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Rogers RO4725JXR 2-Layer 1.62mm PCB: Low-Loss High-PIM Performance Solution for Cellular Base Station Antennas
Rogers RO4725JXR 2-Layer 1.62mm PCB: Low-Loss High-PIM Performance Solution for Cellular Base Station Antennas
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Introduction to Rogers RO4725JXR PCB
Rogers RO4725JXR 2-layer PCB is fabricated with hydrocarbon/ceramic/woven glass antenna-grade laminates, serving as a reliable, cost-effective alternative to traditional PTFE-based laminates. Engineered to meet the rigorous demands of high-frequency antenna applications, this PCB features a dielectric resin system that delivers the mechanical and electrical properties required for ideal antenna performance.
Fully compatible with conventional FR-4 processing and high-temperature lead-free soldering protocols, RO4725JXR high-frequency PCBs eliminates the need for specialized surface treatments during plated through-hole (PTH) preparation— a key pain point with traditional PTFE materials. This compatibility streamlines manufacturing workflows and reduces production costs, while still maintaining performance parity with premium PTFE-based solutions.
When paired with LoPro® Reverse Treated EDC Foil, RO4725JXR laminate achieves a dielectric constant (Dk) of 2.55 and a loss tangent (Df) of 0.0022 at 2.5 GHz, enabling antenna designers to maximize signal gain and minimize signal loss.
RO4725JXR PCB substrate offers demonstrated low passive intermodulation (PIM) performance, with values better than -160 dBc under 43dBm 1,900MHz signal conditions, ensuring exceptional signal clarity for cellular infrastructure applications.
2. Key Features
Dielectric Constant (Dk) of 2.55 +/-0.05 at 10GHz/23°C
Dissipation Factor of 0.0026 at 10GHz/23°C and 0.0022 at 2.5GHz
Excellent Thermal Coefficient of Dielectric Constant of +34 ppm/°C
Copper-matched CTE with X-axis of 13.9 ppm/°C, Y-axis of 19 ppm/°C, Z-axis of 25.6 ppm/°C
High Glass Transition Temperature (Tg) of >280 °C
Superior PIM Value of -166 dBC
3. Core Benefits
Low-loss dielectric paired with low-profile foil for optimized signal transmission
Minimal insertion loss to preserve signal integrity in high-frequency applications
Dielectric constant matched to standard PTFE-based antenna materials for seamless design integration
Reduced passive intermodulation (PIM) to avoid signal interference and distortion
Consistent circuit performance across varying operating conditions for reliable antenna operation
4. PCB Construction Details
Base Material: RO4725JXR
Layer Count: 2-Layer
Board Dimensions: 115.1mm x 66.3mm per unit, with a tolerance of +/- 0.15mm
Minimum Trace/Space: 5/6 mils
Minimum Hole Size: 0.3mm
Via Type: No blind vias
Finished Board Thickness: 1.62mm
Finished Copper Weight: 1oz (1.4 mils) for outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Top Silkscreen: None
Bottom Silkscreen: None
Top Solder Mask: None
Bottom Solder Mask: None
Quality Assurance: 100% electrical test conducted prior to shipment
5. PCB Stackup
2-layer rigid PCB stackup configuration (from top to bottom):
Copper Layer 1: 35 μm
Rogers RO4725JXR Core: 1.542 mm (60.7 mil)
Copper Layer 2: 35 μm
6. PCB Statistics
Components: 25
Total Pads: 150
Thru Hole Pads: 92
Top SMT Pads: 58
Bottom SMT Pads: 0
Vias: 131
Nets: 2
7. Artwork Supply Format
Gerber RS-274-X
8. Quality Standard
IPC-Class-2
9. Availability
Worldwide
10. Typical Applications
Cellular Base Station Antennas
11.Conclusion
RO4725JXR PCB Board emerges as a cost-efficient, high-performance solution tailored for cellular base station antenna applications. Its low-loss electrical properties, superior PIM performance, and compatibility with standard manufacturing processes make it a versatile choice for designers seeking to balance performance and cost-effectiveness. Whether for 2.5GHz or 10GHz frequency bands, Rogers RO4725JXR high-frequency PCB material delivers consistent, reliable operation that meets the strict quality requirements of global cellular infrastructure projects.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.
Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.