1.Introduction of TLX-8 PCB material

Taconic TLX-8 PCB is a PTFE fiberglass laminate, specifically engineered as a high-volume antenna material that delivers consistent reliability across a broad range of RF (radio frequency) applications. Its strong versatility stems from its wide selection of available thicknesses and copper cladding options, making it easy to adapt to diverse design requirements.

 

Ideal for low-layer-count microwave designs, TLX-8 PCB provides essential mechanical reinforcement for substrates operating in severe or harsh environments. Key performance advantages in extreme conditions include:

Creep resistance: Protects printed wiring boards (PWBs) bolted to housings, even when exposed to high vibration levels during space launches.

 

High-temperature tolerance: Maintains stability in engine modules where elevated temperatures are common.

 

Radiation resistance: Suitable for space applications (refer to NASA’s official website for details on low-outgassing materials, a critical standard for space use).

Marine environment durability: Withstands extreme conditions at sea, making it a reliable choice for warship antennas.

Wide temperature range adaptability: Performs consistently across varying temperatures, ideal for altimeter substrates during flight operations.

 

 

2. Benefits

- Excellent PIM Values in PCBs (measured at lower than -160 dBc)

- Excellent Mechanical & Thermal Properties

- Low and Stable Dk

- Dimensionally Stable

- Low Moisture Absorption

- Tightly Controlled DK

- Low DF

- UL 94 V0 Rating

- For Low Layer Count Microwave Designs

 

3. Main Properties

- Electrical Properties

Dielectric Constant @ 10 GHz - 2.55 ± 0.04 - IPC-650 2.5.5.3

Dissipation Factor @ 10 GHz - 0.0018 - IPC-650 2.5.5.5.1

 

Surface Resistivity Elevated Temp. 6.605 x 10^8 Mohm IPC-650 2.5.17.1 Sec. 5.2.1

Surface Resistivity Humidity Cond. 3.550 x 10^6 Mohm IPC-650 2.5.17.1 Sec. 5.2.1

Volume Resistivity Elevated Temp. 1.110 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

Volume Resistivity Humidity Cond. 1.046 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

 

- Dimensional Stability

MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4

CD After Bake 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4

MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

CD Thermal Stress 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

 

- CTE (25-260 °C)

X - 21 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Y - 23 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Z - 215 ppm/°C - IPC-650 2.4.41/ASTM D 3386

 

- Td

2% Weight Loss - 535 °C - IPC-650 2.4.24.6 (TGA)

5% Weight Loss - 553 °C - IPC-650 2.4.24.6 (TGA)

 

-Chemical / Physical Properties

Moisture Absorption - 0.02 % IPC-650 2.6.2.1

Dielectric Breakdown - > 45 Kv - IPC-650 2.5.6

Flammability Rating - V-0 - UL-94

 

4.PCB Construction details:

   - Base material: TLX-8

   - Layer count: 2 layers

    - Board dimensions:  20mm x 21.35 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  5/6 mils

    - Minimum Hole Size:  0.2mm

    - No Blind vias.

    - Finished board thickness:  0.3mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Electroless Nickel Immersion Gold (ENIG)

    - Top Silkscreen:          No

    - Bottom Silkscreen:      No

    - Top Solder Mask:  No

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

5.PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

Taconic TLX-8 Core - 0.254 mm (10mil)

Copper_layer_2 - 35 μm

 

6.PCB Statistics:

    Components:        2

    Total Pads:         14

    Thru Hole Pads:     10

    Top SMT Pads:      4

    Bottom SMT Pads:    0

    Vias:              5

    Nets:              2

 

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

 

10. Some Typical Applications:

- radar systems

- mobile communications

- microwave test equipment

- microwave transmission devices

- couplers, splitters, combiners, amplifiers, antennas