2. Rogers RO4003C LoPro PCB Features

1. Precise dielectric constant (Dk) of 3.38±0.05 at 10 GHz under 23°C operating conditions
2. Ultra-low dissipation factor (Df) of 0.0027 at 10 GHz/23°C, minimizing high-frequency signal attenuation
3. High decomposition temperature (Td) exceeding 425°C, with glass transition temperature (Tg) greater than 280°C (TMA)
4. High thermal conductivity of 0.64 W/mK for efficient heat dissipation in high-power circuits
5. Low Z-axis coefficient of thermal expansion (CTE) of 46 ppm/°C, enhancing structural reliability
6. Copper-matched CTE across -55°C to 288°C: X-axis 11 ppm/°C, Y-axis 14 ppm/°C
7. Fully compatible with lead-free soldering processes, aligning with industry manufacturing norms

3. Rogers RO4003C Low Profile PCB Benefits

1. Minimized insertion loss supports high operating frequency designs, with performance exceeding 40 GHz
2. Reduced passive inter-modulation (PIM) levels, optimizing performance for cellular base station antennas
3. Enhanced thermal performance driven by lower conductor loss, ensuring stable long-term operation
4. Supports multilayer PCB construction, unlocking expanded design possibilities for complex circuits
5. Offers exceptional design flexibility to adapt to diverse high-frequency and high-speed layout requirements
6. Withstands high-temperature processing, suitable for rigorous industrial manufacturing workflows
7. Complies with global environmental protection standards, meeting green manufacturing requirements
8. Exhibits excellent CAF resistance, boosting long-term reliability and service life of the circuit board

4. PCB Construction Details

Item	Specification
Base material	RO4003C Low Profile
Layer count	Double-Layer / 2-layer rigid PCB
Board dimensions	104.3mm x 78.65mm per piece
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.4mm
Blind vias	No Blind vias
Finished board thickness	0.5mm
Finished Cu weight	1 oz (1.4 mils) outer layers
Via plating thickness	20 μm
Surface finish	ENEPIG
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Quality Control	100% Electrical test prior to shipment

5. PCB Stackup

2-layer rigid PCB

1. Copper_layer_1 - 35 μm
2. Rogers RO4003C LoPro Substrate - 16.7mil (0.424mm)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 56
2. Total Pads: 102
3. Thru Hole Pads: 75
4. Top SMT Pads: 27
5. Bottom SMT Pads: 0
6. Vias: 49
7. Nets: 2

7. Artwork & Compliance Standards

1. Type of artwork supplied: Gerber RS-274-X
2. Accepted standard: IPC-Class-2
3. Availability: worldwide

8. Typical Applications

1. Digital applications: Servers, routers and high-speed back planes
2. Cellular base station antennas and power amplifiers
3. LNB’s for direct broadcast satellites
4. RF Identification Tags

9. Conclusion

Rogers 2-Layer RO4003C LoPro high frequency PCB combines ultra-low conductor loss, stable electrical properties and FR-4 process compatibility, making it a high-performance choice for RF and high-speed digital applications. With 0.5mm finished thickness, ENEPIG surface finish, copper-matched CTE and IPC Class 2 compliance, RO4003C LoPro 2-layer rigid PCB ensures reliable, consistent performance in base stations, satellite communications, high-speed digital equipment and RF identification systems worldwide.

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.