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2-layer 60mil Rogers TMM4 PCB Thermoset Microwave Circuit Board for High-Reliability RF Applications
2-layer 60mil Rogers TMM4 PCB Thermoset Microwave Circuit Board for High-Reliability RF Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Rogers TMM4 PCB Introduction
Rogers TMM4 PCB utilizes advanced ceramic-hydrocarbon thermoset polymer composite technology specifically engineered for high-reliability stripline and microstrip applications. This 2-layer 1.6mm TMM4 PCB board combines the mechanical robustness of traditional laminates with the electrical performance of ceramic materials while eliminating the need for specialized manufacturing processes. The thermoset resin base ensures excellent wire-bonding reliability and plated-through-hole integrity, making it suitable for demanding microwave applications where consistent performance and manufacturing efficiency are essential.
2.Material Features
Dielectric Constant: 4.50 ±0.045
Dissipation Factor: 0.0020 at 10 GHz
Thermal Coefficient of Dielectric Constant: 15 ppm/°K
Coefficient of Thermal Expansion: X-axis 16 ppm/°K, Y-axis 16 ppm/°K, Z-axis 21 ppm/°K
Thermal Decomposition Temperature: 425°C (TGA method)
Thermal Conductivity: 0.7 W/m·K
Moisture Absorption: 0.07%-0.18%
Thickness Range: 0.0015 to 0.500 inches (±0.0015 inches)
3.Material Benefits
Superior Mechanical Properties Resist Creep and Cold Flow
Excellent Chemical Resistance to Standard Processing Chemicals
Reliable Wire-Bonding Capability with Thermoset Resin Base
High Reliability of Plated Through Holes
Compatibility with All Common PWB Manufacturing Processes
Stable Electrical Performance Across Temperature Variations
Proven Long-Term Reliability in Demanding Environments
Cost-Effective Manufacturing Without Specialized Equipment Requirements
4.PCB Construction Details
Base Material: TMM4
Layer Count: 2 Layers
Board Dimensions: 47mm × 118mm (1 PC), Tolerance: ±0.15mm
Minimum Trace/Space: 5/7 mils
Minimum Hole Size: 0.35mm
Blind Vias: None
Finished Board Thickness: 1.6mm
Finished Copper Weight: 1 oz outer layers
Via Plating Thickness: 20 μm
Surface Finish: Silver and Gold Plating (Gold over Silver)
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Green
Bottom Solder Mask: No
Electrical Test: 100% Tested Prior to Shipment
5.PCB Stackup: 2-Layer Rigid Construction
Copper Layer 1: 35 μm
Rogers TMM4 Core: 60mil (1.524 mm)
Copper Layer 2: 35 μm
6.PCB Assembly Statistics
Components: 32
Total Pads: 65
Thru Hole Pads: 39
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 78
Nets: 2
7.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
8.Typical Applications
RF and Microwave Communication Circuits
Power Amplifiers and Signal Combiners
High-Frequency Filters and Couplers
Satellite Communication Systems
Global Positioning System Antennas
Patch Antenna Arrays
Dielectric Polarizers and Lenses
Semiconductor Chip Testing Equipment
Aerospace and Defense Electronics
9.Conclusion
Rogers TMM4 PCB delivers reliable thermoset microwave performance with excellent manufacturing versatility, providing a robust solution for high-frequency applications that demand consistent electrical characteristics and proven long-term reliability.