Parameter

Specification

Stack-up Configuration

4-layer copper, 0.254mm RT5880 + 0.204mm TG170 FR-4 Prepreg + 0.254mm RT5880

Finished Thickness

0.833mm

Copper Distribution

Outer Layers: 1OZ (35µm), Inner Layers: 0.5OZ (18µm)

Board Dimensions

126mm × 63mm = 1 PCS

Surface Finish

Immersion Silver, Solder Mask (Green) without legend

Minimum Trace/Space

5mil/5mil

Via Specification

Through-hole vias: 0.2mm drill / 0.5mm pad, no blind/buried vias

PROPERTY

TYPICAL VALUES - RTV/diovid 9370

TYPICAL VALUES - RTV/diovid 9480

DIRECTION

UNITS

CONDITION

TEST METHOD

1Dielectric Constant, εr

2.33

2.20

Z

N/A

CX24/90/50

IPC-TM-650 2.5.5.3

2.33 ± 0.03 spec.

2.20 ± 0.02 spec.

Z

N/A

8 GHz-40 GHz

Differential Phase Length

2Dielectric Constant, εr

2.33

2.20

Z

N/A

CX24/90/50

IPC-TM-650 2.5.5.3

2.33 ± 0.03 spec.

2.20 ± 0.02 spec.

Z

N/A

1 MHz-CX24/90/50

1 MHz-CX24/90/50

Dissipation factor, δ

0.0003

0.0004

Z

N/A

CX24/90/50

IPC-TM-650 2.5.5.5

0.0005

0.0009

Z

N/A

1 MHz-CX24/90/50

1 MHz-CX24/90/50

Thermal Coefficient of εr

-115

-125

Z

ppm/°C

50-150°C

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 10¹⁶

2 x 10¹⁶

Z

Mohm.cm

CX24/90/50

ASTM D257

Surface Resistivity

2 x 10¹⁷

3 x 10¹⁷

Z

Mohm

CX24/90/50

ASTM D257

Specific Heat

0.96(0.23)

0.96(0.23)

N/A

J/kgK (cal/g°C)

N/A

Calculated

Tensile Modulus

Test at 23°C: 1300 (189)Test at 100°C: 490 (71)

Test at 23°C: 1070 (156)Test at 100°C: 450 (65)

X

MPa (Kpsi)

N/A

ASTM D638

Test at 23°C: 1200 (174)Test at 100°C: 430 (62)

Test at 23°C: 890 (129)Test at 100°C: 380 (55)

Y

MPa (Kpsi)

N/A

A

ultimate stress

Test at 23°C: 52 (7.5)Test at 100°C: 34 (4.8)

Test at 23°C: 29 (4.2)Test at 100°C: 18 (2.6)

X

MPa (Kpsi)

N/A

ASTM D638

Test at 23°C: 42 (6.1)Test at 100°C: 34 (4.8)

Test at 23°C: 27 (3.9)Test at 100°C: 17 (2.0)

Y

MPa (Kpsi)

N/A

A

ultimate strain

Test at 23°C: 9.8Test at 100°C: 8.6

Test at 23°C: 4.9Test at 100°C: 5.2

X

%

N/A

ASTM D638

Test at 23°C: 10.8Test at 100°C: 8.6

Test at 23°C: 6.9Test at 100°C: 7.8

Y

%

N/A

A

Compressive Modulus

Test at 23°C: 1310 (189)Test at 100°C: 680 (99)

Test at 23°C: 710 (103)Test at 100°C: 500 (73)

X

MPa (Kpsi)

N/A

ASTM D695

Test at 23°C: 1260 (183)Test at 100°C: 660 (96)

Test at 23°C: 710 (103)Test at 100°C: 500 (73)

Y

MPa (Kpsi)

N/A

ASTM D695

Test at 23°C: 890 (129)Test at 100°C: 520 (76)

Test at 23°C: 490 (71)Test at 100°C: 270 (39)

Z

MPa (Kpsi)

N/A

ASTM D695

ultimate stress

Test at 23°C: 37 (5.3)Test at 100°C: 25 (3.7)

Test at 23°C: 29 (4.3)Test at 100°C: 21 (3.1)

X

MPa (Kpsi)

N/A

A

Test at 23°C: 54 (7.8)Test at 100°C: 39 (5.6)

Test at 23°C: 52 (7.5)Test at 100°C: 43 (6.2)

Y

MPa (Kpsi)

N/A

A

Test at 23°C: 40 (5.8)Test at 100°C: 43 (6.3)

Test at 23°C: 32 (4.6)Test at 100°C: 48 (6.9)

Z

MPa (Kpsi)

N/A

A

ultimate strain

Test at 23°C: 3.3Test at 100°C: 8.7

Test at 23°C: 7.7Test at 100°C: 17.8

X

%

N/A

ASTM D695

Test at 23°C: 8.7Test at 100°C: 8.5

Test at 23°C: 12.5Test at 100°C: 7.6

Y

%

N/A

A

Moisture Absorption

0.02

0.02

N/A

%

40°C/11 (4mm) D48/50

ASTM D570

Thermal Conductivity

0.22

0.20

Z

W/mK

80°C

ASTM C518

Coefficient of Thermal Expansion

22 (X)78 (Y)150 (Z)

31 (X)48 (Y)207 (Z)

X/Y/Z

ppm/°C

0-100°C

IPC-TM-650 2.4.24.1

Density

500

500

N/A

g/cm³

N/A

ASTM D792

Tg

22

22

N/A

°C (TMA)

N/A

ASTM D3418

Copper Peel

27.2 (4.8)

31.2 (5.9)

N/A

pli (N/mm)

1oz (35µm) ED/EC after solder float

IPC-TM-650 2.4.8

Flammability

V-0

V-0

N/A

N/A

N/A

UL94

Lead Free Process Compatible

Yes

Yes

N/A

N/A

N/A

N/A