Taconic TSM-DS3 High Frequency Laminates Introduction Taconic TSM-DS3 is an exceptional thermally stable PCB material that boasts industry-leading low loss properties with a dissipation factor (DF) of 0.0011 at 10 GHz. It offers the predictability and consistency comparable to the best fiberglass reinforced epoxies available in the market. Taconic TSM-DS3 laminate stands out as a ceramic-filled reinforced material with a remarkably low fiberglass content of approximately 5%. This unique composition allows it to rival epoxies in fabricating large format complex multilayers, making it an ideal choice for demanding applications. One of the key highlights of TSM-DS3 material is its suitability for high power applications. With a high thermal conductivity (TC) of 0.65 W/m*K, this material efficiently conducts heat away from other heat sources in a printed wiring board (PWB) design. This capability ensures effective heat dissipation and helps maintain optimal performance in high-power scenarios. Moreover, Taconic TSM-DS3 has been developed to exhibit very low coefficients of thermal expansion, making it highly suitable for applications that undergo demanding thermal cycling. This exceptional feature enhances the material's performance and reliability, providing stability even in environments with significant temperature variations. Data Sheet Let’s explore the detailed properties and test results of the TSM-DS3 laminates. The Dk value of the TSM-DS3 laminates, tested according to IPC-650 2.5.5.3, is 3.00. The Thermal Coefficient of Dielectric Constant value of the TSM-DS3, measured from -30 to 120 °C using a modified IPC-650 2.5.5.5.1 test, is 5.4 ppm. The Dissipation Factor value of the TSM-DS3 material, determined through a modified IPC-650 2.5.5.5.1 test, is 0.0011. The TSM-DS3 exhibits a dielectric breakdown voltage of 47.5 kV, tested according to IPC-650 2.5.6 (ASTM D 149). The through-plane dielectric strength of the TSM-DS3 PCB, measured by ASTM D 149, is 548 V/mil. The TSM-DS3 material demonstrates an arc resistance of 226 seconds, determined by IPC-650 2.5.1 testing. The TSM-DS3 has a moisture absorption rate of 0.07%, tested according to IPC-650 2.6.2.1. The TSM-DS3 exhibits flexural strength of 11,811 psi (MD) and 7,512 psi (CD), measured by ASTM D 790 or IPC-650 2.4.4. The TSM-DS3 has a tensile strength of 7,030 psi (MD) and 3,830 psi (CD), determined by ASTM D 3039 or IPC-650 2.4.19 testing. The TSM-DS3 demonstrates elongation at break values of 1.6% (MD) and 1.5% (CD), measured by ASTM D 3039 or IPC-650 2.4.19. The TSM-DS3 has Young's modulus values of 973,000 psi (MD) and 984,000 psi (CD), determined by ASTM D 3039 or IPC-650 2.4.19. The Poisson's ratio values of the TSM-DS3 are 0.24 (MD) and 0.20 (CD), measured by ASTM D 3039 or IPC-650 2.4.19. The TSM-DS3 exhibits a compressive modulus of 310,000 psi, tested according to ASTM D 695 (23°C). The peel strength of the TSM-DS3 is 8 lbs/in (CV1), determined by IPC-650 2.4.8 Sec 5.2.2 (TS) testing. The thermal conductivity (unclad) of the TSM-DS3 is 0.65 W/M·K, measured by ASTM F 433 or ASTM 1530-06. The TSM-DS3 demonstrates dimensional stability values of 0.21 mils/in (MD) and 0.20 mils/in (CD) after bake, as well as 0.15 mils/in (MD) and 0.10 mils/in (CD) for thermal stress, tested according to IPC-650 2.4.39. The TSM-DS3 has surface resistivity values of 2.3 x 10^6 Mohms (ET) and 2.1 x 10^7 Mohms (HC), determined by IPC-650 2.5.17.1 Sec. 5.2.1 testing. The volume resistivity values of the TSM-DS3 are 1.1 x 10^7 Mohms/cm (ET) and 1.8 x 10^8 Mohms/cm (HC), measured by IPC-650 2.5.17.1 Sec. 5.2.1. The TSM-DS3 exhibits CTE values of 10 ppm/oC (x-axis), 16 ppm/oC (y-axis), and 23 ppm/oC (z-axis) from room temperature to 125oC, tested according to IPC-650 2.4.41/TMA. The TSM-DS3 has a density of 2.11 g/cm3, determined by ASTM D 792. The hardness of the TSM-DS3, measured using ASTM D 2240 (Shore D), is 79. The TSM-DS3 has a Td of 526oC (2% Weight Loss) and 551oC (5% Weight Loss), determined by IPC-650 2.4.24.6 (TGA) testing. Property Test Method Unit TSM-DS3 Unit TSM-DS3 Dk IPC-650 2.5.5.3 3.00 3.00 TcK (-30 to 120 °C) IPC-650 2.5.5.5.1 (Modified) ppm 5.4 ppm 5.4 Df IPC-650 2.5.5.5.1 (Modified) 0.0011 0.0011 Dielectric Breakdown IPC-650 2.5.6 (ASTM D 149) kV 47.5 kV 47.5 Dielectric Strength ASTM D 149 (Through Plane) V/mil 548 V/mm 21,575 Arc Resistance IPC-650 2.5.1 Seconds 226 Seconds 226 Moisture Absorption IPC-650 2.6.2.1 % 0.07 % 0.07 Flexural Strength (MD) ASTM D 790/ IPC-650 2.4.4 psi 11,811 N/mm2 81 Flexural Strength (CD) ASTM D 790/ IPC-650 2.4.4 psi 7,512 N/mm2 51 Tensile Strength (MD) ASTM D 3039/IPC-650 2.4.19 psi 7,030 N/mm2 48 Tensile Strength (CD) ASTM D 3039/IPC-650 2.4.19 psi 3,830 N/mm2 26 Elongation at Break (MD) ASTM D 3039/IPC-650 2.4.19 % 1.6 % 1.6 Elongation at Break (CD) ASTM D 3039/IPC-650 2.4.19 % 1.5 % 1.5 Young’s Modulus (MD) ASTM D 3039/IPC-650 2.4.19 psi 973,000 N/mm2 6,708 Young’s Modulus (CD) ASTM D 3039/IPC-650 2.4.19 psi 984,000 N/mm2 6,784 Poisson’s Ratio (MD) ASTM D 3039/IPC-650 2.4.19 0.24 0.24 Poisson’s Ratio (CD) ASTM D 3039/IPC-650 2.4.19 0.20 0.20 Compressive Modulus ASTM D 695 (23℃) psi 310,000 N/mm2 2,137 Flexural Modulus (MD) ASTM D 790/IPC-650 2.4.4 kpsi 1,860 N/mm2 12,824 Flexural Modulus (CD) ASTM D 790/IPC-650 2.4.4 kpsi 1,740 N/mm2 11,996 Peel Strength (CV1) IPC-650 2.4.8 Sec 5.2.2 (TS) lbs/in 8 N/mm 1.46 A Laminate and Applications On the screen, you can see a Taconic TSM-DS3 laminate. Taconic TSM-DS3 high frequency PCB material is utilized in a wide range of fields, which include: 1.Couplers 2. Phased Array Antennas 3. Radar Manifolds 4. mmWave Antennas 5. Oil Drilling 6. Semiconductor/Automatic Test Equipment (ATE) Testing Summary Taconic TSM-DS3 is a thermally stable, low-loss PCB laminate ideal for high-power, high-frequency and harsh thermal cycling applications. This ceramic-filled reinforced material (≈5% fiberglass) features a 0.0011 DF at 10 GHz, 0.65 W/m*K thermal conductivity and ultra-low CTE, enabling reliable large-format complex multilayer PCB fabrication with consistent performance matching top-grade fiberglass-reinforced epoxies.
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