1.Introduction of RO3010 PCB

Rogers RO3010 PCB represents an advanced series of ceramic-filled PTFE composite laminates engineered to deliver higher dielectric constant (Dk) values while maintaining exceptional electrical and mechanical stability. These high-frequency circuit materials provide cost-effective solutions for demanding RF and microwave designs, featuring consistent performance across wide frequency ranges. The material's stable dielectric properties simplify the development of broadband components and support applications spanning multiple frequency bands. With its enhanced Dk characteristics, RO3010 laminate enables significant circuit miniaturization, making it ideal for compact, high-performance electronic systems where space constraints and signal integrity are critical considerations.

 

 

2. Features

- Dielectric constant of 10.2+/- .30 at 10 GHz/23°C

- Dissipation factor of 0.0022 at 10 GHz/23°C

- Low Coefficient of Thermal Expansion (-55 to 288 °C) of 13 ppm/°C(X), 11 ppm/°C (Y),  16 ppm/°C (Z) respectively

- Td> 500°C

- Thermal Conductivity of 0.95 W/mK

- Moisture Absorption of 0.05%

- -40℃ to +85℃ operation

 

3. Benefits

- Material exhibits dimensional stability with expansion coefficient matched to copper

- Economical laminate pricing for Volume manufacturing process

- ISO 9001 Certified

- Suitable for use with multi-layer board designs

 

 4.PCB Construction details:

- Base material: RO3010

- Layer count: 4-layer

- Board dimensions:  35mm x 42 mm=1PCS

- Minimum Trace/Space:  6/9 mils

- Minimum Hole Size:  0.4mm

- Blind vias L1-L2.

- Finished board thickness:  2.7mm

- Finished Cu weight:  1 oz (1.4 mils) outer layers

- Via plating thickness: 20 μm

- Surface finish:  Immersion Tin

- Top Silkscreen:          No

- Bottom Silkscreen:      No

- Top Solder Mask:  No

- Bottom Solder Mask: No

- 100% Electrical test used prior to shipment

 

5. PCB Stackup:  4-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3010 Substrate - 50mil (1.27mm)

Copper_layer_2 - 35 μm

Prepreg 1060 x 1 - 0.05mm bonding ply

Copper_layer_3 - 35 μm

Rogers RO3010 Substrate - 50mil (1.27mm)

Copper_layer_4 - 35 μm

 

6.  PCB Statistics:

    Components:        4

    Total Pads:         12

    Thru Hole Pads:    2

    Top SMT Pads:      12

    Bottom SMT Pads:    0

    Vias:              4

    Nets:              3

 

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

 

10. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes