1.Introduction of RO3210 PCB

Rogers' RO3210 high frequency PCB represents a class of high-frequency circuit materials engineered as ceramic-filled laminates reinforced with woven fiberglass. These advanced materials deliver exceptional electrical performance while providing enhanced mechanical stability—a key distinguishing characteristic that sets them apart from conventional high-frequency substrates.

 

Rogers RO3210 PCBs uniquely combine the superior surface smoothness typical of non-woven PTFE materials, enabling finer line etching tolerances and improved impedance control, with the structural rigidity characteristic of woven-glass PTFE composites. This balanced material architecture allows for precise circuit fabrication while maintaining dimensional stability. Furthermore, RO3210 PCB can be processed using standard PTFE circuit board manufacturing techniques, ensuring compatibility with existing production infrastructure and facilitating seamless integration into both prototype and volume manufacturing workflows.

 

 

2. Features

- Dk of 10.2 +/- 0.5

- Dissipation factor of .0027 at 10GHz

- Coefficient of thermal expansion matched to copper - x y z : 13 ppm/°C, 13 ppm/°C, 34 ppm/°C

- Decomposition Temperature (Td) of 500 °C TGA

- Thermal Conductivity of 0.81W/mk

- Flammability of V0 UL 94 standard

 

3. Benefits

- Woven glass reinforcement

*Improves rigidity for easier handling

 

- Uniform electrical and mechanical performance;

*Ideal for complex multi-layer high frequency structures

 

- Low in-plane expansion coefficient (matched to copper)

* Suitable for use with epoxy multi-layer board hybrid designs

* Reliable surface mounted assemblies

 

- Excellent dimensional stability

* High production yields

 

-Surface smoothness

* Allows for finer line etching tolerances

 

 4.PCB Construction details:

- Base material: RO3210

- Layer count: 4 layers

    - Board dimensions:  60mm x 55 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  4/6 mils

    - Minimum Hole Size:  0.3mm

    - No Blind vias.

    - Finished board thickness:  1.24mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Immersion Gold

    - Top Silkscreen:          No

    - Bottom Silkscreen:      No

    - Top Solder Mask:  No

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

5. PCB Stackup:  4-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3210 Core - 0.508 mm (20mil)

Copper_layer_2 - 35 μm

---Prepreg ---- 0.102mm

Copper_layer_3 - 35 μm

Rogers RO3210 Core - 0.508 mm (20mil)

Copper_layer_4 - 35 μm

 

6. PCB Statistics:

    Components:        12

    Total Pads:         38

    Thru Hole Pads:     28

    Top SMT Pads:      10

    Bottom SMT Pads:    0

    Vias:             32

    Nets:              2

 

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

 

10. Some Typical Applications:

- Automotive collision avoidance systems

- Automotive global positions satellite antennas

- Wireless telecommunications systems

- Microstrip patch antennas for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

- LMDS and wireless broadband

- Base station infrastructure