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50mil Taconic TLX-9 PCB 2-Layer PTFE Woven Glass PCB with Immersion Tin for High-Frequency Applications
50mil Taconic TLX-9 PCB 2-Layer PTFE Woven Glass PCB with Immersion Tin for High-Frequency Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Taconic TLX-9 PCB Introduction
Taconic TLX-9 PCB utilizes PTFE/woven glass composite laminates in a 2-layer configuration with 1.35mm thickness. Designed for high-frequency and high-power applications, this low-dielectric-constant material features immersion tin surface finish and white silkscreen for identification. With a tightly controlled dielectric constant of 2.5 and excellent dimensional stability, TLX-9 PCB is ideal for RF components, amplifiers, and communication systems requiring reliable performance under demanding conditions.
2. PCB Construction Details:
Base Material: Taconic TLX-9
Layer Count: 2 Layers
Board Dimensions: 57mm × 136mm = 1PCS, ±0.15mm
Minimum Trace/Space: 6/6 mils
Minimum Hole Size: 0.3mm
No Blind Vias
Finished Board Thickness: 1.35mm
Finished Cu Weight: 1oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Immersion Tin
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Printing Series Number for Identification
100% Electrical Test Before Shipment
3. PCB Stackup: 2-Layer Rigid PCB
Copper Layer 1 - 35 μm
Taconic TLX-9 Core - 1.27 mm (50mil)
Copper Layer 2 - 35 μm
4. PCB Statistics:
Components: 32
Total Pads: 64
Thru Hole Pads: 36
Top SMT Pads: 28
Bottom SMT Pads: 0
Vias: 97
Nets: 2
5. Artwork Format: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
7. Availability: Worldwide
8. TLX-9 Material Features:
Dielectric Constant: 2.5 @10GHz
Dissipation Factor: 0.0019 @10GHz
Moisture Absorption: <0.02%
Dielectric Breakdown: >60 kV
Peel Strength: 12 lbs/in
Thermal Conductivity: 0.19 W/m/K
CTE: X-Y 9-12 ppm/°C, Z 130-145 ppm/°C
UL 94 V-0 Flammability Rating
9. Material Benefits:
Low Dielectric Constant
Low Dissipation Factor
Minimal Moisture Absorption
High Dielectric Breakdown Strength
Strong Peel Strength
Controlled CTE
Dimensional Stability
10. Typical Applications:
LNAs, LNBs, and LNCs
PCS/PCN Large Format Antennas
High-Power Amplifiers
Passive RF Components
Communication Systems
Microwave Circuits
Radar Systems