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Taconic TLX-8 Double-Sided PCB 31mil Low Moisture Absorption PCB Circuit Board for RF Applications
Taconic TLX-8 Double-Sided PCB 31mil Low Moisture Absorption PCB Circuit Board for RF Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Taconic TLX-8 PCB Introduction
Taconic TLX-8 PCB utilizes advanced PTFE fiberglass laminate technology to deliver reliable performance across diverse RF applications. This 2-layer 0.8mm thick TLX-8 PCB board combines mechanical robustness with stable electrical characteristics, making it suitable for demanding environments where consistent performance is critical. TLX-8 PCB material's versatility is demonstrated through its availability in various thicknesses and copper cladding options, providing design flexibility for low layer count microwave applications operating under challenging conditions.
2.Material Benefits
Excellent Passive Intermodulation Values Below -160 dBc
Superior Mechanical and Thermal Stability
Low and Stable Dielectric Constant Characteristics
Exceptional Dimensional Stability Across Temperature Variations
Minimal Moisture Absorption for Enhanced Reliability
Tightly Controlled Dielectric Constant Tolerance
Low Dissipation Factor for High-Frequency Performance
UL 94 V0 Flammability Rating for Safety Compliance
Optimized for Low Layer Count Microwave Circuit Designs
3.Material Features
Dielectric Constant: 2.55 ±0.04 at 10 GHz
Dissipation Factor: 0.0018 at 10 GHz
Coefficient of Thermal Expansion: X-axis 21 ppm/°C, Y-axis 23 ppm/°C, Z-axis 215 ppm/°C
Thermal Decomposition Temperature: 2% Weight Loss at 535°C, 5% Weight Loss at 553°C
Moisture Absorption: 0.02%
Dielectric Breakdown Strength: >45 kV
Flammability Rating: UL 94 V-0
4.Electrical Performance Characteristics
Surface Resistivity (Elevated Temperature): 6.605 × 10^8 MΩ
Surface Resistivity (Humidity Conditioning): 3.550 × 10^6 MΩ
Volume Resistivity (Elevated Temperature): 1.110 × 10^10 MΩ/cm
Volume Resistivity (Humidity Conditioning): 1.046 × 10^10 MΩ/cm
5.Dimensional Stability Specifications
Machine Direction After Bake: 0.06 mm/m
Cross Direction After Bake: 0.08 mm/m
Machine Direction Thermal Stress: 0.09 mm/m
Cross Direction Thermal Stress: 0.10 mm/m
6.PCB Construction Details
Base Material: TLX-8
Layer Count: 2 Layers
Board Dimensions: 25mm × 71mm (1 PC), Tolerance: ±0.15mm
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 0.3mm
Blind Vias: None
Finished Board Thickness: 0.8mm
Finished Copper Weight: 1 oz outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Electrical Test: 100% Tested Prior to Shipment
7.PCB Stackup: 2-Layer Rigid Construction
Copper Layer 1: 35 μm
Taconic TLX-8 Core: 31mil (0.787 mm)
Copper Layer 2: 35 μm
8.PCB Assembly Statistics
Components: 11
Total Pads: 34
Thru Hole Pads: 19
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 27
Nets: 2
9.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
10.Typical Applications
Radar and Detection Systems
Mobile Communication Infrastructure
Microwave Test and Measurement Equipment
RF Transmission Devices
Couplers, Splitters, Combiners, and Amplifiers
High-Frequency Antenna Systems
Aerospace and Defense Electronics
Marine Communication Systems
11.Conclusion
Taconic TLX-8 PCB provides outstanding reliability and consistent performance for demanding RF applications, combining excellent electrical properties with mechanical robustness to ensure optimal operation in severe environmental conditions.