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Rogers RT/duroid 6035HTC Double-Sided PCB 1.6mm High Thermal Conductivity PCB for Power Amplifiers
Rogers RT/duroid 6035HTC Double-Sided PCB 1.6mm High Thermal Conductivity PCB for Power Amplifiers
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RT/duroid 6035HTC PCB Introduction
Rogers RT/duroid 6035HTC PCB utilizes ceramic-filled PTFE composite material in a double-sided configuration with 1.6mm thickness. Designed for high-power RF and microwave applications, this high-thermal-conductivity laminate features immersion-gold surface finish and provides exceptional thermal management capabilities. With thermal conductivity nearly 2.4 times higher than standard RT/duroid 6000 products, RT/duroid 6035HTC PCB material enables lower operating temperatures and superior performance in power amplifiers and microwave circuits.
2. PCB Construction Details:
Base Material: Rogers RT/duroid 6035HTC
Layer Count: Double-Sided
Board Dimensions: 77mm × 96mm = 1PCS, ±0.15mm
Minimum Trace/Space: 5/9 mils
Minimum Hole Size: 0.3mm
No Blind Vias
Finished Board Thickness: 1.6mm
Finished Cu Weight: 1oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Top Silkscreen: Black
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical Test Before Shipment
3. PCB Stackup: 2-Layer Rigid PCB
Copper Layer 1 - 35 μm
RT/duroid 6035HTC - 1.524 mm (60mil)
Copper Layer 2 - 35 μm
4. PCB Statistics:
Components: 22
Total Pads: 65
Thru Hole Pads: 47
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 53
Nets: 2
5. Artwork Format: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
7. Availability: Worldwide
8. RT/duroid 6035HTC Material Features:
Dielectric Constant: 3.5 ± 0.05 @10GHz/23°C
Dissipation Factor: 0.0013 @10GHz/23°C
Thermal Coefficient of Dk: -66 ppm/°C
Moisture Absorption: 0.06%
Thermal Conductivity: 1.44 W/m/K @80°C
CTE: X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 39 ppm/°C
UL 94-V0 Flammability Rating
Lead-free Process Compatible
9. Material Benefits:
High Thermal Conductivity
Improved Heat Dissipation
Lower Operating Temperature
Excellent High Frequency Performance
Low Insertion Loss
Superior Thermal Stability
Cost-effective Drilling Capability
10. Typical Applications:
High Power RF Amplifiers
Microwave Power Amplifiers
RF Couplers and Filters
Power Combiners
RF Power Dividers
Microwave Circuits
High Power Communication Systems