2. RT/duroid 6006 PCB Material Features

1. Premium Material Construction: High-performance ceramic-PTFE composite dielectric structure for microwave-grade circuit applications
2. Stable Dielectric Constant: DK 6.15 +/- 0.15 tested at 10 GHz / 23°C, supporting circuit miniaturization design
3. Ultra-Low Dissipation Factor: Df 0.0027 at 10 GHz / 23°C to minimize microwave signal attenuation
4. Extreme Thermal Stability: Thermal decomposition temperature TDA higher than 500°C
5. Low Moisture Absorption Rate: Only 0.05%, eliminating electrical performance drift caused by humidity changes
6. Precise CTE Parameters: X-axis 47 ppm/°C, Y-axis 34 ppm/°C, Z-axis 117 ppm/°C for controllable thermal expansion
7. Dual Foil Cladding Option: Compatible with standard and reverse-treated electrodeposited copper foil for diverse design demands
8. Strict Dk and thickness tolerance control for consistent batch production performance

3. Key Product Benefits

1. High dielectric constant effectively reduces circuit board footprint, supporting compact and miniaturized microwave device design
2. Ultra-low loss dielectric properties ensure minimal signal attenuation, ideal for X-band and below microwave frequency operation
3. Strict dielectric constant and dimensional thickness control deliver highly consistent and repeatable circuit electrical performance
4. Extremely low moisture absorption avoids signal loss fluctuation and parameter deviation in humid operating conditions
5. Optimized Z-axis expansion performance guarantees reliable plated through-hole structure for multilayer microwave PCB construction
6. Excellent thermo-mechanical stability prevents board deformation and performance degradation during processing and long-term operation
7. Flexible copper foil cladding and thickness specifications meet customized microwave circuit design and production requirements

4. PCB Construction Details

Item	Specification
Base Material	Rogers RT/duroid 6006
Layer Count	2-Layer Rigid PCB
Board Dimensions	134.8mm x 78.65mm (2 Types, 2PCS), Tolerance: +/- 0.15mm
Minimum Trace / Space	5/6 mils
Minimum Hole Size	0.3mm
Blind Vias	Not Allowed
Finished Board Thickness	0.4mm
Finished Outer Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Pre-Shipment Test	100% Electrical Test

5. PCB Stackup Structure

This 2-layer rigid RT/duroid 6006 high frequency PCB adopts a flat and stable composite stackup structure with precise industrial-standard thickness configuration:

1. Copper Layer 1: 35 μm
2. Rogers RT/duroid 6006 Core Dielectric: 0.254mm (10mil)
3. Copper Layer 2: 35 μm

6. PCB Statistical Parameters

1. Total Components: 46
2. Total Pads: 64
3. Thru Hole Pads: 26
4. Top SMT Pads: 38
5. Bottom SMT Pads: 0
6. Total Vias: 41
7. Total Nets: 2

7. Manufacturing Artwork & Quality Standard

1. Artwork Format: Gerber RS-274-X
2. Industry Quality Standard: IPC-Class-2

8. Global Availability

This custom Rogers RT/duroid 6006 2-layer microwave PCB supports worldwide supply and global shipping services. It is widely available for procurement by microwave communication enterprises, aerospace equipment manufacturers and high-frequency RF circuit design teams across the globe.

9. Typical Applications

1. Wireless antenna systems: High-performance patch antenna devices
2. Aerospace communication: Professional satellite communication system circuits
3. RF power devices: Microwave power amplifier circuit boards
4. Aviation safety equipment: Aircraft collision avoidance system modules
5. Radar detection devices: Ground radar warning system microwave circuits

10. Rogers RT/duroid 6006 Copper Clad Laminate Knowledge

10.1 Product Overview

Rogers RT/duroid 6006 laminate is a professional ceramic-PTFE composite dielectric material tailored for high-frequency and microwave circuit applications. Featuring a high and tightly controlled dielectric constant, RT/duroid 6006 material enables effective miniaturization of microwave circuit dimensions while maintaining ultra-low signal loss characteristics. It supports multiple standard dielectric thickness specifications and dual-sided copper cladding with optional copper foil types, providing extreme flexibility for customized microwave PCB design.

10.2 Dielectric Performance & Frequency Stability

RT/duroid 6006 circuit material delivers stable electrical performance across microwave frequency bands. With a Dk value of 6.15±0.15 and an ultra-low Df of 0.0027 at 10 GHz, it ensures minimal signal attenuation and excellent signal integrity for X-band and lower-frequency microwave operation. Benefiting from strict dielectric constant and thickness tolerance control, RT/duroid 6006 material achieves highly consistent electrical repeatability in batch production, avoiding performance differences between individual circuit boards.

10.3 Thermo-Mechanical Stability

RT/duroid 6006 high-frequency laminate features reliable thermal stability with a thermal decomposition temperature exceeding 500°C, adapting to high-temperature PCB processing and long-term high-power operation. Its low moisture absorption rate of 0.05% prevents electrical parameter drift caused by environmental humidity changes. Matched with professional multi-axis CTE parameters, the material maintains stable structural performance and ensures reliable plated through-hole quality for multilayer microwave PCB structures.

10.4 Fabrication Flexibility & Customization

RT/duroid 6006 microwave material supports standard microwave PCB fabrication processes, compatible with both standard and reverse-treated electrodeposited copper foil cladding. It provides multiple optional dielectric thicknesses and copper foil weight specifications, allowing designers to flexibly adjust circuit structure according to frequency and power demands. The material features excellent processing adaptability and stable usability, greatly improving production yield for high-precision microwave circuits.

10.5 Core Material Advantages

1. High dielectric constant supports compact circuit design and equipment miniaturization
2. Ultra-low dissipation factor guarantees low-loss transmission for microwave signals
3. Precise Dk and thickness tolerance ensures consistent batch circuit performance
4. Superior humidity resistance stabilizes electrical performance in complex environments
5. Reliable thermal mechanical properties support multilayer board fabrication
6. Diversified copper cladding and thickness options meet customized design needs

10.6 Material Application Scenarios

1. High-precision patch antenna and microwave antenna systems
2. Satellite communication transceiver circuit modules
3. Microwave power amplifier and RF signal processing circuits
4. Aviation collision avoidance and safety monitoring equipment
5. Ground radar warning and microwave detection systems

11. Datasheet

Property	Typical Values	Direction	Units	Test Conditions	Test Method
Dielectric Constant εr (Process)	6.15 ± 0.15	Z	--	10 GHz, 23°C	IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant εr (Design)	6.45	Z	--	8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor, tan δ	0.0027	Z	--	10 GHz/A	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-410	Z	ppm/°C	-50 to 170°C	IPC-TM-650 2.5.5.5
Surface Resistivity	7 × 10^7	--	Mohm	A	IPC 2.5.17.1
Volume Resistivity	2 × 10^7	--	Mohm•cm	A	IPC 2.5.17.1
Tensile Young’s Modulus	627 (91)	X	MPa (kpsi)	A	ASTM D638 (0.1/min. strain rate)
Tensile Young’s Modulus	517 (75)	Y	MPa (kpsi)	A	ASTM D638 (0.1/min. strain rate)
Tensile Ultimate Stress	20 (2.8)	X	MPa (kpsi)	A	ASTM D638
Tensile Ultimate Stress	17 (2.5)	Y	MPa (kpsi)	A	ASTM D638
Tensile Ultimate Strain	12 to 13	X	%	A	ASTM D638
Tensile Ultimate Strain	4 to 6	Y	%	A	ASTM D638
Compressive Young’s Modulus	1069 (155)	Z	MPa (kpsi)	A	ASTM D695 (0.05/min. strain rate)
Compressive Ultimate Stress	54 (7.9)	Z	MPa (kpsi)	A	ASTM D695
Compressive Ultimate Strain	33	Z	%	--	ASTM D695
Flexural Modulus	2634 (382)	X	MPa (kpsi)	A	ASTM D790
Flexural Modulus	1951 (283)	Y	MPa (kpsi)	A	ASTM D790
Flexural Ultimate Stress	38 (5.5)	X,Y	MPa (kpsi)	A	ASTM D790
Deformation under Load	0.33	Z	%	24 hr / 50°C / 7MPa	ASTM D261
Deformation under Load	2.10	Z	%	24 hr / 150°C / 7 MPa	ASTM D261
Moisture Absorption	0.05	--	%	D48/50°C, 0.050” (1.27mm) thick	IPC-TM-650, 2.6.2.1
Density	2.7	--	g/cm3	--	ASTM D792
Thermal Conductivity	0.49	--	W/m/°K	80°C	ASTM C518
Coefficient of Thermal Expansion	47	X	ppm/°C	23°C / 50% RH	IPC-TM-650 2.4.41
Coefficient of Thermal Expansion	34, 117	Y,Z	ppm/°C	23°C / 50% RH	IPC-TM-650 2.4.41
Decomposition Temperature (Td)	500	--	°C	TGA	ASTM D3850
Specific Heat	0.97 (0.231)	--	J/g/K (BTU/lb/°F)	--	Calculated
Copper Peel Strength	14.3 (2.5)	--	pli (N/mm)	after solder float	IPC-TM-650 2.4.8
Flammability Rating	V-0	--	--	--	UL94
Lead-Free Process Compatible	Yes	--	--	--	--

12. Summary

Rogers RT/duroid 6006 2-Layer microwave PCB is a high-stability, miniaturized circuit solution for professional microwave and RF applications. Adopting premium ceramic-PTFE composite dielectric material, it features high controllable dielectric constant, ultra-low signal loss, low moisture absorption and excellent thermo-mechanical stability. With 0.4mm board thickness, immersion silver surface finish and strict IPC-Class-2 manufacturing standards, this Rogers PCB delivers consistent and reliable performance for patch antennas, satellite communication systems, power amplifiers and aviation radar devices, serving as an ideal high-frequency circuit substrate for industrial and aerospace microwave equipment.

Tags：Rogers RT/duroid 6006 PCB, 2-Layer 0.4mm Microwave PCB, Immersion Silver High Frequency PCB, Low Loss Ceramic PTFE PCB, High DK Microwave Circuit Board, IPC Class 2 RF PCB, Patch Antenna PCB, Satellite Communication PCB, Radar Warning System PCB, X-Band Low Loss PCB