1.Introduction of RO4533 PCB

 

Rogers RO4533 PCB represents an advanced ceramic-filled, glass-reinforced hydrocarbon composite material specifically engineered to meet the demanding requirements of mobile infrastructure microstrip antenna applications. This innovative material set delivers precisely controlled dielectric constant, ultra-low signal loss, and superior passive intermodulation (PIM) performance essential for modern base station antenna systems.

 

Fully compatible with standard FR-4 manufacturing processes and high-temperature lead-free soldering operations, RO4533 PCB eliminates the specialized through-hole treatments typically required for PTFE-based laminates. This compatibility significantly simplifies production while providing an economical alternative to conventional PTFE antenna technologies, enabling designers to achieve optimal balance between cost efficiency and RF performance. The material is available in halogen-free formulations that comply with stringent environmental regulations.

 

The optimized resin system in RO4533 laminate ensures ideal antenna characteristics through carefully engineered thermal properties. The material's coefficients of thermal expansion (CTE) in X and Y directions closely match those of copper, minimizing mechanical stresses in printed circuit board antennas during thermal cycling. With a glass transition temperature (Tg) exceeding 280°C, RO4533 maintains low Z-axis CTE and delivers exceptional plated through-hole reliability even under demanding operating conditions, ensuring long-term stability for critical communications infrastructure.

 

 

2. Features

    - Dielectric Constant of DK 3.3 at 10GHz

    - Dissipation Factor of 0.0025 at 10GHz

    - X axis CTE of 13ppm/°C, Y CTE of 11ppm/°C, Z CTE of 37ppm/°C

    - Tg >280 °C

    - Low moisture absorption of 0.02%

    - Thermal conductivity of 0.6 W/mk

 

3. Benefits:

- Low Loss, Low Dk and low PIM response for wide range of application use

- Thermoset resin system compatible with standard PCB fabrication

- Excellent dimensional stability for greater yield on larger panels sizes

- Uniform mechanical properties for maintaining mechanical form during handling

- High thermal conductivity for improved power handling

 

 

1. PCB Construction details:

- Base material: RO4533

- Layer count: 2 layers

    - Board dimensions:  52mm x 35 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  4/7 mils

    - Minimum Hole Size:  0.3mm

    - No Blind vias.

    - Finished board thickness:  0.6mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Immersion Gold

    - Top Silkscreen:          White

    - Bottom Silkscreen:      No

    - Top Solder Mask:  Green

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

5. PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers 4533 Core - 0.508 mm (20mil)

Copper_layer_2 - 35 μm

 

6. PCB Statistics:

    Components:        25

    Total Pads:         31

    Thru Hole Pads:     21

    Top SMT Pads:      10

    Bottom SMT Pads:    0

    Vias:              32

    Nets:              2

 

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

 

10. Some Typical Applications:

- Cellular infrastructure base station antennas

- WiMAX antenna networks