2. Core Features

• Dielectric Constant: 3.48 +/- 0.05 at 10 GHz / 23°C
• Dissipation Factor: 0.0037 at 10 GHz / 23°C
• Decomposition Temperature Td > 390°C, TMA High Tg Exceeds 280°C
• High Thermal Conductivity: 0.69 W/mK
• Low Z-axis Thermal Expansion Coefficient: 32 ppm/°C
• Copper Matched CTE (-55 to 288°C): X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 32 ppm/°C
• UL 94-V0 Flammability Rating
• Fully Compatible With Lead-Free Manufacturing Processes

3. Key Benefits

• Low insertion loss performance supports high operating frequency designs, applicable for frequency scenarios over 40 GHz
• Effectively reduces passive inter-modulation (PIM), ideal for cellular base station antenna applications
• Optimized thermal performance achieved through minimized conductor loss
• Supports multilayer PCB design and lamination requirements
• Provides high design flexibility for diverse high-frequency circuit layouts
• Adaptable to high-temperature assembly and processing conditions
• Compliant with global environmental protection standards and regulations
• Features excellent CAF resistance for long-term service reliability

 

PCB Construction Details

Item	Specification
Base Material	RO4350B Low Profile
Layer Count	2-Layer
Board Dimensions	78mm x 101mm (1PCS)
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.25mm
Blind Vias	Not Allowed
Finished Board Thickness	0.2mm
Finished Outer Copper Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	White
Bottom Silkscreen	None
Top Solder Mask	Blue
Bottom Solder Mask	None
Pre-Shipment Test	100% Electrical Test

 

5. PCB Stackup

2-layer rigid PCB structure:

• Copper_layer_1 – 35 μm
• Rogers RO4350B LoPro Substrate – 4mil (0.102mm)
• Copper_layer_2 – 35 μm

6. PCB Statistics

• Components: 24
• Total Pads: 49
• Thru Hole Pads: 31
• Top SMT Pads: 18
• Bottom SMT Pads: 0
• Vias: 26
• Nets: 2

7. Artwork & Manufacturing Standard

• Type of Artwork Supplied: Gerber RS-274-X
• Accepted Quality Standard: IPC-Class-2

8. Global Availability

This Rogers RO4350B Low Profile 2-layer PCB is available for worldwide supply and shipment, supporting global high-frequency electronics project procurement demands.

9. Typical Applications

• Digital devices: Servers, routers and high-speed backplanes
• Cellular infrastructure: Base station antennas and power amplifiers
• Satellite communication: LNBs for direct broadcast satellites
• Radio frequency field: RF Identification Tags

10. Rogers RO4350B LoPro CCL Laminate Knowledge

10.1 Product Overview

RO4350B LoPro is a representative high frequency CCL material under the RO4000 LoPro series. It adopts Rogers exclusive proprietary bonding technology, allowing reverse treated foil to bond stably with standard RO4000 dielectric. The laminate retains all excellent inherent properties of the RO4000 series, while lowering conductor loss to improve insertion loss and signal integrity. As hydrocarbon ceramic reinforced CCL, it delivers premium high-frequency performance and enables cost-effective PCB fabrication with competitive pricing.

 

 

10.2 Dielectric and Frequency Stability

Most conventional circuit laminates fail to perform stably when the working frequency rises above 500 MHz. Rogers RO4000 series CCL is perfectly tailored for RF microwave circuits, impedance matching networks and controlled impedance transmission line designs. It features an ultra-low temperature coefficient of dielectric constant and stable Dk across a wide frequency range, making it an ideal substrate for broadband high-frequency applications.

 

10.3 Thermal Expansion and Structural Stability

The CTE of RO4000 laminate is well matched with copper, delivering outstanding dimensional stability and adapting to mixed dielectric multilayer PCB construction. Its low Z-axis CTE guarantees reliable plated through-hole performance even under severe thermal shock conditions. The material owns a Tg higher than 280°C, maintaining stable expansion performance throughout the entire PCB thermal processing cycle.

 

10.4 Fabrication Process Compatibility

Rogers RO4350B LoPro laminate can be processed with standard FR-4 manufacturing procedures. Unlike traditional PTFE high-frequency materials, it does not require special via treatment such as sodium etch. As a rigid thermoset hydrocarbon ceramic laminate, it is compatible with automated production lines and copper surface scrubbing equipment, simplifying mass production and lowering manufacturing difficulty.

 

10.5 RO4350B Low Profile CCL Core Features & Advantages

• Low insertion loss and low PIM performance
• Enhanced signal integrity and higher circuit density
• Easy fabrication and cost-efficient production
• Low Z-axis coefficient of thermal expansion
• Support MLB multilayer PCB construction
• High design flexibility for RF and high-speed layouts
• Full compatibility with lead-free high-temperature processes
• Eco-friendly formula and excellent CAF resistance

10.6 RO4350B Low Profile CCL Main Application Fields

• High-speed digital: Servers, routers, high-speed backplanes
• Wireless communication: Cellular base station antennas and power amplifiers
• Satellite communication: LNBs for direct broadcast satellite systems
• RF industry: RF identification tag substrate solutions

11. Summary

Rogers RO4350B Low Profile 2-Layer high frequency PCB is a cost-effective and high-reliability circuit solution, combining low dielectric loss, matched thermal expansion coefficient and excellent thermal conductivity. Compatible with standard FR-4 fabrication processes and lead-free production, it perfectly fits wireless communication, high-speed digital, satellite and RF identification applications with stable high-frequency signal performance and long-term structural reliability.

 

Tags：Rogers RO4350B Low Profile PCB, Rogers RO4000 LoPro CCL, 2-Layer 0.2mm High Frequency PCB, Immersion Gold RF PCB, Low Insertion Loss Rogers PCB, IPC Class 2 High Frequency Circuit Board, Base Station Antenna PCB, High Speed Backplane PCB, Hydrocarbon Ceramic CCL Laminate, RF Microwave Circuit Substrate