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2-Layer Taconic TSM-DS3 0.6mm Immersion Gold PCB: Low-Loss High-Thermal Board for mmWave and Radar Uses
2-Layer Taconic TSM-DS3 0.6mm Immersion Gold PCB: Low-Loss High-Thermal Board for mmWave and Radar Uses
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Introduction
Taconic TSM-DS3 is a high-performance 2-layer rigid printed circuit board built with premium ceramic-filled reinforced TSM-DS3 substrate, engineered to meet the rigorous demands of high-power, high-frequency and thermal-sensitive electronic applications. Taconic TSM-DS3 high-frequency circuit material features an ultra-low fiberglass content of approximately 5%, delivering dimensional stability that competes with traditional epoxy materials while offering superior electrical and thermal performance. As a thermally stable, industry-leading low-loss core substrate, Taconic TSM-DS3 high-frequency laminate ensures consistent, predictable manufacturability even for large-format and complex circuit designs. Boasting a thermal conductivity of 0.65 W/m*K, it efficiently dissipates heat from critical components, ideal for high-power setups; its ultra-low thermal expansion coefficients also make it perfectly suited for harsh thermal cycling environments, standing out as a top choice for reliable, long-lasting high-performance circuits.
2. TSM-DS3 PCB Features
- Stable dielectric constant (Dk) of 3.0 with a tight tolerance of ±0.05 at 10 GHz under 23°C
- Ultra-low dissipation factor (Df) of 0.0014 at 10 GHz for minimal high-frequency signal loss
- High unclad thermal conductivity of 0.65 W/MK for efficient heat dissipation in high-power applications
- Low moisture absorption rate of only 0.07%, ensuring stable performance in humid operating conditions
- CTE perfectly matched to copper: X-axis 10 ppm/°C, Y-axis 16 ppm/°C, Z-axis 23 ppm/°C
3. TSM-DS3 PCB Benefits
- Features ultra-low fiberglass content (around 5%), optimizing material performance and processability
- Offers exceptional dimensional stability comparable to standard epoxy materials
- Supports fabrication of large-format, high-layer count PCBs without compromising quality
- Enables consistent, high-yield production of complex PCB designs with reliable repeatability
- Maintains temperature-stable Dk with ±0.25% variation across -30°C to 120°C temperature range
- Fully compatible with resistive foils, expanding design flexibility for specialized circuits
4. PCB Construction Details
Item |
Specification |
Base material |
TSM-DS3 |
Layer count |
2-layer rigid PCB |
Board dimensions |
96mm x 130mm per piece, tolerance +/- 0.15mm |
Minimum Trace/Space |
6/5 mils |
Minimum Hole Size |
0.25mm |
Blind vias |
No Blind vias |
Finished board thickness |
0.6mm (20mil core) |
Finished Cu weight |
1oz (1.4 mils) outer layers |
Via plating thickness |
20 μm |
Surface finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Quality Control |
100% Electrical test prior to shipment |
5. PCB Stackup
- Copper_layer_1 - 35 μm
- TSM-DS3 - 0.508 mm (20 mil)
- Copper_layer_2 - 35 μm
6. PCB Statistics
- Components: 62
- Total Pads: 134
- Thru Hole Pads: 69
- Top SMT Pads: 65
- Bottom SMT Pads: 0
- Vias: 94
- Nets: 2
7. Artwork & Compliance Standards
- Type of artwork supplied: Gerber RS-274-X
- Accepted standard: IPC-Class-2
- Availability: worldwide
8. Typical Applications
- Couplers
- Phased Array Antennas
- Radar Manifolds
- mmWave Antenna & Automotive Electronics
- Oil Drilling Equipment
- Semiconductor & ATE Testing
9. Conclusion
2-Layer TSM-DS3 high frequency PCB delivers exceptional thermal conductivity, stable dielectric performance and ultra-low signal loss, making it a robust solution for mission-critical high-power and mmWave applications. With 0.6mm finished thickness, immersion gold surface finish, IPC Class 2 compliance and copper-matched CTE, TSM-DS3 printed circuit board ensures reliable operation under extreme thermal cycling and harsh working conditions, catering to global demands for radar, automotive, semiconductor testing and industrial electronic systems.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.