1.Introduction of RT/duroid 5880

 

Rogers RT/duroid 5880 high-frequency PCBs are polytetrafluoroethylene (PTFE) composites reinforced with glass microfibers, specifically engineered for demanding stripline and microstrip circuit applications. A key advantage of these laminates lies in their randomly oriented microfibers—this structural design delivers outstanding dielectric constant uniformity, a critical performance attribute for high-frequency circuits.Notably, the dielectric constant of RT/duroid 5880 laminates maintains consistency not only across individual panels but also remains stable over an extensive frequency range. This cross-panel and wideband stability ensures reliable, predictable performance in varied circuit designs and operating conditions.

 

Additionally, the material features a low dissipation factor. This characteristic minimizes signal loss, effectively extending the practical application scope of RT/duroid 5880 laminates to the Ku-band and higher frequency bands—making it a versatile choice for high-frequency communication and radar systems, among other advanced electronic applications.

 

RT/duroid 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

 

2. Features

- Dielectric constant of 2.2 with tight tolerance 0.02 at 10 GHz/23°C

- Dissipation factor of 0.0009 at 10GHz

- Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C

- Low Moisture Absorption 0.02%

- CTE in X-axis of 31 ppm/°C, Y-axis of 48 ppm/°C and Z-axix of 237 ppm/°C

- Isotropic

 

 

3. Benifits

- Uniform electrical properties over wide frequency range

- Easily cut, shared and machined to shape

- Resistant to solvents and reagents used in etching or plating edges and holes

- Ideal for high moisture environments

- Well-established material

- Lowest electrical loss for reinforced PTFE material

 

 4.PCB Construction details:

- Base material: RT/duroid 5880 / RO4450F

- Layer count: 4 layers of copper

- Board dimensions:  50mm x 60 mm=1PCS, +/- 0.15mm

- Minimum Trace/Space:  5/7 mils

- Minimum Hole Size:  0.45mm

- Blind vias: Top - inner layer 3

- Finished board thickness:  3.0mm

- Finished Cu weight:  1oz (1.4 mils) outer layers/inner layers

- Via plating thickness: 20 μm

- Surface finish:  OSP

- Top Silkscreen:          No

- Bottom Silkscreen:      No

- Top Solder Mask:  No

- Bottom Solder Mask: No

- 100% Electrical test used prior to shipment

 

5. PCB Stackup:  4-layer rigid PCB

Copper_layer_1 - 35 μm

RT/duroid 5880 - 1.575 mm (62mil)

Copper_layer_2 - 35 μm

RO4450F Bonding ply - 0.102mm (4mil)

RT/duroid 5880 - 0.787 mm (31mil)

RO4450F Bonding ply - 0.102mm (4mil)

Copper_layer_3 - 35 μm

RT/duroid 5880 - 0.254 mm (10mil)

Copper_layer_4 - 35 μm

 

 

6.PCB Statistics:

    Components:        10

    Total Pads:         35

    Thru Hole Pads:     21

    Top SMT Pads:      14

    Bottom SMT Pads:    0

    Vias:              22

    Nets:              6

 

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

 

10. Some Typical Applications:

- Commercial Airline Broadband Antennas

- Microstrip and Stripline Circuits

- Millimeter Wave Applications

- Radar Systems

- Guidance Systems

- Point to Point Digital Radio Antennas