1.TLY-5 PCB Introduction

TLY-5 PCBs are constructed using ultra-lightweight woven fiberglass, delivering significantly superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix of Taconic TLY-5 PCB creates a mechanically more stable laminate, which is well-suited for high-volume manufacturing processes and can effectively meet the needs of large-scale electronic component production scenarios. Meanwhile, leveraging its core advantage of a low dissipation factor, TLY-5 2-layer PCB not only enables successful deployment in 77 GHz automotive radar systems (such as adaptive cruise control and collision warning safety systems) but also supports other antenna devices operating at millimeter wave frequencies, providing reliable signal transmission guarantees for high-frequency communication and sensing fields.

 

 

2. Features

- Dielectric constant of 2.2 with tight tolerance 0.02 at 10 GHz/23°C

- 0.0009 loss tangent at 10GHz

- Density (specific gravity) of 2.19 g/cm3

- Moisture Absorption 0.02%

- CTE in X-axis of 26 ppm/°C, Y-axis of 15 ppm/°C and Z-axix of 217 ppm/°C

 

3. Benifits

- Dimensionally stable

- Lowest DF

- Low moisture absorption

- High copper peel strength

- Uniform & consistent DK

 

4. PCB Construction details:

- Base material: TLY-5

- Layer count: 2 layers

- Board dimensions:  106mm x 48.5 mm=1PCS, +/- 0.15mm

- Minimum Trace/Space:  7/7 mils

- Minimum Hole Size:  0.4mm

- No Blind vias.

- Finished board thickness:  3.2mm

- Finished Cu weight:  1oz (1.4 mils) outer layers

- Via plating thickness: 20 μm

- Surface finish:  Immersion gold

- Top Silkscreen:          No

- Bottom Silkscreen:      No

- Top Solder Mask:  No

- Bottom Solder Mask: No

- 100% Electrical test used prior to shipment

 

5. PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

TLY-5 - 3.175 mm (125mil)

Copper_layer_2 - 35 μm

 

6. PCB Statistics:

    Components:        39

    Total Pads:         136

    Thru Hole Pads:     74

    Top SMT Pads:      62

    Bottom SMT Pads:    0

    Vias:              97

    Nets:              2

 

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

 

10. Key Advantages of TLY-5 Laminate:

TLY-5 PCB substrate is a woven fiberglass-reinforced PTFE laminate engineered for high-frequency RF and microwave applications. TLY-5 high-frequency material offers a stable dielectric constant of 2.20 ± 0.02 and an ultra-low dissipation factor of 0.0009 at 10 GHz, ensuring minimal insertion loss and excellent signal integrity over a broad frequency range. Its low moisture absorption rate of below 0.02% provides superior dimensional stability and consistent electrical performance in humid environments. TLY-5 PCB material also features a low Z-axis coefficient of thermal expansion, which enhances plated through-hole reliability during thermal cycling. With a density of 2.0 g/cm³, TLY-5 PCB laminate is lightweight and well-suited for aerospace, defense, and 5G millimeter-wave applications. TLY-5 microwave material  offers excellent copper peel strength and supports hybrid multilayer constructions, making it a versatile and cost-effective solution for demanding high-reliability circuit designs.

 

11. Some Typical Applications:

- Automotive Radar

- Satellite/Cellular Communications

- Power Amplifiers

- LNBs, LNAs, LNCs

- Aerospace

- Ka, E and W band Applications

 

12.Appendix: Typical Value of TLY-5

Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5		2.2		2.2
Df at 10 GHz	IPC-650 2.5.5.5		0.0009		0.0009
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Dielectric Strength	ASTM D 149	V/mil	2,693	V/mil	106,023
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	1010	Mohms/cm	1010
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	1010	Mohms/cm	109
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	108	Mohms	108
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	108	Mohms	108
Flex Strength(MD)	IPC-650 2.4.4	psi	14,057	N/mm2	96.91
Flex Strength(CD)	IPC-650 2.4.4	psi	12,955	N/mm2	89.32
Peel Stength(½ oz.ed copper)	IPC-650 2.4.8	Ibs./inch	11	N/mm	1.96
Peel Stength(1 oz.CL1 copper)	IPC-650 2.4.8	Ibs./inch	16	N/mm	2.86
Peel Stength(1 oz..CV1 copper)	IPC-650 2.4.8	Ibs./inch	17	N/mm	3.04
Peel Stength	IPC-650 2.4.8(after elevated temp.)	Ibs./inch	13	N/mm	2.32
Young's Modulus(MD)	ASTM D 3039/IPC-650 2.4.19	psi	1.4 x 106	N/mm2	9.65 x 103
Poisson's Ratio(MD)	ASTM D 3039/IPC-650 2.4.19		0.21		0.21
Thermal Conductivity	ASTM F 433	W/M*K	0.22	W/M*K	0.22
Dimensional Stability(MD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.038		-0.038
Dimensional Stability(CD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.031		-0.031
Density(Specific Gravity)	ASTM D 792	g/cm3	2.19	g/cm3	2.19
CTE(X axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	26	ppm/℃	26
CTE(Y axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	15	ppm/℃	15
CTE(Z axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	217	ppm/℃	217
NASA Outgassing(% TML)			0.01		0.01
NASA Outgassing(% CVCM)			0.01		0.01
NASA Outgassing(% WVR)			0.00		0.00
UL-94 Flammability Rating	UL-94		V-0		V-0