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Wangling F4BTM300 2-Layer 0.3mm PCB High-Reliability RF/Microwave Substrate with ENIG for Aerospace and Military Use
Wangling F4BTM300 2-Layer 0.3mm PCB High-Reliability RF/Microwave Substrate with ENIG for Aerospace and Military Use
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Wangling F4BTM300 PCB Introduction
Wangling F4BTM300 High Frequency PCB is fabricated using F4BTM300 laminates, which are produced through a precise manufacturing process involving the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. Built on the F4BM dielectric layer, F4BTM300 PCBs incorporate high dielectric constant and low loss nano-ceramics into their substrate structure. This integration not only enhances the dielectric constant but also delivers superior heat resistance, a reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining excellent low loss characteristics. Furthermore, F4BTM300 2-layer rigid PCBs utilize F4BTM laminates specifically paired with reverse-treated RTF copper foil, ensuring exceptional performance in terms of Passive Intermodulation (PIM), precise line control, and minimized conductor loss, making them ideal for high-frequency and high-reliability applications.
2. Features of F4BTM300 PCB
- Dielectric constant (Dk) of 3 +/- 0.06 at 10GHz
- Dissipation factor of 0.0018 at 10GHz and 0.0023 at 20GHz
- Coefficient of Thermal Expansion (CTE): x-axis 15 ppm/°C, y-axis 16 ppm/°C, z-axis 72 ppm/°C (temperature range: -55°C to 288°C)
- Low thermal coefficient of Dk at -75 ppm/°C (temperature range: -55°C to 150°C)
- Moisture absorption of 0.05%
- UL-94V0 flammability rating
3. Benefits of F4BTM300 PCB
- Superior high-frequency performance with stable Dk and low dissipation factor, ensuring minimal signal loss in RF and microwave applications
- Excellent thermal stability and low CTE across multiple axes, reducing the risk of board warpage and component failure under extreme temperature fluctuations
- High insulation resistance and improved thermal conductivity, enhancing overall reliability and service life in harsh operating environments
- Exceptional PIM performance and precise line control due to the pairing of F4BTM laminates with reverse-treated RTF copper foil, ensuring accurate signal transmission
- Low moisture absorption (0.05%) and UL-94V0 flammability rating, meeting strict safety and environmental requirements for critical applications
4. PCB Construction Details
- Base material: F4BTM300
- Layer count: 2 layers
- Board dimensions: 112mm x 89mm per piece, tolerance +/- 0.15mm
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.4mm
- Blind vias: No
- Finished board thickness: 0.3mm
- Finished Cu weight: 1oz (1.4 mils) for outer layers
- Via plating thickness: 20 μm
- Surface finish: Electroless Nickle Immersion Gold (ENIG)
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- Electrical test: 100% electrical test conducted prior to shipment
5. PCB Stackup
2-layer rigid PCB with the following stackup configuration:
- Copper_layer_1: 35 μm
- F4BTM300 Core: 0.254 mm (10mil)
- Copper_layer_2: 35 μm
6. PCB Statistics
- Components: 29
- Total Pads: 106
- Thru Hole Pads: 73
- Top SMT Pads: 33
- Bottom SMT Pads: 0
- Vias: 26
- Nets: 2
7. Artwork Type Supplied
Gerber RS-274-X
8. Quality Standard
IPC-Class-2
9. Availability
Worldwide
10. Typical Applications
- Aerospace equipment, space and cabin equipment
- Microwave, RF devices
- Radar, military radar systems
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications systems, and more
11. Summary
F4BTM300 2-layer laminate PCB is a high-performance rigid substrate designed for critical high-frequency and high-reliability applications. Leveraging the advanced properties of F4BTM300 laminates, this PCB offers stable dielectric performance, low loss, excellent thermal stability, and exceptional signal integrity. Compliant with IPC-Class-2 quality standards and featuring a robust construction with ENIG surface finish, it meets the stringent requirements of aerospace, military, and satellite communication industries. With worldwide availability and precise manufacturing control, F4BTM300 high-frequency circuit materials is the reliable choice for demanding RF and microwave applications.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.