2. Core PCB Material Features

1. Stable Dielectric Constant: DK 3.3 at 10 GHz operating frequency
2. Ultra-Low Dissipation Factor: Df 0.0025 at 10 GHz for minimal signal attenuation
3. Copper-Matched CTE Parameters: X-axis 13 ppm/°C, Y-axis 11 ppm/°C, Z-axis 37 ppm/°C
4. Superior Thermal Resistance: Glass transition temperature Tg higher than 280°C
5. Low Moisture Absorption Rate: Only 0.02%, ensuring stable electrical performance in humid environments
6. Excellent Thermal Conductivity: 0.6 W/mK for efficient heat dissipation
7. Low PIM performance, reaching better than –155 dBC under standard test conditions
8. Dimensional stability below 0.05%, supporting large-panel high-yield production

3. Key Product Benefits

1. Low dielectric loss, stable DK value and excellent low-PIM characteristics support diverse high-frequency wireless application scenarios
2. Advanced thermoset resin structure enables full compatibility with standard FR-4 PCB fabrication and lead-free high-temperature processing
3. Outstanding dimensional stability effectively improves production yield for large-format PCB panels
4. Uniform mechanical properties maintain structural integrity during manufacturing, handling and long-term service
5. High thermal conductivity enhances heat dissipation efficiency and improves circuit power-handling capability
6. Cost-effective alternative to traditional PTFE laminates, balancing premium antenna performance and competitive manufacturing costs
7. Halogen-free composition meets international environmental protection requirements for green electronic manufacturing

4. PCB Construction Details

Item	Specification
Base Material	Rogers RO4533
Layer Count	2-Layer Rigid PCB
Board Dimensions	123.5mm x 46mm (1PCS), Tolerance: +/- 0.15mm
Minimum Trace / Space	4/5 mils
Minimum Hole Size	0.25mm
Blind Vias	Not Allowed
Finished Board Thickness	0.6mm
Finished Outer Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	White
Bottom Silkscreen	None
Top Solder Mask	Green
Bottom Solder Mask	None
Pre-Shipment Test	100% Electrical Test

5. PCB Stackup Structure

RO4533 2-layer rigid PCB adopts a symmetrical and stable stackup design with precise thickness configuration:

1. Copper Layer 1: 35 μm
2. Rogers RO4533 Core Substrate: 0.508mm (20mil)
3. Copper Layer 2: 35 μm

6. PCB Statistical Parameters

1. Total Components: 36
2. Total Pads: 28
3. Thru Hole Pads: 18
4. Top SMT Pads: 10
5. Bottom SMT Pads: 0
6. Total Vias: 17
7. Total Nets: 2

7. Manufacturing Artwork & Quality Standard

1. Artwork Format: Gerber RS-274-X
2. Industry Quality Standard: IPC-Class-2

8. Global Availability

Rogers RO4533 2-layer custom PCB supports worldwide supply and global shipping services. It is available for procurement by wireless communication manufacturers, antenna design enterprises and high-frequency electronic project teams across all regions.

9. Typical Applications

1. Cellular communication infrastructure: Base station antenna systems
2. Broadband wireless networks: WiMAX antenna network equipment
3. High-frequency RF microstrip antenna design and manufacturing
4. Wireless signal transmission and receiving circuit systems

10. Rogers RO4533 CCL Knowledge

10.1 Product Overview

Rogers RO4533 is a core high-frequency laminate belonging to the premium RO4500 series, featuring a ceramic-filled and glass-reinforced hydrocarbon thermoset structure. Developed specifically for antenna-centric high-frequency circuit designs, this substrate delivers precisely controlled dielectric constant, ultra-low signal loss and exceptional passive intermodulation performance, solving common signal distortion and attenuation problems of traditional laminates in RF antenna applications. As a cost-effective upgrade of the classic RO4000 series, RO4533 PCB material balances professional high-frequency performance and mass production compatibility, serving as an ideal replacement for high-cost PTFE laminates.

 

10.2 Dielectric Performance & Frequency Stability

RO4533 laminate provides stable and consistent dielectric properties across high-frequency operating bands. With a fixed DK value of 3.3 and a low Df of 0.0025 at 10 GHz, RO4533 material maintains minimal signal loss and excellent signal integrity during high-frequency signal transmission. Its professional low-PIM performance (better than –155 dBC) effectively avoids signal interference and intermodulation distortion, meeting the high-precision signal transmission demands of cellular base station antennas and WiMAX wireless devices.

10.3 Thermo-Mechanical Stability & CTE Matching

Rogers RO4533 dielectric material features a copper-matched thermal expansion coefficient, with X-axis and Y-axis CTE values highly consistent with copper foil. This optimal matching greatly reduces thermal stress inside the PCB during soldering and long-term operation, preventing board warpage, delamination and circuit damage. With a Tg exceeding 280°C and an ultra-low Z-axis CTE of 37 ppm/°C, the laminate ensures outstanding plated through-hole reliability and structural stability even under extreme thermal shock and high-temperature processing conditions.

10.4 Fabrication & Environmental Compatibility

Different from conventional PTFE high-frequency substrates that require complex special treatments, RO4533 Copper Clad Laminate is fully compatible with standard FR-4 manufacturing processes and high-temperature lead-free soldering procedures. It needs no specialized via surface treatment, greatly simplifying the production process, improving processing efficiency and lowering manufacturing costs. Meanwhile, the halogen-free material formulation conforms to global green environmental protection regulations, supporting eco-friendly electronic production and sustainable industrial development.

10.5 Core RO4533 Laminate Advantages

1. Low Dk, low Df and ultra-low PIM performance for high-precision RF antenna designs
2. Universal compatibility with standard PCB fabrication and lead-free high-temperature processes
3. Superior dimensional stability for high-yield production of large PCB panels
4. Uniform mechanical properties to maintain structural stability during processing and usage
5. High thermal conductivity for improved heat dissipation and circuit power handling capacity
6. Cost-performance optimized, replacing expensive PTFE materials for commercial mass production
7. Halogen-free and environmentally friendly, compliant with global green electronics standards

10.6 RO4533 Laminate Application Scenarios

1. Cellular base station antenna systems for mobile communication infrastructure
2. WiMAX broadband wireless antenna network equipment
3. High-frequency RF microstrip antennas and signal transceiver circuits
4. High-performance wireless communication and RF microwave circuit modules

   11.Datasheet

Property	Typical Values	Direction	Units	Test Condition	Test Method
Dielectric Constant, εr (Process)	3.3 ± 0.08	Z	-	10 GHz/23°C, 2.5 GHz	IPC-TM-650, 2.5.5.5
Dissipation Factor	0.0020	Z	-	2.5 GHz/23°C	IPC-TM-650, 2.5.5.5
Dissipation Factor	0.0025	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.2	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion (X-direction)	13	X	ppm/°C	-55 to 288°C	IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion (Y-direction)	11	Y	ppm/°C	-55 to 288°C	IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion (Z-direction)	37	Z	ppm/°C	-55 to 288°C	IPC-TM-650, 2.4.41
Thermal Conductivity	0.6	-	W/(m.K)	80°C	ASTM C518
Moisture Absorption	0.02	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Glass Transition Temperature (Tg)	>280	-	°C	TMA A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.9 (1.2)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-

12.Summary

Rogers RO4533 2-Layer high frequency PCB is a high-reliability, cost-optimized antenna-specific circuit board solution. Built on premium RO4533 hydrocarbon ceramic laminate, it features low dielectric loss, ultra-low PIM performance, copper-matched thermal expansion and excellent thermal conductivity. Fully compatible with standard FR-4 fabrication and lead-free processing, RO4533 0.6mm thick immersion gold PCB delivers stable high-frequency signal performance and superior structural durability, making it the ideal choice for cellular base station antennas, WiMAX wireless networks and various high-frequency RF antenna applications.

Tags： Rogers RO4533 PCB, 2-Layer 0.6mm High Frequency PCB, Rogers RO4533 Laminate, Low PIM RF Antenna PCB, Immersion Gold Circuit Board, Rogers PCB, Cellular Base Station Antenna PCB, WiMAX Antenna PCB, Low Loss Hydrocarbon Ceramic Laminate, RF Microwave PCB Substrate