2. Key Benefits

• High fixed dielectric constant with ultra-low and stable loss, perfect for miniaturized antenna and resonant circuit design
• Fiberglass-free structure ensures even electrical performance and avoids weave effect signal interference
• Excellent radiation resistance and low outgassing property suitable for aerospace, satellite and defense projects
• Superior machinability supports drilling, turning, grinding and etching with reliable copper adhesion strength
• Thermoplastic processing characteristic brings higher production yield and lower cost than alumina and AlN ceramic substrates
• Wide long-term operating temperature range from -100℃ to +150℃ with stable low-temperature tolerance
• Multiple customizable dielectric constant options available from 3.0 to 25 for diverse high-frequency design needs
• Strict thermal processing stability meets special soldering and assembly specification requirements

 

3. PCB Construction Details

 

Item	Specification
Base Material	TP1600 (Copper Clad Laminate)
Layer Count	2-Layer Rigid PCB
Board Dimensions	75mm x 68mm (1PCS), Tolerance +/- 0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.2mm
Blind Vias	Not Allowed
Finished Board Thickness	0.9mm
Finished Outer Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Pure Gold Plating
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Green
Bottom Solder Mask	Green
Pre-Shipment Test	100% Electrical Test

 

4. PCB Stackup Structure

This 2-layer rigid TP1600 high frequency PCB adopts standard symmetrical stackup design:

• Copper_layer_1 – 35 μm
• TP1600 Core – 0.8 mm (31.49mil)
• Copper_layer_2 – 35 μm

 

5. PCB Statistics

• Components: 34
• Total Pads: 56
• Thru Hole Pads: 29
• Top SMT Pads: 27
• Bottom SMT Pads: 0
• Vias: 34
• Nets: 2

 

6. Artwork & Quality Standard

• Type of Artwork Supplied: Gerber RS-274-X
• Accepted Quality Standard: IPC-Class-2

 

7. Global Availability

Wangling customized TP1600 2-layer high frequency PCB supports worldwide supply and global delivery services, widely available for procurement by aerospace institutes, defense electronic manufacturers, satellite navigation enterprises and microwave RF design teams globally.

 

8. Typical Applications

• Miniaturized high-frequency antennas, RF microwave filters, couplers and resonant cavity components
• Aerospace, defense industry, satellite payload and Beidou navigation system circuit modules
• Missile-borne equipment, fuze electronic units and high-stability high-frequency sensor modules
• Special microwave circuits requiring high Dk, low loss and radiation-resistant performance

 

9. TP1600 Copper Clad Laminate Knowledge

9.1 Product Overview

TP1600 is a professional thermoplastic microwave Copper Clad Laminate belonging to the TP material series, adopting ceramic-filled polyphenylene oxide (PPO) resin matrix without fiberglass reinforcement. Manufactured via exclusive compression molding process, its nominal dielectric constant reaches 16.0 by adjusting the proportion of ceramic powder and PPO resin.

TP series materials cover rich customizable Dk range from 3.0 to 25, including mainstream specifications such as 4.4, 6.15, 9.6, 10.2 and 16.0. The material is divided into three types: bare TP substrate without copper foil, single-sided copper-clad TP-1, and double-sided copper-clad TP-2. It features stable dielectric performance, reliable mechanical structure and flexible thickness customization starting from 0.5mm.

 

 

9.2 Electrical Performance & Frequency Stability

TP1600 high frequency circuit laminate maintains stable high dielectric constant and ultra-low dissipation factor across high-frequency bands. Its dielectric property changes slightly within 10 GHz, ensuring consistent signal transmission performance. The temperature coefficient of dielectric constant stays at a low level, providing stable electrical parameters under variable temperature conditions. Without fiberglass woven structure, TP1600 material achieves uniform dielectric distribution and effectively eliminates electromagnetic weave effect in microwave circuit design.

 

9.3 Thermal & Mechanical Stability

The long-term reliable operating temperature of TP1600 ranges from -100℃ to +150℃, with outstanding low-temperature resistance. When the temperature exceeds 180℃, the material may suffer deformation, copper foil peeling and obvious electrical performance deviation. Its Z-axis CTE remains at a stable 45ppm/°C, ensuring structural stability during conventional processing. Compared with vacuum-coated ceramic substrates, it possesses stronger copper foil and medium adhesion, greatly improving finished board reliability.

 

9.4 Process Compatibility & Application Limitation

TP1600 high frequency laminate features excellent machinability and can be processed by drilling, turning, grinding, shearing and engraving. As a thermoplastic material, it delivers higher production yield and lower processing cost than alumina and AlN ceramic substrates.

It is not recommended for standard multilayer lamination; if multilayer design is required, only low-Tg prepregs can be used after feasibility evaluation. In terms of soldering process, wave soldering is prohibited, reflow soldering maximum temperature shall not exceed 200℃, and constant-temperature manual soldering is the most applicable method to avoid thermal impact deformation and performance deterioration.

 

9.5 Core Material Advantages

• Fixed high Dk 16.0 ± 0.32 and ultra-low Df 0.0012 for high-frequency miniaturized circuit design
• Low TcDk value ensures stable dielectric constant under temperature fluctuation
• Fiberglass-free smooth structure avoids microwave weave effect and improves circuit consistency
• Radiation-resistant and low outgassing, fully adapted to aerospace and high-reliability military scenarios
• Rich customizable dielectric constant and thickness options meet diverse high-frequency design requirements
• Easy mechanical processing and reliable copper adhesion superior to traditional ceramic substrates
• Cost-effective thermoplastic forming process with high yield and lower manufacturing cost

 

10.Datasheet

Parameter Name	Test Conditions	Units	Typical Value
Dielectric Constant (Typical Value)	5GHz	/	16.0 ± 0.4
Dielectric Constant Tolerance	--	/	±2.5%
Dissipation Factor	5GHz	/	0.0015
Temperature Coefficient of Dielectric Constant	-55℃ ~ 150℃	PPM/℃	-40
Peel Strength (1 OZ, Normal State)	Normal State	N/mm	>0.6
Peel Strength (1 OZ, After Alternating Damp Heat)	After Alternating Damp Heat Test	N/mm	>0.4
Volume Resistivity	Normal State, 500V	MΩ.cm	>1 × 10^9
Surface Resistance	Normal State, 500V	MΩ	>1 × 10^7
Coefficient of Thermal Expansion (X, Y, Z direction)	-55℃ ~ 150℃	PPM/℃	40, 40, 50
Water Absorption	20±2℃, 24 hours	%	≤0.01
Long-term Operating Temperature	High and Low Temperature Chamber	℃	-100℃ ~ 150℃
Density	--	g/cm3	2.76
Thermal Conductivity	--	W/(M.K)	0.80
Material Composition	--	--	Polyphenylene Oxide (PPO), Ceramic, Matched with ED Copper Foil

 

11. Summary

TP1600 2-Layer 0.9mm high frequency PCB is a high-reliability pure gold plating microwave circuit board built on professional ceramic-filled PPO thermoplastic Copper Clad Laminate. With high stable dielectric constant, ultra-low dissipation loss, radiation resistance and excellent low-temperature adaptability, it adopts fiberglass-free smooth structure to eliminate weave effect interference. Restricted by professional thermoplastic processing specifications, this IPC-Class-2 certified PCB is the ideal solution for miniaturized antennas, microwave filters, aerospace navigation, Beidou satellite and defense electronic high-frequency sensor modules.

 

Tags:TP1600 PCB, TP1600 High Frequency PCB, Pure Gold Plating Microwave PCB, TP1600 Copper Clad Laminate, Ceramic-Filled PPO PCB, High Dk PCB, Low Loss Microwave Board, Aerospace Navigation PCB, Beidou Satellite High Frequency PCB, Miniaturized Antenna RF PCB, Defense Electronic Microwave PCB