Home
-
Newly shipped PCBs
-
Rogers TC600 Thermally Conductive PCB: 30mil Double-Sided High-Performance RF Board with ENEPIG
Rogers TC600 Thermally Conductive PCB: 30mil Double-Sided High-Performance RF Board with ENEPIG
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Rogers TC600 PCB Introduction
Rogers TC600 PCB represents a significant advancement in thermally conductive circuit materials, combining PTFE with specialized ceramic fillers and woven glass reinforcement. This double-sided 0.8mm board delivers exceptional thermal management capabilities while maintaining superior high-frequency performance. The material's unique composition enables enhanced heat dissipation, reduced insertion loss, and improved power handling capacity, making it ideal for high-power RF applications where thermal management and electrical performance are equally critical.
2.Material Features
Dielectric Constant: 6.15 at 1.8 MHz and 10 GHz/23°C
Dissipation Factor: 0.0017 at 1.8 GHz, 0.0020 at 10 GHz/23°C
Thermal Conductivity: 1.1 W/m·K
Temperature Stability: -75 ppm/°C from -40°C to 140°C
Coefficient of Thermal Expansion: X-axis 9 ppm/°C, Y-axis 9 ppm/°C, Z-axis 35 ppm/°C
Moisture Absorption: 0.03%
3.Material Benefits
Optimal Thermal Management for High-Power Applications
Reduced Insertion Loss for Improved Signal Integrity
Enhanced Power Handling Capacity with Minimal Heat Generation
Superior Mechanical Robustness for Demanding Environments
Compatible CTE Matching with Active Components
Excellent Size Reduction Capabilities for Compact Designs
Reliable Performance Across Wide Temperature Range
Improved System Reliability Through Efficient Heat Dissipation
4.PCB Construction Details
Base Material: TC600
Layer Count: Double Sided
Board Dimensions: 112mm x 60mm (1 PC), Tolerance: ±0.15mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3mm
Blind Vias: None
Finished Board Thickness: 0.8mm
Finished Copper Weight: 1 oz outer layers
Via Plating Thickness: 20 μm
Surface Finish: ENEPIG
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Green
Bottom Solder Mask: No
Electrical Test: 100% Tested Prior to Shipment
4.PCB Stackup: 2-Layer Rigid Construction
Copper Layer Top: 18 μm + 17μm plating
TC600 Substrate: 30mil (0.762 mm)
Copper Layer Bottom: 18 μm + 17μm plating
5.PCB Assembly Statistics
Components: 32
Total Pads: 146
Thru Hole Pads: 94
Top SMT Pads: 52
Bottom SMT Pads: 0
Vias: 77
Nets: 2
6.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
7.Typical Applications
High-Power RF Amplifiers and Filter Systems
Avionics Microwave Combiner and Power Divider Boards
Compact High-Frequency Antenna Systems
Digital Audio Broadcasting Satellite Antennas
GPS and Handheld RFID Reader Antennas
Wireless Communication Infrastructure
Thermally Demanding RF Applications
High-Reliability Communication Systems
8.Conclusion
The Rogers TC600 PCB establishes a new standard for thermally managed high-frequency circuits, providing an optimal balance of thermal conductivity and electrical performance for demanding RF applications where heat dissipation and signal integrity are paramount.