Rogers RO3003 High Frequency PCB Material Introduction Greetings, everyone! Welcome back to our channel. In today's discussion, we will be focusing on the topic of RO3003 laminates. Rogers 3003 high frequency laminates are composite materials made of ceramic-filled PTFE. RO3003 PCB material are specifically designed for use in printed circuit boards that are utilized in commercial microwave and RF applications. The key advantage of RO3003 laminates lies in their exceptional stability of dielectric constant (Dk) across various temperatures and frequencies. Unlike PTFE glass materials that often exhibit a significant change in Dk near room temperature, RO3003 laminates eliminate this abrupt shift. This characteristic makes them highly suitable for a range of applications, including automotive radar (operating at 77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure, especially in the mmWave frequency bands. Data Sheet As a high-frequency PCB material, RO3003 possesses following typical values and properties: Electrical Properties: Rogers RO3003 laminate has a Dielectric Constant (εProcess) value of 3.0±0.04 in the Z-direction at 10 GHz and 23℃, determined using the IPC-TM-650 2.5.5.5 Clamped Stripline test method. It has a design Dielectric Constant value of 3 in the Z-direction, covering a frequency range of 8 GHz to 40 GHz, measured using the Differential Phase Length Method. Rogers 3003 PCB material has a low dissipation factor of 0.001 in the Z-direction at 10 GHz and 23℃, determined using the IPC-TM-650 2.5.5.5 test method. The thermal coefficient of the dielectric constant is -3 ppm/℃ in the Z-direction, measured at 10 GHz across a temperature range of -50℃ to 150℃ using the IPC-TM-650 2.5.5.5 test method. Rogers RO3003 exhibits a volume resistivity of 10^7 MΩ.cm under specified conditions (COND A), according to the IPC 2.5.17.1 test method. It has a surface resistivity of 10^7 MΩ under specified conditions (COND A), determined using the IPC 2.5.17.1 test method. Thermal Properties: RO3003 laminate has a decomposition temperature (Td) of 500℃, evaluated using the TGA (Thermogravimetric Analysis) method according to ASTM D 3850. The coefficient of thermal expansion ranges from 17 to 25 ppm/℃ in the X, Y, and Z directions, measured from -55℃ to 288℃ at 23℃/50% RH using the IPC-TM-650 2.4.4.1 test method. It has a thermal conductivity of 0.5 W/M/K at 50℃, determined by the ASTM D 5470 test method. Mechanical Properties: Rogers RO3003 material exhibits a copper peel strength of 12.7 Ib/in. under specific conditions (1oz, EDC after solder float), tested according to the IPC-TM 2.4.8 method. The Young's modulus of RO3003 is 930 MPa in the X-direction and 823 MPa in the Y-direction at 23℃, determined by the ASTM D 638 test method. Rogers 3003 laminate demonstrates dimensional stability with values ranging from -0.06 to 0.07 mm/m in the X and Y directions, tested under specified conditions (COND A) using the IPC-TM-650 2.2.4 test method. Physical Properties: RO3003 possesses a V-0 flammability rating according to the UL 94 standard. The material has a moisture absorption rate of 0.04% under specific conditions (D48/50), tested using the IPC-TM-650 2.6.2.1 method. RO3003 has a density of 2.1 gm/cm3 at 23℃, determined by the ASTM D 792 test method. The specific heat of the material is 0.9 j/g/k, calculated based on its properties. Finally, RO3003 is compatible with lead-free processes. RO3003 Typical Value Property RO3003 Direction Units Condition Test Method Electrical Properties Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5 Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1 Surface Resistivity 107 MΩ COND A IPC 2.5.17.1 Thermal Properties Td 500 ℃ TGA ASTM D 3850 Coefficient of Thermal Expansion 17 X ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1 Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470 Mechanical Properties Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8 Young's Modulus 930 X MPa 23℃ ASTM D 638 Dimensional Stability -0.06 X mm/m COND A IPC-TM-650 2.2.4 Physical Properties Flammability V-0 UL 94 Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1 Density 2.1 gm/cm3 23℃ ASTM D 792 Specific Heat 0.9 j/g/k Calculated Lead-free Process Compatible Yes A Laminate and Applications Displayed on the screen is a Rogers RO3003 substrate, specially tailored for patch antennas. Rogers 3003 laminate demonstrates versatility in several applications, encompassing: * Automotive radar systems * Global positioning satellite (GPS) antennas * Cellular telecommunications systems involving power amplifiers and antennas * Wireless communications through patch antennas * Direct broadcast satellite (DBS) systems * Datalink on cable systems * Remote meter reading devices * Power backplanes Should you require further details or have any other questions, feel free to let me know.
(-55 to 288℃)
16
25
Y
Z
823
Y
0.07
Y
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