2. CLTE-MW PCB Features

• Low Loss Tangent: 0.0015 at 10GHz
• Z-axis Coefficient of Thermal Expansion (CTE): 30 ppm/°C
• Thermal Conductivity: 0.42 W/(mK)
• UL94 V-0 Flammability Rating
• Low Moisture Absorption: 0.03%
• High Dielectric Strength: 630 V/mil
• Ultra-Thin Finished Board Thickness: 0.15mm
• 1oz (1.4 mils) Outer Layer Copper Weight
• Immersion Gold Surface Finish
• 100% Pre-Shipment Electrical Testing

 

3. CLTE-MW PCB Benefits

• Enables ultra-low loss high frequency circuit designs for 5G & millimeter wave applications
• Delivers excellent plated through hole (PTH) reliability for long-term operational stability
• Provides superior heat dissipation performance for high-density aggressive circuit designs
• Fully compatible with commercial, industrial and aerospace high frequency application requirements
• Maintains reliable mechanical performance under extreme thermal cycling environments
• Ultra-thin profile adapts to electronic devices with strict thickness limitations
• Offers outstanding dimensional stability for precision high-density PCB fabrication
• Delivers excellent cost-performance ratio for mass market high frequency electronic projects

 

4. PCB Construction Details

Item	Specification
Board Dimensions	76.4mm x 95mm, 1PCS, +/- 0.15mm
Minimum Trace/Space	6/7 mils
Minimum Hole Size	0.25mm
Blind Vias	No Blind vias
Finished Board Thickness	0.15mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Inspection	100% Electrical test prior to shipment

 

5. PCB Stackup

2-layer rigid PCBCopper_layer_1 - 35μm (1oz)CLTE-MW Core - 0.076 mm (2.99mil)Copper_layer_2 - 35μm (1oz)

 

6. PCB Statistics

• Components: 19
• Total Pads: 36
• Thru Hole Pads: 21
• Top SMT Pads: 15
• Bottom SMT Pads: 0
• Vias: 12
• Nets: 4

7. Type Of Artwork Supplied

Gerber RS-274-X

 

8. Quality Standard

IPC-Class-2

 

9. Availability

Worldwide

 

10. CLTE-MW PCB Applications

• 5G Millimeter Wave Communication Circuits & Systems
• Commercial Communications & Avionics Electronic Devices
• Military & Aerospace High Frequency RF Components
• Microwave Feed Networks & Antenna Arrays
• Phase Sensitive Electronic Structures & Precision Circuits
• Satellite Communication System On-Board Electronics
• RF Passive Components (Couplers, Filters, Baluns, Power Dividers)
• High Frequency Amplifiers, Oscillators & Transceiver Circuits

 

11. CLTE-MW CCL Base Material Knowledge

11.1 Material Overview

Rogers CLTE-MW is a professional-grade laminate specially developed by Rogers Corporation as a high-performance base material for modern high frequency and millimeter wave electronic applications. It adopts an advanced composite structure of ceramic filled polytetrafluoroethylene (PTFE) resin reinforced with spread woven fiberglass, delivering inherent low dielectric loss, stable thermal performance, and excellent mechanical rigidity. This unique laminate system is available in seven standard thickness options ranging from 3 mils to 10 mils, perfectly addressing the strict thickness limitations of modern 5G and millimeter wave circuit designs, while ensuring optimal signal-to-ground spacing for high frequency signal transmission.

 

The spread glass reinforcement design, combined with high ceramic filler loading, effectively minimizes the high frequency glass weave effects on electromagnetic wave propagation, ensuring stable and consistent signal transmission performance across high frequency bands. The woven fiberglass structure also provides outstanding long-term dimensional stability, making it ideal for high-density multilayer circuit manufacturing. As a cost-effective high frequency substrate from Rogers, CLTE-MW maintains standard industry lead times and fully adapts to the miniaturization trend of modern RF and microwave circuits. It offers superior bonding compatibility with a wide range of copper foil options, including rolled, reverse treated ED, and standard ED copper, with resistive foil and metal plate options available upon custom request.

 

Rogers CLTE-MW laminate is fully compatible with conventional PTFE PCB processing workflows, supporting standard shearing, drilling, milling, and plating procedures for mass production. Its low Z-axis thermal expansion coefficient ensures reliable plated through hole performance even under extreme thermal cycling, while its low moisture absorption of 0.03% guarantees stable electrical performance across varying operating environments. With a high dielectric strength of 630 V/mil, it delivers excellent z-axis insulation between conductor layers, making it suitable for high-voltage high frequency applications.

 

 

11.2 CLTE-MW CCL Core Benefits

• Ultra-low loss tangent of 0.0015 at 10GHz enables high-efficiency low loss high frequency circuit designs
• Low X, Y & Z-axis CTE delivers reliable mechanical performance under thermally challenging environments
• Excellent dimensional stability is critical for precise registration of small high-density circuit features
• 3-10mil available thickness options perfectly adapt to ultra-high frequency millimeter wave applications
• High thermal conductivity of 0.42 W/(mK) enables superior heat dissipation in aggressive high-density circuit designs
• UL94 V-0 flammability rating ensures full compliance with commercial and industrial safety requirements
• Low moisture absorption of 0.03% guarantees stable electrical performance in harsh operating environments
• Outstanding cost-performance ratio makes it ideal for mass market high frequency electronic projects

 

11.3 CLTE-MW CCL Typical Applications

• 5G Millimeter Wave Communication Circuits & Systems
• Commercial Communications & Avionics Electronic Devices
• Military & Aerospace High Frequency RF Components
• Microwave Feed Networks & Antenna Arrays
• Phase Sensitive Electronic Structures & Precision Circuits
• Satellite Communication System On-Board Electronics
• RF Passive Components (Couplers, Filters, Baluns, Power Dividers)
• High Frequency Amplifiers, Oscillators & Transceiver Circuits

 

12. DataSheet

Properties	Typical Value1	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	2.94 to 3.02 ± 0.04	-	23˚C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	3.03 to 3.10	-	C-24/23/50, 8-40 GHz	Microstrip Differential Phase Length
Dissipation Factor	0.0015	-	23˚C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-35	ppm/˚C	0 to 100˚C, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	1.3 x 10⁷	MΩ-cm	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity	2.5 x 10⁶	MΩ	C96/35/90	IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength)	630	V/mil	-	IPC TM-650 2.5.6.2
Dielectric Breakdown	44	kV	D-48/50	IPC TM-650 2.5.6
Comparative Tracking Index	600V/ PLC 0	class/volts	C-40/23/50	UL-746A, ASTM D6054
Thermal Properties
Decomposition Temperature (Td)	500	˚C	2hrs @ 105˚C, 5% Weight Loss	IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x	8	ppm/˚C	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	8	ppm/˚C	-	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	30	ppm/˚C	-	IPC TM-650 2.4.24
Thermal Conductivity	0.42	W/(m.K)	Z Direction	ASTM D5470
Time to Delamination	>60	minutes	288˚C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength	1.1 (6.0)	N/mm (lbs/in)	as-received, 10s @288˚C, 35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	113, 99 (16.4, 14.4)	MPa (ksi)	25˚C +/- 3˚C	ASTM D790
Tensile Strength (MD, CMD)	83, 80 (12.0, 11.6)	MPa (ksi)	23˚C @ 50% RH	ASTM D3039/D3039-14
Flex Modulus (MD, CMD)	6468, 6360 (938.1, 922.4)	MPa (ksi)	25˚C +/- 3˚C	IPC TM-650 2.4.4
Dimensional Stability (MD, CMD)	0.22, 0.22	mil/inch	after etch + bake	IPC-TM-650 2.4.39a
Physical Properties
Flammability	V-0	-	-	UL 94
Moisture Absorption	0.03	%	E1/105+D48/50	IPC TM-650 2.6.2.1
Density	2.1	g/cm³	C24/23/50	ASTM D792
Specific Heat Capacity	0.93	J/g˚K	2 hours at 105˚C	ASTM E2716
NASA Outgassing - Total Mass Lost (TML)	0.03	%	-	ASTM E595
NASA Outgassing - Collected Volatiles (CVCM)	<0.01	%	-	ASTM E595

 

13. Summary

Rogers CLTE-MW 2-Layer 0.15mm High Frequency PCB is a cost-effective, ultra-thin rigid circuit board built with advanced ceramic filled PTFE and spread woven fiberglass substrate from Rogers Corporation. With stable ultra-low loss high frequency performance, excellent thermal management capability, precise dimensional stability, and reliable mechanical performance under extreme environments, Rogers CLTE-MW 2-Layer PCB fully adapts to 5G millimeter wave communication, aerospace, satellite, and industrial high frequency electronic projects. It supports global supply chain coverage and fully meets IPC Class 2 quality standard requirements for mass production.

 

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