2. Key Benefits

Stable low dielectric constant for consistent high-frequency signal transmission

Ultra-low dissipation factor minimizes microwave signal loss

Extremely low moisture absorption avoids performance drift in changing environments

High dielectric breakdown strength ensures circuit safety and reliability

Excellent copper peel strength guarantees long-term bonding stability

Well-controlled X-Y and Z-axis CTE reduces thermal stress and board deformation

Compliant with standard PTFE processing for easy fabrication and cost efficiency

UL 94 V-0 flame retardant rating improves overall application safety

 

3. PCB Construction Details

Item	Specification
Base Material	Taconic TLX-9
Layer Count	2-Layer Rigid PCB
Board Dimensions	91.6mm x 45.3mm (1PCS), Tolerance +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.3mm
Blind Vias	Not Allowed
Finished Board Thickness	0.3mm
Finished Outer Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	EPIG (Nickel-Free)
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Pre-Shipment Test	100% Electrical Test

 

4. PCB Stackup Structure

This 2-layer rigid Taconic TLX-9 PCB adopts standard symmetrical stackup design:

• Copper_layer_1 – 35 μm
• Taconic TLX-9 Core (Copper Clad Laminate) – 0.254 mm (10mil)
• Copper_layer_2 – 35 μm

 

5. PCB Statistics

• Components: 29
• Total Pads: 45
• Thru Hole Pads: 24
• Top SMT Pads: 21
• Bottom SMT Pads: 0
• Vias: 19
• Nets: 2

 

6. Artwork & Quality Standard

• Type of Artwork Supplied: Gerber RS-274-X
• Accepted Quality Standard: IPC-Class-2, Tested per IPC-TM 650

 

7. Global Availability

This custom Taconic TLX-9 2-layer high frequency PCB is available for worldwide supply and shipment, supporting global procurement for microwave communication manufacturers, RF component designers and wireless infrastructure projects.

 

8. Typical Applications

• LNAs, LNBs and LNCs microwave receiver modules
• PCS/PCN large format communication antennas
• High power RF amplifier circuit boards
• Microwave passive components and RF devices
• Phased array antennas and radar system circuits
• Microwave test equipment and mobile communication systems

 

9. Taconic TLX-9 Copper Clad Laminate Knowledge

9.1 Product Overview

Taconic TLX-9 is a high-performance PTFE woven glass composite Copper Clad Laminate, developed with over 35 years of professional PTFE coating technology from Taconic. It delivers exceptionally stable electrical and mechanical properties, with a controllable dielectric constant ranging from 2.45 to 2.65 and tight tolerance of ±0.04.

Taconic TLX-9 microwave material can be processed with conventional PTFE fabrication methods including shearing, drilling, milling and plating. It features superior dimensional stability and negligible moisture absorption throughout production, making it a reliable choice for mass production of high-frequency microwave PCBs. TLX-9 can be supplied with single-sided or double-sided copper cladding in 1/2 oz, 1 oz or 2 oz options for flexible design customization.

 

 

9.2 Electrical Performance & Frequency Stability

Taconic TLX-9 circuit material maintains steady dielectric constant and low dissipation factor over a broad frequency and temperature spectrum. It ensures low signal attenuation and outstanding signal integrity for microwave applications. All batches are tested according to IPC-TM 650 standards, with compliance test data provided for each shipment to guarantee consistent performance.

 

9.3 Thermal & Mechanical Stability

Boasting well-balanced CTE performance, TLX-9 PCB material features low X-Y thermal expansion and controlled Z-axis CTE, effectively reducing internal thermal stress and preventing board warpage or delamination. It provides high dielectric breakdown strength, excellent flexural strength and stable copper peel strength, ensuring structural reliability during high-temperature processing and long-term service. Taconic TLX-9 material also achieves UL 94 V-0 flammability certification for enhanced safety in commercial and industrial applications.

 

9.4 Process Compatibility & Customization

Taconic TLX-9 high-frequency laminate fully adapts to standard PTFE and fiberglass PCB manufacturing workflows without requiring complex special treatment. It supports multiple copper foil weight options and customized cladding solutions, offering great design flexibility for microwave engineers. Its low moisture absorption and stable dimensional performance further improve production consistency and finished product yield.

 

9.5 Core Material Advantages

• Precision-controlled dielectric constant within 2.45–2.65 range
• Ultra-low dissipation factor for low-loss microwave transmission
• Near-zero moisture absorption for stable environmental adaptability
• High mechanical strength and reliable copper bonding performance
• Balanced CTE structure for excellent thermal dimensional stability
• Standard PTFE process compatible for easy fabrication
• UL 94 V-0 flame retardant grade for safer application deployment

 

10.Datasheet

Property	Test Method	Units	Typical Value
Dielectric Constant @ 10 GHz	IPC-TM 650 2.5.5.5	--	2.50
Dissipation Factor @ 10 GHz	IPC-TM 650 2.5.5.5	--	0.0019
Moisture Absorption	IPC-TM 650 2.6.2.1	%	<0.02
Dielectric Breakdown	IPC-TM 650 2.5.6	kV	>60
Volume Resistivity	IPC-TM 650 2.5.17.1	Mohm/cm	10^7
Surface Resistivity	IPC-TM 650 2.5.17.1	Mohm	10^7
Arc Resistance	IPC-TM 650 2.5.1	seconds	>180
Flexural Strength (Lengthwise)	IPC-TM 650 2.4.4	lbs./in. (N/mm²)	>23,000 (>159)
Flexural Strength (Crosswise)	IPC-TM 650 2.4.4	lbs./in. (N/mm²)	>19,000 (>131)
Peel Strength (1oz copper)	IPC-TM 650 2.4.8	lbs./linear in. (N/mm)	12.0 (2.1)
Thermal Conductivity	ASTM F 433	W/m/K	0.19
Coefficient of Thermal Expansion (x-y direction)	ASTM D 3386 (TMA)	ppm/°C	9-12
Coefficient of Thermal Expansion (z direction)	ASTM D 3386 (TMA)	ppm/°C	130-145
UL-94 Flammability Rating	UL-94	--	V-0

 

11. Summary

Taconic  TLX-9 2-Layer PCB is a high-reliability microwave circuit board built on premium PTFE woven glass composite Copper Clad Laminate. With stable low dielectric property, ultra-low dissipation factor, minimal moisture absorption and well-controlled CTE performance, this 0.3mm nickel-free EPIG finished PCB meets strict IPC-Class-2 manufacturing criteria. It is perfectly suited for LNAs, LNBs, high power amplifiers, PCS antennas and various RF passive components, delivering consistent electrical stability and long-term mechanical reliability for global microwave and wireless communication projects.

 

Tags: Taconic TLX-9 PCB, 2-Layer 0.3mm High Frequency PCB, Nickel-Free EPIG PCB, PTFE Woven Glass Microwave PCB, Low Loss RF Circuit Board, IPC Class 2 Taconic PCB, LNB LNA Microwave PCB, PCS PCN Antenna PCB, High Power Amplifier PCB, Microwave Passive Component PCB