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Rogers RO3003 and FR-28 Prepreg PCB : 1.66mm 10-Layer PCB substrate for RF and High-Frequency Applications
Rogers RO3003 and FR-28 Prepreg PCB : 1.66mm 10-Layer PCB substrate for RF and High-Frequency Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Introduction
The evolution of advanced RF systems, automotive radar, and high-speed digital applications demands PCBs that deliver exceptional electrical stability, precise signal integrity, and reliable mechanical performance. Our 10-layer PCB, constructed with RO3003 laminates and FR-28 prepreg, is engineered to meet these rigorous requirements. Rogers RO3003 and FR-28 Prepreg multilayer PCB solution integrates ceramic-filled PTFE materials with advanced processing techniques to provide stable dielectric properties, excellent thermal management, and consistent performance in demanding environments.
Designed for applications ranging from automotive radar to avionics and telecommunications, Rogers RO3003 high-frequency PCB offers a balanced combination of low loss, controlled impedance, and structural reliability. RO3003 core PCB materials ensures stable electrical characteristics across frequency and temperature variations, while the fiberglass-free FR-28 prepreg enables high-density interconnections and supports sequential lamination processes.
2.Technical Specifications
Parameter |
Specification |
Layer Count |
10 Layers |
Core Material |
RO3003 High-Frequency Laminate |
Prepreg Material |
FR-28 Multilayer Prepreg |
Construction |
5 × RO3003 Core with FR-28 Prepreg |
Finished Copper Weight |
1 oz per Layer |
Board Thickness |
1.66 mm |
Surface Finish |
Immersion Gold |
Solder Mask & Legend |
No Solder Mask, No Silkscreen |
Panel Dimensions |
75 × 63 mm (1 Unit per Panel) |
Via Configuration |
Blind Vias: L7-L10, L9-L10 |
Dielectric Constant (Dk) |
Stable Over Temperature and Frequency |
Dissipation Factor (Df) |
0.0014 @ 10 GHz / 0.0017 @ 40 GHz |
Coefficient of Thermal Expansion (CTE) |
X/Y: 17 ppm/°C, Z: 24 ppm/°C |
3.RO3003 Core Material Advantages
Rogers RO3003 RF Circuit Board is a ceramic-filled PTFE composite material designed for commercial microwave and RF applications. Its key benefits include:
Stable Dielectric Constant: Rogers 3003 Maintains consistent electrical properties across temperature and frequency variations, ideal for filters, antennas, and oscillators.
Low Dielectric Loss: Enables efficient signal transmission up to 77 GHz, suitable for automotive radar and high-frequency communications.
Excellent CTE Matching: X/Y axis CTE of 17 ppm/°C matches copper, ensuring dimensional stability and reliable surface mount assembly.
Mechanical Consistency: Uniform properties across different dielectric constants support hybrid multilayer designs without warpage.
4.Advanced Prepreg Technology: FR-28 Multilayer Prepreg
FR-28 is a fiberglass-free, multilayer prepreg designed for high-layer-count and high-speed digital applications. Its features include:
Low Dissipation Factor: Df of 0.0014–0.0017 ensures minimal signal loss in high-frequency designs.
HDI Readiness: Laser ablatable and compatible with sequential lamination processes (up to 5+ cycles).
Thermal Stability: Stable Dk over temperature, suitable for military and aerospace applications.
Flexible Design Support: Enables integration of conductive pastes and supports complex interconnect architectures.
5.Design and Performance Benefits
Enhanced Signal Integrity: Low-loss materials and controlled impedance design ensure reliable performance in RF and high-speed digital circuits.
Thermal Reliability: Matched CTE between materials and copper minimizes thermal stress and improves plated through-hole reliability.
Manufacturing Flexibility: Compatible with standard PTFE processing techniques, supporting hybrid designs with epoxy-glass materials.
High-Density Integration: Blind via technology (L7-L10, L9-L10) enables compact routing and improved signal paths in multilayer stacks.
6.Typical Applications
- Automotive Radar Systems (e.g., adaptive cruise control, collision avoidance)
- Avionics and Aerospace Communication Systems
- Cellular Telecommunications (power amplifiers, antennas)
- Global Positioning Satellite (GPS) Antennas
- High-Speed Digital Backplanes and Data Links
- Beam-Steerable Antennas and RF Filters
7.RO3003 Typical Value
Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.0±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.001 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.06 |
X |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
107 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
930 |
X |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.04 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.9 |
|
j/g/k |
|
Calculated |
Thermal Conductivity |
0.5 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion |
17 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
|
℃TGA |
|
ASTM D 3850 |
Density |
2.1 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
12.7 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|
8.Conclusion
Rogers RO3003 1.66mm 10-layer PCB combines advanced material science with precision engineering to deliver a robust, high-performance solution for demanding RF and high-frequency applications. With stable electrical properties, excellent thermal management, and flexible design options, Rogers RO3003 Multilayer PCB Board provides engineers with a reliable platform for next-generation electronic systems. For customized designs or technical support, contact our engineering team to optimize your application requirements.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.