440 is a mainstream high-frequency copper clad laminate belonging to Wangling WL-CT series, featuring organic polymer ceramic fiberglass reinforced structure and thermosetting hydrocarbon resin substrate. This low-loss copper clad laminate is specially developed for high-frequency microwave PCB production, serving as a perfect domestic substitute for imported high-frequency laminates. It supports multiple customizable Dk values including 3.00, 3.30, 3.38, 3.48, 4.10 and 6.15, fully meeting diversified design requirements of aerospace and radar high frequency PCB.

The WL-CT440 copper clad laminate can be matched with standard ED copper foil or reverse treated RTF copper foil for WL-CT440 high frequency PCB production. RTF copper foil effectively optimizes PIM performance, reduces conductor loss and insertion loss of microwave circuits; the professional back glue treatment enhances copper foil adhesion, ensuring long-term stable operation of the finished PCB. Additionally, this material can be compounded with aluminum substrates to produce customized high-frequency aluminum-based PCB for special high-power microwave scenarios.

9.2 Electrical Performance & Frequency Stability

WL-CT440 RF circuit board boasts excellent and stable electrical performance at microwave frequencies. The WL-CT440 copper clad laminate features a fixed Dk of 4.1 and ultra-low Df of 0.004 at 10 GHz, with a superior TCDK value of -21 ppm/°C, realizing ultra-stable dielectric constant in variable temperature environments. Its low moisture absorption property avoids electrical parameter drift, ensuring consistent signal integrity and reliable transmission performance for aerospace radar and satellite communication microwave PCB circuits.

9.3 Thermal & Mechanical Stability

Supported by the high Tg (over 280°C) thermoset resin system, the WL-CT440 copper clad laminate enables the finished 0.8mm immersion gold high frequency PCB to maintain excellent dimensional stability during multiple lamination and high-temperature assembly processes. Its copper-matched X/Y-axis CTE and low Z-axis thermal expansion greatly reduce thermal stress, ensuring reliable plated through-hole quality. With a high thermal conductivity of 0.66 W/MK, this WL-CT440 microwave PCB delivers outstanding heat dissipation, perfectly adapting to high-power RF amplifier circuit applications.

9.4 Process Compatibility & Customization

Different from hard-to-process PTFE microwave substrates, the WL-CT440 copper clad laminate supports full conventional FR4 fabrication processes, featuring excellent machinability in fine line routing and dense hole processing. The 2-layer WL-CT440 high frequency PCB is compatible with multi-layer lamination and backplane production. Meanwhile, the material’s inherent radiation resistance and low outgassing properties fully meet aerospace vacuum environment standards, making it a preferred substrate for high-reliability aviation and satellite microwave PCB projects.

9.5 Core Material Advantages

1. Stable low Dk and low Df for high-frequency microwave circuit requirements
2. Thermoset hydrocarbon ceramic system with outstanding heat resistance and processability
3. Minor dielectric constant variation against temperature change for stable broadband performance
4. Copper-matched CTE design improves yield and long-term structural reliability
5. High Tg structure supports multiple pressing and high-temperature assembly processes
6. Higher thermal conductivity than ordinary thermoplastic substrates for high-power scenarios
7. Radiation resistant and low outgassing, fully qualified for aerospace grade usage
8. Compatible with ED / RTF copper foil options to optimize PIM and insertion loss performance
9. High cost-performance and stable mass supply to replace imported high-frequency laminates

10. Datasheet

Parameter Name	Test Conditions	Units	Typical Value
Dielectric Constant (Typical Value)	10GHz	/	4.10
Dielectric Constant (Design Value)	10GHz	/	4.38
Dielectric Constant Tolerance	/	/	±0.08
Dissipation Factor (Typical Value)	2GHz	/	0.0040
Dissipation Factor (Typical Value)	10GHz	/	0.0050
Dissipation Factor (Typical Value)	20GHz	/	/
Temperature Coefficient of Dielectric Constant	-55℃ ~ 150℃	PPM/℃	-21
Peel Strength	1 OZ ED Copper Foil	N/mm	1.0
Peel Strength	1 OZ RTF Copper Foil	N/mm	Not Compatible
Volume Resistivity	Normal State	MΩ.cm	1 × 10^9
Surface Resistance	Normal State	MΩ	5 × 10^7
Electric Strength (Z-direction)	5KW, 500V/s	KV/mm	27
Breakdown Voltage (XY-direction)	5KW, 500V/s	KV	25
Coefficient of Thermal Expansion (X, Y-direction)	-55℃ ~ 288℃	ppm/℃	14, 18
Coefficient of Thermal Expansion (Z-direction)	-55℃ ~ 288℃	ppm/℃	35
Thermal Stress	288℃, 10s, 3 cycles	/	No Delamination
Water Absorption	23.5±2℃, 24 hours	%	0.12
Density	Normal Temperature	g/cm3	2.00
Long-term Operating Temperature	High and Low Temperature Chamber	℃	-55～+260
Thermal Conductivity	Z-direction	W/(M.K)	0.66
PIM Value	With RTF Copper Foil	dBc	Not Applicable
Flame Retardancy	UL-94	Rating	V-0
Glass Transition Temperature (Tg)	Standard Test	℃	>280℃
Thermal Decomposition Temperature (Td)	Onset Value	℃	402
Halogen Content	--	--	Halogenated
Material Composition	--	--	Hydrocarbon + Ceramic + Glass Fiber Cloth

 

11. Summary

WL-CT440 2-Layer 0.8mm immersion gold PCB is a cost-effective and high-reliability microwave circuit solution based on Wangling hydrocarbon ceramic fiberglass copper clad laminate. Featuring stable low loss, excellent temperature coefficient of dielectric constant, copper-matched thermal expansion and over 280°C high Tg, it supports standard FR4 manufacturing workflow and multi-layer lamination. With radiation resistance and low outgassing capability, WL-CT440 IPC-Class-2 certified PCB is perfectly suited for aerospace aviation equipment, phased array antennas, satellite navigation, airborne radar and RF power amplifier high-frequency electronic projects.

Tags：WL-CT440 2-Layer PCB, WL-CT440 High Frequency PCB, Immersion Gold Microwave PCB, Wangling WL-CT440 copper clad laminate,  Low Loss RF Circuit Board, Aerospace Radar PCB, Phased Array Antenna PCB,  High Power Amplifier PCB, FR4 Processable PCB, Low TCDK Microwave PCB