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Wangling F4BM217 2-Layer 0.17mm PCB: Low-Loss High-Frequency Solution for RF and Microwave Applications
Wangling F4BM217 2-Layer 0.17mm PCB: Low-Loss High-Frequency Solution for RF and Microwave Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Introduction
Wangling F4BM217 0.17mm 2-layer circuit laminate is a premium composite, manufactured by integrating fiberglass cloth, polytetrafluoroethylene (PTFE) resin and PTFE film through scientific formulation and strict pressing processes. Compared with F4B220 grade, this F4BM217 high-frequency PCB material delivers upgraded electrical performance, characterized by lower dielectric loss, higher insulation resistance and enhanced stability, serving as a dependable alternative to imported equivalents.
A key distinction exists between F4BM217 laminate and its counterpart F4BME217 material: both share the same dielectric layer, but are paired with different copper foils. F4BM217 circuit board is combined with electrolytic (ED) copper foil, ideal for applications without Passive Intermodulation (PIM) requirements. In contrast, the latter adopts reverse-treated foil (RTF), offering superior PIM performance, precise trace control and reduced conductor loss.
By adjusting the ratio of PTFE to fiberglass cloth, Wangling F4BM217 high-frequency circuit material achieves precise dielectric constant control, ensuring low signal loss and excellent dimensional stability. A higher dielectric constant corresponds to a greater fiberglass proportion, which further improves dimensional stability, lowers thermal expansion coefficient, enhances temperature drift resistance, with only a marginal increase in dielectric loss.
2. Features
- Dielectric constant (Dk) of 2.17±0.04 at 10GHz
- Dissipation factor of 0.001 at 10GHz
- CTE x-axis of 25 ppm/°C, y-axis of 34 ppm/°C, z-axis of 240 ppm/°C (-55°C to 288°C)
- Thermal coefficient of Dk at -150 ppm/°C (-55°C to 150°C)
- Moisture absorption of ≤0.08%
- Flammability rating of UL-94 V0
3. Benefits
- Low dielectric loss and stable Dk ensure reliable signal transmission for high-frequency RF and microwave systems
- Precise dielectric constant control meets impedance matching demands of phased array antennas and satellite communication equipment
- Excellent dimensional stability and low CTE minimize deformation risks under extreme temperature fluctuations
- Low moisture absorption maintains consistent electrical and mechanical performance in humid environments
- UL-94 V0 rating enhances end-product safety compliance
- Compatible with standard manufacturing processes, supporting accurate trace/space and hole size control
- Cost-effective alternative to imported high-frequency circuit materials
4. PCB Construction Details
- Base material: Wangling F4BM217 high-frequency composite
- Layer count: double sided (2-layer rigid circuit board)
- Board dimensions: 120mm x 89 mm=1PCS, tolerance +/- 0.15mm
- Minimum Trace/Space: 6/7 mils
- Minimum Hole Size: 0.3mm
- Blind vias: None
- Finished board thickness: 0.17mm
- Finished copper weight: 1oz (1.4 mils) outer layers (35μm)
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold (ENIG, 3.9mil)
- Top/Bottom Silkscreen: No
- Top/Bottom Solder Mask: No
- Quality inspection: 100% Electrical test prior to shipment
5. PCB Stackup
2-layer rigid high-frequency circuit board
- Copper_layer_1 - 35 μm (1oz ED copper foil)
- Wangling F4BM217 core material - 0.1 mm
- Copper_layer_2 - 35 μm (1oz ED copper foil)
6. PCB Statistics
- Components: 5
- Total Pads: 21
- Thru Hole Pads: 15
- Top SMT Pads: 6
- Bottom SMT Pads: 0
- Vias: 25
- Nets: 2
7. Type of Artwork Supplied
Gerber RS-274-X
8. Quality Standard
IPC-Class-2
9. Availability
Worldwide
10. Typical Applications
- Microwave, RF and radar systems
- Phase shifters
- Passive components
- Power dividers, couplers and combiners
- Feed networks
- Phased array antennas
- Satellite communications
- Base station antennas
Conclusion
Wangling 0.17mm 2-layer F4BM217 Microwave PCB is a high-performance solution tailored for demanding RF, microwave and satellite communication applications. This circuit board substrate features low dielectric loss, stable electrical performance and excellent dimensional stability, complying with IPC-Class-2 quality standards. F4BM217 high-frequency circuit board stands as a cost-effective alternative to imported high-frequency materials, with global availability and compatibility with standard manufacturing processes, making it a reliable choice for electronic engineers and manufacturers.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.