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Taconic TLX-0 PCB 2-Layer 20mil Low-DK PCB with Immersion Gold for RF Microwave Applications
Taconic TLX-0 PCB 2-Layer 20mil Low-DK PCB with Immersion Gold for RF Microwave Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. TLX-0 PCB Introduction
20mil Taconic TLX-0 PCB utilizes PTFE fiberglass composite material in a 2-layer configuration. Designed for demanding RF and microwave applications, this low-dielectric-constant laminate features immersion gold surface finish and green solder mask hole plugging. With a tightly controlled dielectric constant of 2.45±0.04, TLX-0 PCB delivers excellent mechanical and thermal stability for harsh environments including aerospace, marine, and automotive applications.
2. PCB Construction Details:
Base Material: TLX-0
Layer Count: 2-Layer
Board Dimensions: 175mm × 90mm = 10PCS, ±0.15mm
Minimum Trace/Space: 5/7 mils
Minimum Hole Size: 0.3mm
No Blind Vias
Finished Board Thickness: 0.6mm
Finished Cu Weight: 1oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Hole Plugged by Solder Mask Ink (Green)
100% Electrical Test Before Shipment
3. PCB Stackup: 2-Layer Rigid PCB
Copper Layer 1 - 35 μm
TLX-0 Core - 0.508 mm (20mil)
Copper Layer 2 - 35 μm
4. PCB Statistics:
Components: 32
Total Pads: 73
Thru Hole Pads: 51
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 105
Nets: 2
5. Artwork Format: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
7. Availability: Worldwide
8. TLX-0 Material Features:
Dielectric Constant: 2.45 ± 0.04 @10GHz
Dissipation Factor: 0.0021 @10GHz
Moisture Absorption: 0.02%
CTE: X-axis 21 ppm/°C, Y-axis 23 ppm/°C, Z-axis 215 ppm/°C
Peel Strength: 12 lbs/in
PTFE Fiberglass Composite
UL 94 V-0 Rated
9. Material Benefits:
Excellent PIM Performance (<-160 dBc)
Superior Mechanical & Thermal Properties
Low Stable Dielectric Constant
Excellent Dimensional Stability
Low Moisture Absorption
Tight DK Tolerance
Low Dissipation Factor
Harsh Environment Resistance
10. Typical Applications:
RF Couplers and Splitters
Power Combiners and Dividers
Microwave Amplifiers
Radar Systems
Mobile Communication Equipment
Microwave Test Equipment
Aerospace Antennas
Marine Communication Systems