2. Core Features of Wangling TFA300 PCB

Stable Dielectric Constant (Dk) of 3.0±0.04 at 10GHz

Ultra-low Dissipation Factor: 0.001 at 10GHz & 20GHz, 0.0012 at 40GHz

Low Temperature Coefficient of Dielectric Constant (TCDK): -8 ppm/°C within -55°C to 150°C

Balanced CTE performance: X-axis 18 ppm/°C, Y-axis 18 ppm/°C, Z-axis 30 ppm/°C from -55°C to 288°C

Thermal conductivity reaches 0.6 W/mk for efficient heat dissipation

Ultra-low moisture absorption rate at 0.04%

UL 94-V0 flame retardant certification

Fiberglass-free structure to remove fiberglass phase shift interference

Minimal X/Y/Z anisotropy for uniform circuit performance

CTE value close to copper foil to reduce thermal cycling stress

 

3. Key Product Benefits

Consistent signal integrity across microwave, millimeter-wave and phased array antenna circuits without fiber-induced signal distortion

Stable dielectric properties under wide temperature range, suitable for airborne, space and outdoor radar equipment

Matched thermal expansion with copper layers reduces cracking and delamination risks during soldering and long-term operation

Low dielectric loss minimizes power attenuation for power amplifier and satellite communication modules

Aerospace-grade reliability serves as cost-effective alternative to imported high-frequency PTFE substrates

UL 94-V0 flame resistance meets strict safety standards for aviation and defense electronics

Global availability supports prototype and mass production orders for overseas RF manufacturers

Strict IPC-Class-2 quality control plus 100% electrical testing before shipment guarantees circuit yield

 

4. PCB Construction Details

Item	Specification
Base Material	TFA300 (Wangling fiberglass-free ceramic-filled PTFE laminate)
Layer Count	2 Layers, Rigid PCB
Board Dimension	87mm × 54mm, ±0.15mm tolerance, 1PCS standard size
Minimum Trace / Space	6 mils / 8 mils
Minimum Hole Size	0.4mm
Via Type	No Blind Vias, only through vias
Finished Board Thickness	0.2mm
Outer Copper Weight	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	Green
Bottom Solder Mask	None
Pre-Shipment Inspection	100% Electrical Test

 

5. PCB Stackup

2-layer rigid PCB layer structure from top to bottom:

Copper Layer 1: 35 μm

TFA300 Core Substrate: 0.127 mm (5mil)

Copper Layer 2: 35 μm

 

6. PCB Statistics

Total Components: 18

Total Pads: 36

Through Hole Pads: 19

Top SMT Pads: 17

Bottom SMT Pads: 0

Conductive Vias: 6

Electrical Nets: 2

 

7. Artwork & Manufacturing Standard

Supplied Artwork Format: Gerber RS-274-X

Quality Compliance Standard: IPC-Class-2

Supply Scope: Worldwide Shipping & Production Support

 

8. Typical Application Scenarios

Aerospace equipment, aircraft cabin electronics, space-grade communication hardware

Microwave circuits, broadband antennas, phase-sensitive antenna modules

Early warning radar systems, airborne radar assemblies

Phased array antennas, RF beamforming networks

Satellite communication, navigation positioning hardware

RF power amplifier circuits

 

9. TFA Series Laminate Knowledge

9.1 Product Overview

Wangling TFA Series PTFE ceramic composite copper clad laminates are engineered high-frequency base materials built with a unique dielectric blend of PTFE resin and nano ceramic fillers. Distinct from traditional glass fiber cloth-based prepreg laminates, the TFA family adopts an optimized prepreg forming workflow paired with proprietary precision lamination technology. The finished copper clad laminate delivers premium electrical, thermal and mechanical performance at fixed dielectric constant grades, acting as a fully interchangeable domestic alternative to premium foreign high-frequency RF substrates for aerospace and radar PCB fabrication.

As a fiberglass-free copper clad laminate lineup, TFA Series mixes evenly distributed specialty nano-ceramic particles into the PTFE resin matrix. This construction completely eliminates the fiberglass effect that causes signal deviation during electromagnetic wave transmission. Designers gain superior frequency consistency, industry-leading low dielectric loss, and drastically reduced X/Y/Z directional anisotropy. The material’s CTE is closely matched to copper foil, maintaining steady dielectric performance across extreme temperature shifts.

Four fixed Dk grades are available for customized RF PCB design: 2.94, 3.0, 6.15, and 10.2, corresponding to TFA294, TFA300, TFA615 and TFA1020 respectively.

Standard TFA copper clad laminate is equipped with RTF low-roughness copper foil, cutting conductor signal loss while retaining robust copper peel strength. Rolled copper foil can be configured on demand. The laminate can also be bonded onto copper or aluminum metal base plates for metal-backed high-power PCB designs.

Two mainstream variants TFA294 and TFA300 support lamination with embedded 50Ω resistor copper foil, producing integrated resistor-film copper clad laminates for miniaturized RF circuit boards.

Fabrication of Wangling TFA copper clad laminate PCB follows universal PTFE circuit processing workflows. Outstanding mechanical stability enables production of multi-layer, high-layer-count and backplane PCBs, alongside reliable manufacturing of dense hole arrays and ultra-fine trace layouts for compact millimeter-wave modules.

 

 

9.2 Core Copper Clad Laminate Features

Ultra-tight Dk tolerance with consistent electrical performance across production batches

Class-leading low dissipation factor to minimize high-frequency signal attenuation

Rated operating frequency up to 77 GHz, ideal for millimeter-wave hardware and automotive radar PCB

Stable frequency and phase response within -55°C ~ 150°C full working temperature range

Excellent radiation resistance; dielectric and physical properties remain intact after high-dose radiation exposure

Low vacuum outgassing, fully compliant with aerospace industry vacuum volatile material testing standards

Copper foil-matched CTE prevents barrel cracking and stabilizes board dimensions during thermal cycling

Minimal moisture absorption, locking in consistent circuit performance under high-humidity operating environments

 

9.3 Copper Clad Laminate Target Applications

Aerospace & aviation electronics: spaceborne devices, aircraft cabin control systems, onboard flight hardware

Microwave circuits, broadband antennas, phase-sensitive antenna array assemblies

Multi-type radar platforms: early warning radar, airborne radar signal processing boards

Phased array antenna systems and RF beamforming network PCBs

Satellite communication terminals and positioning navigation circuit modules

RF power amplifier high-frequency printed circuit boards

 

10.TFA300 DataSheet

Property	Test Condition	Unit	TFA300
Typical Dielectric Constant	10GHz	/	3.00
Design Dielectric Constant	10GHz	/	3.00
Dielectric Constant Tolerance	/	/	±0.04
Typical Dissipation Factor	10GHz	/	0.001
Typical Dissipation Factor	20GHz	/	0.001
Typical Dissipation Factor	40GHz	/	0.0012
Temperature Coefficient of Dielectric Constant	-55 ºC ~ 150ºC	PPM/℃	-8
Peel Strength	1 OZ RTF Copper Foil	N/mm	>1.6
Volume Resistivity	Ambient Condition	MΩ·cm	≥5×10⁷
Surface Resistivity	Ambient Condition	MΩ	≥5×10⁷
Dielectric Strength (Z-axis)	5KW, 500V/s	KV/mm	>32
Breakdown Voltage (XY-plane)	5KW, 500V/s	KV	>40
CTE (X, Y-axis)	-55 ºC ~ 288ºC	ppm/ºC	18,18
CTE (Z-axis)	-55 ºC ~ 288ºC	ppm/ºC	30
Thermal Stress	260℃, 10s, 3 cycles	-	No Delamination
Water Absorption	20±2℃, 24h	%	0.04
Density	Ambient Temperature	g/cm³	2.15
Continuous Operating Temperature	Temperature & Humidity Chamber	℃	-55～+260
Thermal Conductivity	Z-axis	W/(M·K)	0.60
Flame Retardancy	/	UL-94	V-0
TD (Decomposition Temperature)	Initial Value	℃	498
Material Composition	/	/	PTFE with ceramic (A tiny amount of fiberglass cloth will be added when dielectric thickness exceeds 1.5mm)

 

 

11.Summary

 2-Layer TFA300 High Frequency PCB delivers balanced electrical, thermal and mechanical performance for high-reliability RF and millimeter-wave electronics. Its fiberglass-free nano-ceramic PTFE core eliminates fiberglass effect, maintains stable Dk and low loss across 10GHz to 40GHz, and fits compact 0.2mm thin-board designs with immersion gold surface finish. Built upon Wangling’s proprietary TFA Series PTFE ceramic composite copper clad laminate, this 2-layer circuit board complies with IPC-Class-2 standards and ships globally. It provides a cost-effective domestic laminate solution for aerospace radar, satellite communication and phased array antenna PCB projects, replacing imported high-frequency substrates without sacrificing signal stability or thermal durability.

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