2. Key Features & Benefits

 

Exceptional Dielectric Stability: Maintains a consistent dielectric constant of 3.00±0.04 @ 10 GHz with minimal variation across temperature and frequency ranges, ensuring predictable performance in sensitive RF designs.

 

Low Loss up to mmWave Frequencies: Features an ultra-low dissipation factor of 0.001 @ 10 GHz, supporting high-efficiency signal transmission in applications up to 77 GHz and beyond.

 

Superior Thermal & Mechanical Properties: Offers excellent thermal decomposition temperature (Td >500°C), low CTE values (X/Y/Z: 17/16/25 ppm/°C), and minimal moisture absorption (0.04%), ensuring reliability under harsh operating conditions.

 

Ideal for Multilayer & Hybrid Designs: Exhibits uniform mechanical properties across a range of dielectric constants and low in-plane expansion matched to copper, enabling reliable stripline, multilayer, and hybrid epoxy-glass constructions.

 

Cost-Effective Volume Manufacturing: Leverages a volume production process that provides consistent quality and economical pricing for high-frequency commercial applications.

 

 

3. Construction & Technical Specifications

 

Layer Count & Thickness: 2-layer rigid PCB, 0.3mm finished thickness.

 

Base Material: Rogers RO3003 ceramic-filled PTFE composite.

 

Board Dimensions: 254mm x 142mm panel containing 50 individual boards.

 

Copper Specifications: 1oz (35μm) finished copper on outer layers; 20μm via plating thickness.

 

Critical Dimensions: Minimum trace/space of 5/4 mils; minimum hole size of 0.2mm; no blind vias.

 

Surface Finish & Appearance: Silver plate/gold plate finish; green solder mask on bottom only; white silkscreen on bottom only.

 

Quality Assurance: 100% electrical test prior to shipment; IPC-Class-2 accepted standard.

 

 

4. PCB Stackup Structure

 

Layer 1: Copper - 35 μm

 

Core: Rogers RO3003 - 0.254 mm (10 mil)

 

Layer 2: Copper - 35 μm

 

 

5. PCB Assembly Statistics

 

Components: 150

 

Total Pads: 300

 

Through-Hole Pads: 200

 

Top SMT Pads: 100

 

Bottom SMT Pads: 0

 

Vias: 250

 

Nets: 2

 

 

6. Technical & Supply Information

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Availability: Worldwide

 

 

7. Typical Applications

Rogers RO3003 2-layer rigid PCB Board is engineered for high-frequency commercial and automotive systems, including:

 

Automotive Radar Systems (77 GHz) and ADAS

 

5G Wireless Infrastructure and mmWave Components

 

Cellular Telecommunications Power Amplifiers and Antennas

 

Global Positioning Satellite (GPS) Antennas

 

Direct Broadcast Satellites and Datalink Systems

 

Microstrip Patch Antennas and Band Pass Filters

 

Remote Meter Readers and Power Backplanes

 

 

8. Conclusion

Rogers RO3003 printed circuit board provides a reliable, high-performance platform for advanced microwave and RF circuit designs requiring stable electrical properties, low signal loss, and excellent thermal stability.

 

Rogers 3003 PCB substrate, by combining ceramic-filled PTFE technology with consistent mechanical performance, enables optimized solutions for automotive, telecommunications, and satellite applications where frequency stability and dimensional reliability are critical to system success.

 

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.

 

Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.