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Rogers RO4003C High-Frequency PCB: 2-Layer 0.3mm Board with 1oz Copper and Immersion Silver Finish for RF and Microwave Applications
Rogers RO4003C High-Frequency PCB: 2-Layer 0.3mm Board with 1oz Copper and Immersion Silver Finish for RF and Microwave Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Introduction of Rogers RO4003C PCB
Rogers RO4003C high frequency circuit laminate is a high-performance circuit board designed for demanding RF and microwave applications.
Rogers based 4003C PCB material, utilizing a proprietary woven glass reinforced hydrocarbon/ceramic composite, delivers the superior electrical performance of PTFE/woven glass while maintaining the straightforward manufacturability and lower fabrication cost of standard epoxy/glass. Unlike PTFE-based materials, Rogers RO4003C PCB board requires no special through-hole treatments or handling procedures. It is a non-brominated material that is not UL 94 V-0 rated. A critical advantage is its dimensional stability, driven by a thermal coefficient of expansion (CTE) closely matched to copper (X: 11 ppm/°C, Y: 14 ppm/°C), making it ideal for mixed dielectric multi-layer board (MLB) constructions. Its low Z-axis CTE (46 ppm/°C) ensures reliable plated through-hole quality under thermal shock, and its high Tg (>280°C) guarantees stable performance across all processing temperatures.
2. Key Features of RO4003C PCB
Controlled Dielectric Constant: Stable Dk of 3.38 +/-0.05 at 10 GHz, with a thermal coefficient of +40 ppm/°C.
Low Dissipation Factor: 0.0027 at 10 GHz (0.0021 at 2.5 GHz) for minimal signal loss.
Superior Thermal & Mechanical Properties: Thermal conductivity of 0.71 W/m/K, low moisture absorption (0.06%), and CTE matched to copper for reliability.
Precision Construction: Supports designs with 4/6 mil trace/space, 0.2mm minimum hole size, and features a finished board thickness of 0.3mm with 1oz (35μm) copper layers.
Robust Interconnect: Via plating thickness of 20 μm ensures durable connections in a 2-layer, no-blind-via design.
Stable & Protective Finish: Immersion Silver surface finish with Black top silkscreen (no silkscreen on bottom; no solder mask on top or bottom).
3. Primary Benefits for Designers & Manufacturers
Processes Like FR-4: Enables lower fabrication cost and faster turnaround, using standard methods without the complexity of PTFE.
Ideal for Multilayer Constructions: Excellent dimensional stability supports reliable, high-density MLB designs.
Designed for High-Volume Applications: Competitively priced for performance-sensitive commercial and automotive markets.
Guaranteed Quality: 100% electrical test prior to shipment and adherence to IPC-Class-2 quality standard ensure reliability. Gerber RS-274-X artwork format is accepted.
4. PCB Construction
Stackup: 2-layer rigid construction: Copper (35 μm) / Rogers 4003C Core (0.203 mm) / Copper (35 μm).
Board Details: Dimensions of 54mm x 58mm per piece (±0.15mm). Finished thickness: 0.3mm.
Fabrication Limits: Minimum trace/space: 4/6 mils. Minimum hole size: 0.2mm. No blind vias.
Materials & Finishes: Base material: RO4003C. Finished Cu weight: 1oz outer layers. Via plating: 20 μm. Surface finish: Immersion Silver.
Artwork & Marking: Top Silkscreen: Black. Bottom Silkscreen: No. Top/Bottom Solder Mask: No.
5. Technical Specifications
Quality & Delivery: 100% Electrical test.
Quality standard: IPC-Class-2.
Availability: Worldwide.
6. PCB Statistics
Board Statistics (Example): 14 Components, 22 Total Pads (12 Thru-Hole, 10 Top SMT), 19 Vias, 2 Nets.
7.Typical Applications
Cellular Base Station Antennas and Power Amplifiers, RF Identification Tags, Automotive Radar and Sensors, LNB's for Direct Broadcast Satellites.
8. Conclusion
Rogers 2-layer dual layer 4003C PCB substrate provides an optimal balance of high-frequency performance, manufacturing practicality, and cost-effectiveness for global RF and microwave designs. Its unique properties—such as a stable DK, low loss, and FR-4 compatibility—make it a superior choice for engineers designing cellular infrastructure, automotive radar, and satellite communication systems where reliability and signal integrity are paramount.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.
Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.