2. Key Features & Benefits

 

Stable High-Frequency Performance: Features a tightly controlled dielectric constant of 6.15±0.15 @ 10 GHz and low dissipation factor of 0.0027, ensuring consistent signal integrity in RF applications.

 

Enhanced Mechanical Stability: Woven glass reinforcement provides improved rigidity for easier handling and processing while maintaining excellent dimensional stability for high production yields.

 

Superior Thermal Management: Offers high thermal conductivity of 0.67 W/mK and CTE values matched to copper (X/Y/Z: 13/13/34 ppm/°C), ensuring reliable performance in thermal cycling environments.

 

Excellent Manufacturing Characteristics: Provides strong copper peel strength (10.7 lbs/in), smooth surface for finer line etching, and compatibility with epoxy multilayer hybrid designs.

 

Cost-Effective Solution: Delivers premium high-frequency performance at economical pricing, making it ideal for volume manufacturing in commercial applications.

 

 

3. Construction & Technical Specifications

 

Layer Count & Thickness: 2-layer rigid PCB, 1.4mm finished thickness.

 

Base Material: Rogers RO3206 ceramic-filled laminate with woven glass reinforcement.

 

Board Dimensions: 90.92mm x 53.03mm per panel, tolerance ±0.15mm.

 

Copper Specifications: 1oz (35μm) finished copper on outer layers; 20μm via plating thickness.

 

Critical Dimensions: Minimum trace/space of 5/5 mils; minimum hole size of 0.3mm; no blind vias.

 

Surface Finish & Appearance: Immersion gold; green solder mask on top only; white silkscreen on top only.

 

Quality Assurance: 100% electrical test prior to shipment; IPC-Class-2 accepted standard.

 

 

4. PCB Stackup Structure

 

Layer 1: Copper - 35 μm

 

Core: RO3206 Laminate - 1.27 mm (50 mil)

 

Layer 2: Copper - 35 μm

 

 

5. PCB Assembly Statistics

 

Components: 36

 

Total Pads: 59

 

Through-Hole Pads: 27

 

Top SMT Pads: 32

 

Bottom SMT Pads: 0

 

Vias: 33

 

Nets: 2

 

 

6. Technical & Supply Information

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Availability: Worldwide

 

 

7. Typical Applications

Rogers RO3206 PCB substrate is engineered for advanced high-frequency systems, including:

 

Automotive Collision Avoidance Systems and GPS Antennas

 

Wireless Telecommunications Infrastructure and Base Stations

 

Microstrip Patch Antennas for Wireless Communications

 

Direct Broadcast Satellites and Datalink Systems

 

LMDS and Wireless Broadband Equipment

 

Remote Meter Readers and Power Backplanes

 

Complex Multi-layer High-Frequency Structures

 

 

8. Conclusion

RO3206 high-frequency PCB material provides a robust, cost-effective platform for demanding RF and wireless applications requiring stable electrical properties, enhanced mechanical stability, and reliable thermal performance.

 

RO3206 printed circuit board, by combining ceramic-filled technology with woven glass reinforcement, enables high-yield manufacturing of complex high-frequency designs for automotive, telecommunications, and satellite communication markets where performance and reliability are essential.

 

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.

 

Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.