1.Introduction of RO4003C

 

Rogers RO4003C is a high-performance circuit material composed of proprietary woven glass reinforced hydrocarbon/ceramic composites, delivering PTFE-level electrical performance with epoxy/glass process compatibility. Available in multiple configurations including 1080 and 1674 glass fabric styles, all RO4003C laminates maintain consistent electrical specifications while offering tight dielectric constant (Dk) control and low loss characteristics. These materials enable high-frequency circuit fabrication using standard epoxy/glass processing protocols, providing cost-effective alternatives to conventional microwave laminates without requiring specialized through-hole treatments.

 

Rogers RO4003C PCB material's thermal expansion coefficient (CTE) closely matches that of copper, ensuring exceptional dimensional stability essential for mixed dielectric multilayer constructions. With a low Z-axis CTE, RO4003C guarantees reliable plated through-hole integrity even under severe thermal cycling conditions. Featuring a glass transition temperature (Tg) exceeding 280°C, the material maintains stable expansion properties throughout circuit processing temperatures. The 4-layer 1.8mm board configuration with ENIG surface finish and blind via technology provides optimal signal integrity for demanding RF applications, while the non-brominated composition meets modern environmental requirements, though it does not carry UL 94 V-0 certification.

 

 

2. Features

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz

- Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz.

- Thermal Coefficient of dielectric constant of +40 ppm/°C

- Thermal Conductivity 0.71 W/m/°K

- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C

- Low moisture absorption of 0.06%

 

3. Benefits:

- Ideal for multi-layer board (MLB) constructions

- Processes like FR-4 at lower fabrication cost

- Designed for performance sensitive, high volume applications

- Competitively priced

 

1. PCB Construction details:

    -Base material: RO4003C /RO4450F

    - Layer count: 3 Layers

    - Board dimensions:  291mm x 155 mm=2 Types=2PCS, +/- 0.15mm

    - Minimum Trace/Space:  5/4 mils

    - Minimum Hole Size:  0.3mm

    - Blind vias: Top Layer to Inner layer 1.

    - Finished board thickness:  1.82mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers / 1oz inner layers

    - Via plating thickness: 20 μm

    - Surface finish:  Immersion Gold

    - Top Silkscreen:          White

    - Bottom Silkscreen:      No

    - Top Solder Mask:  Black

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

5.  PCB Stackup:  3-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers 4003C Core - 0.813 mm (32mil)

Copper_layer_2 - 35 μm

Bonding ply - RO4450F -0.102mm (4mil)

Rogers 4003C Core - 0.813 mm (32mil)

Copper_layer_3 - 35 μm

 

6.  PCB Statistics:

    Components:        32

    Total Pads:         141

    Thru Hole Pads:     73

    Top SMT Pads:      68

    Bottom SMT Pads:    0

    Vias:              37

    Nets:              5

 

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

 

10. Some Typical Applications:

- Cellular Base Station Antennas and Power Amplifiers

- RF Identification Tags

- Automotive Radar and Sensors

- LNB's for Direct Broadcast Satellites