2. Wangling F4BTMS1000 PCB Features

Dk (10 GHz): 10.2 ± tight tolerance, excellent batch consistency

 

Df (10/20 GHz): 0.0020 / 0.0023 – ultra-low signal loss

 

CTE (X/Y/Z): 16 / 18 / 32 ppm/°C (-55°C to 288°C)

 

Thermal Coefficient of Dk: -320 ppm/°C (-55°C to 150°C) – stable phase/frequency

 

Thermal Conductivity: 0.81 W/mK – efficient heat dissipation

 

Moisture Absorption: 0.03% – stable in high humidity

 

Board Thickness: 0.4 mm

 

Cu Weight (outer layers): 1 oz (1.4 mils)

 

Surface Finish: OSP

 

Min Trace/Space: 5/6 mils

 

Min Hole Size: 0.2 mm

 

100% Electrical Testing (pre-shipment)

 

Radiation Resistance: stable after high-dose irradiation

 

Ultra-Low Outgassing: meets aerospace vacuum requirements

 

Superior Dimensional Stability – for high-density precision circuits

 

3. Wangling F4BTMS1000 PCB Benefits

Aerospace-grade reliability – radiation resistant, low outgassing

 

Ultra-low dielectric loss – minimizes RF signal attenuation

 

Stable phase/frequency – up to 40 GHz, -55°C to 288°C

 

High thermal conductivity – improves high-power system reliability

 

Low CTE – excellent thermal stability and PTH reliability

 

Superior dimensional stability – consistent circuit geometry

 

Excellent machinability – supports fine-line, dense vias, multilayer

 

High cost-performance – domestic alternative to imported aerospace laminates

 

Mature mass production – consistent quality and global supply

 

4. PCB Construction Details

Base material	F4BTMS1000
Layer count	2 layers
Board dimensions	79.6mm x 45 mm=1PCS, +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.2mm
Blind vias	No
Finished board thickness	0.4mm
Finished Cu weight	1oz (1.4 mils) outer layers
Via plating thickness	20 μm
Surface finish	OSP
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Electrical test	100% Electrical test used prior to shipment

 

5. PCB Stackup

2-layer rigid PCBCopper_layer_1 - 35μm (1oz)Wangling F4BTMS1000 Core - 0.254 mm (10mil)Copper_layer_2 - 35μm (1oz)

 

6. PCB Statistics

·Components: 42·Total Pads: 78·Thru Hole Pads: 41·Top SMT Pads: 37·Bottom SMT Pads: 0·Vias: 36·Nets: 2

 

7. Type Of Artwork Supplied

Gerber RS-274-X

 

8. Quality Standard

IPC-Class-2

 

9. Availability

Worldwide

 

10. Wangling F4BTMS1000 PCB Applications

- Aerospace equipment, space and cabin equipment

- Microwave, RF

- Radar, military radar

- Feed networks

- Phase-sensitive antennas, phased array antennas

- Satellite communications, and more.

 

11. Wangling F4BTMS1000 CCL Base Material Knowledge

11.1 Material Overview

Wangling F4BTMS1000 is a professional-grade aerospace copper clad laminate (CCL) specially developed by Wangling for high performance RF, microwave, radar and extreme environment electronic applications. It is the core grade of the F4BTMS series, an upgraded iteration of the F4BTM series with groundbreaking technological breakthroughs in material formulation and manufacturing processes. It adopts an innovative composite structure of high-purity PTFE resin, uniformly distributed special nano-ceramics, and ultra-thin ultra-fine woven fiberglass cloth reinforcement, delivering exceptional electrical performance, mechanical stability, and environmental adaptability.

By incorporating a small amount of ultra-thin ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with PTFE resin, the F4BTMS1000 minimizes the negative glass fiber weave effect on electromagnetic wave propagation. This innovative design reduces dielectric loss, enhances dimensional stability, decreases the X/Y/Z anisotropy of the material, extends the usable frequency range up to 40GHz, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits an excellent low thermal expansion coefficient and stable dielectric temperature characteristics across a wide temperature range of -55°C to 288°C.

The F4BTMS series comes standard with RTF low-roughness copper foil, which reduces conductor loss at high frequencies while providing excellent peel strength. It can be paired with either copper or aluminum bases for different thermal management requirements, and the F4BTMS294 grade can be paired with embedded 50Ω resistive copper foil to form resistive film laminates. The F4BTMS1000 laminate is fully compatible with standard PTFE PCB processing technology, with excellent mechanical and physical properties that make it suitable for multilayer, high-multilayer, and backplane processing. It also delivers outstanding machinability for high-density fine-line circuits and dense via hole fabrication, making it the ideal substrate for modern high frequency electronic designs.

 

 

11.2 F4BTMS1000 CCL Core Benefits

·Tight dielectric constant tolerance and excellent batch-to-batch consistency, ensuring stable impedance matching and consistent circuit performance across mass production batches·Ultra-low dielectric loss for high efficiency RF signal transmission and minimal signal attenuation at high microwave frequencies·Wide operating frequency range, maintaining stable dielectric constant and low loss values at frequencies up to 40GHz, fully meeting the requirements of phase-sensitive applications·Excellent temperature stability, with dielectric constant and dissipation factor maintaining excellent frequency and phase stability across -55°C to 150°C·Superior radiation resistance, maintaining stable dielectric and physical properties after high-dose irradiation, making it ideal for aerospace and space applications·Ultra-low outgassing performance, tested in accordance with standard methods for material volatilization under vacuum conditions, fully complying with aerospace vacuum outgassing requirements·Low X/Y/Z-axis thermal expansion coefficient, ensuring excellent dimensional thermal stability and plated through hole reliability even under extreme thermal cycling conditions·High thermal conductivity of 0.81 W/mK, effectively dissipating heat generated by high-power components and adapting to high-power RF and microwave application scenarios·Excellent dimensional stability, maintaining consistent circuit geometry and electrical performance across varying temperature and environmental conditions·Low moisture absorption of 0.03%, ensuring stable electrical performance in high-humidity operating environments·Mature mass production capability ensures stable product quality and consistent supply for large-scale commercial projects·Excellent cost-performance ratio as a high-performance domestic alternative to imported aerospace-grade high frequency laminates

 

11.3 F4BTMS1000 CCL Typical Applications

·Aerospace & Aviation Equipment, Space and Cabin On-Board Electronics·Microwave, RF and High Power Amplifier Circuits·Radar Systems, Military Radar and Phased Array Radar·Antenna Feed Networks and Phase-Sensitive Antennas·Phased Array Antennas for 5G/6G Base Stations·Satellite Communication On-Board Electronic Systems·Avionics and Aircraft Collision Avoidance Systems·Test and Measurement Instrumentation RF Circuits·Industrial Microwave Heating and High Power RF Equipment·Automotive Radar and Advanced Driver Assistance System (ADAS) RF Circuits

 

12. DataSheet

Parameter Name	Parameter Value
Base material	F4BTMS1000
Layer count	2 layers
Board dimensions	79.6mm x 45 mm=1PCS, +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.2mm
Blind vias	No
Finished board thickness	0.4mm
Finished Cu weight	1oz (1.4 mils) outer layers
Via plating thickness	20 μm
Surface finish	OSP
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Electrical test	100% Electrical test used prior to shipment

 

13. Summary

Wangling F4BTMS1000 2-Layer 0.4mm High Frequency PCB is an aerospace-grade, high-reliability rigid circuit board built with advanced ceramic filled PTFE composite substrate from Wangling. With its precise dielectric performance, ultra-low loss high frequency characteristics, exceptional phase and temperature stability, aerospace-grade radiation resistance and low outgassing performance, high thermal conductivity, and superior mechanical reliability, this Wangling F4BTMS1000 2-Layer PCB fully adapts to aerospace, satellite communication, radar, phased array antenna, and high-power RF microwave electronic projects. It supports global supply chain coverage and fully meets IPC Class 2 quality standard requirements for mass production.

 

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